Heat-stable copolycondensate molding materials

Abstract

Copolycondensate molding materials are obtainable by polycondensation of from 2 to 98 mol % of 2,2-di-(4'-hydroxyphenyl)-propane (A), from 2 to 98 mole % of 4,4'-dihydroxydiphenyl sulfone (B) and from 0 to 96 mole % of (C) (* CHEMICAL STRUCTURE *) where R1 and R2 are each H, C1-C6-alkyl or C1-C6-alkoxy, X is a chemical bond, -S-, -O-, -CO-, CR3R4 (where R3 and R4 are different when n and p are each 0), or SO2- only when n or p is (+ not +) 0), R3 and R4 are each H, C1-C6-alkyl, C1-C6-alkoxy, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1, and n and p are each 0, 1, 2, 3, or 4, with from 1 to 100 mole % of (D) (* CHEMICAL STRUCTURE *) where R5 and R6 have the same meaning as R1 and R2, and v and w are each 0, 1, 2, 3 or 4, and from 0 to 99 mol % of (E) (* CHEMICAL STRUCTURE *) where R7-R10 are each Cl or F or have the same meanings as R1 and R2, q is 0 or 1, r, s, t and n are each 0, 1, 2, 3 or 4, Z1 is -SO2- or -CO- and Z2 is -O-, -S-, -SO2-, -CO- or a chemical bond, with the proviso that one or more of the components C and E are present and the molar ratio of B to the sum of A and C is not greater than 1.

We claim: 
     
       1. A heat-stable copolycondensate molding material which contains polyarylene sulfone and polyarylene ether sulfone units in random distribution and is obtainable by polycondensation of a mixture of (A) from 2 to 98 mol %, based on the sum of (A)-(C), of ##STR37## (B) from 2 to 98 mol %, based on the sum of (A)-(C), ##STR38## and (C) from 0 to 96 mol %, based on the sum of (A)-(C), of ##STR39## where X is a chemical bond or ##STR40## ##STR41## (only when n or p is .Iadd.not .Iaddend.0), R 1  and R 2  are each alkyl or alkoxy, each of 1 to 6 carbon atoms, R 3  and R 4  are each hydrogen, alkyl of 1 to 6 carbons atoms, aryl or halogen-substituted alkyl of 1 to 4 carbon atoms, m is 0 or 1 and n and p are 0, 1, 2, 3 or 4, with   (D) from 1 to 100 mol %, based on the sum of (D) and (E), of ##STR42## where R 5  and R 6  are each hydrogen or have the same meanings as R 1  and R 2 , Y is Cl or F, and v and w are each 0, 1, 2, 3 or 4, and   (E) from 0 to 99 mol %, based on the sum of (D) and (E), of ##STR43## or a chemical bond, R 7 , R 8 , R 9  and R 10  are each hydrogen, Cl or F or may have the same meanings as R 1  and R 2 , q and p are each 0 or 1 and r, s, t and u may each be an integer from 0 to 4, with the proviso that one or more of the components C and E are present and the molar ratio of B to the sum of A+C is not greater than 1.   
     
     
       2. A heat-stable copolycondensate molding material as claimed in claim 1, which is obtainable by polycondensation of a mixture of from 25 to 70 mol % of A,   from 25 to 70 mol % of B and   from 5 to 60 mol % of C, the percentages in each case being based on the sum of A to C, with     from 1 to 100 mol % of D and   from 0 to 99 mol % of E, the percentages in each case being based on the sum of D and E.     
     
     
       3. A heat-stable copolycondensation molding material as claimed in claim 1, which is obtainable by polycondensation of a mixture of from 20 to 80 mol % of A   from 20 to 80 mol % of B and   from 0 to 60 mol % of C, the percentages in each case being based on the sum of A to C, with     from 50 to 95 mol % of D and   from 5 to 50 mol % of E, the percentages in each case being based on the sum of D and E.     
     
     
       4. A heat-stable copolycondensate molding material as claimed in claim 1, which is obtainable by polycondensation of a mixture of from 25 to 70 mol % of A   from 25 to 70 mol % of B and   from 5 to 60 mol % of C, the percentages in each case being based on the sum of A to C, with     from 50 to 95 mol % of D and   from 5 to 50 mol % of E, the percentages in each case being based on the sum of D and E.     
     
     
       5. A molding which is obtainable from a heat-stable copolycondensate molding material as claimed in claim 1 as the central component. 
     
     
       6. A printed circuit board consisting of a heat-stable copolycondensate molding material as claimed in claim 1. 
     
     
       7. An electrical plug connection consisting of a heat-stable copolycondensate molding material as claimed in claim 1.