Method for fixing an electronic component and its contacts to a support

Abstract

A method for positioning an electronic component and its contacts on a card is disclosed. The electronic component is first of all placed in the cavity of the card, then the electrical contacts are placed on the card and electrically connected to the output terminals by a so-called tape automatic bonding process using a film on which the electrical contacts are deposited.

What is claimed is: 
     
       1. A method to fix an electronic component and its external contacts on a support, said support comprising a cavity to house said component, said method comprising the following operations: (a) positioning the electronic component (22) in the cavity (21), so that output terminals (23-26) of the component are accessible through the opening of the cavity;   (b) positioning the external electrical contacts (27-30) on a supporting film (31), according to a pattern appropriate to the geometry of the output terminals of the electronic component;   (c) positioning the electrical contacts on the support (20) by means of the supporting film (31);   (d) simultaneously electrically connecting said electrical contacts (27-30) to the output terminals (23-26) of the electronic component (22); wherein prior to the first positioning step (a), the electronic component is coated with resin which allows the output terminals (23-26) to extend through said protective resin coating whereby the surface of the component is protected.     
     
     
       2. A method according to claim 1, wherein said resin is a heat setable resin and is hardened by heating to a temperature of about 300° C. .Iadd. 
     
     
       3.  A method of attaching an electronic component having output terminals to a supporting structure having an upper surface and a cavity opening upon the upper surface, comprising the steps of: coating the electronic component with resin, wherein the output terminals remain uncovered;   positioning the electronic component in the cavity with the output terminals exposed in the cavity, and with the output terminals approximately coplanar with the upper surface;   positioning external electrical contacts on a supporting film in a pattern corresponding to the locations of the electronic component output terminals;   positioning the supporting film on the upper surface so that the external electrical contacts contact the electronic component output terminals; and   simultaneously bonding the external contacts to the electronic component output terminals. .Iaddend..Iadd.   
     
     
       4.  The method of claim 3, further comprising the step of, after said bonding step, removing the supporting film. .Iaddend..Iadd. 
     
     
       5.  The method of claim 3, wherein the external contacts are positioned on the supporting film on a side opposite a side attached to the upper surface, and wherein electrical contact is made between the output terminals and the electrical contacts through openings in the supporting film, whereby the supporting film remains as part of a composite structure with the supporting structure. .Iaddend..Iadd.6. A method of connecting external electrical contacts for a package with an electronic component carried internally thereof, comprising the steps of: positioning the electronic component in a cavity of a supporting structure so that output terminals of the electronic component are exposed and approximately coplanar with an upper surface of the package;   forming conductive leads on a surface of a supporting film;   positioning the supporting film so that the external contacts make electrical contact with the output terminals; and   bonding the external contacts to the output terminals to form external package contacts. .Iaddend..Iadd.7. The method of claim 6, further comprising the step of removing the supporting film so as to leave the   
     
     
        external contacts behind. .Iaddend..Iadd.8.  The method of claim 6, further comprising the step of, before positioning the electronic component in the cavity, coating the electronic component with resin so as 
     
     
        to leave the output terminals exposed. .Iaddend..Iadd.9.  The method of claim 6, wherein the external contacts are positioned on the supporting film on a side opposite a side attached to the supporting structure, and wherein electrical contact is made between the output terminals and the electrical contacts through openings in the supporting film, whereby the supporting film remains as part of a composite structure with the supporting structure. .Iaddend.