Solderable lead

Abstract

A solderable lead is fashioned with a C-shaped contact portion along its length. The interior of the C-portion is dimensioned to receive and resiliently contact a substrate at a predetermined contact pad. A layer of solder is provided on the exterior of the C-shaped contact portion and extends around its edge. During heating, the solder migrates to the interior of the C-portion by capillary action to the area between the contact pad of the substrate and the interior of the C-portion. While the solder is liquid, the C-portion maintains engagement with the substrate.

What is claimed is: 
     
       1. A solderable lead for connection to a device having a conductive area, comprising: a substantially flat elongated body, said body having a curved contact portion having an interior and an exterior, said interior being adapted to receive said device and to resiliently contact said conductive area of said device; and   a layer of solder overlying said curved portion exterior and having a portion extending around the edge thereof and immediately adjacent said curved portion interior, but without having solder in said interior of the curved portion, whereby upon heating, said layer of solder will liquefy and migrate to form a soldered joint between said interior and said conductive area.   
     
     
       2. A solderable lead according to claim 1, wherein said curved contact portion is a C-shaped clip portion having top, rear and bottom walls. 
     
     
       3. A solderable lead according to claim 2, wherein said portion of said solder layer covers an edge of one of said top and bottom walls. 
     
     
       4. A solderable lead according to claim 3, wherein portion of said clip portion under said solder layer is curved toward said curved portion interior. 
     
     
       5. A solderable lead according to claim 3, wherein said C-shaped portion has a burr at the edge thereof, said solder layer extending over the edge of said burr. 
     
     
       6. An assemblage of leads, each as in claim 1, each lead being integral with a carrier strip and said leads being uniformly spaced along said carrier strip. 
     
     
       7. The method of producing a lead soldered to a conductive pad of a substrate comprising the steps of: providing a lead as in claim 1;   resiliently maintaining said curved portion interior in contact with said substrate conductive area;   heating said lead to melt said solder layer and cause said solder to flow around the edge of said lead into the region between said curved portion interior and said conductive area;   whereby on cooling, said conductive pad is soldered to said curved portion interior. .Iadd.   
     
     
       8.  A solderable lead for connection to a device having a conductive area, comprising: a substantially flat elongated conductive body having a body portion intended for soldering to said conductive area, said body portion having a first surface facing said conductive area and a second surface opposite said first surface;   a plating-like substantially uniform thickness layer of solder formed from a band of solder overlying said body portion on said second surface, said solder layer having a portion extending around the edge of said body portion and covering substantially the entire thickness of said edge, to be immediately adjacent said first surface, but not covering said first surface;   whereby upon heating said body in juxtaposition to said conductive area said solder will liquify and migrate to form a soldered joint between said body portion and said conductive area. .Iaddend..Iadd.9. A solderable lead according to claim 8, wherein a portion of said body portion under said   
     
     
        solder layer is curved toward said first surface. .Iaddend..Iadd.10.  A solderable lead according to claim 8, wherein said body portion has a burr at the edge thereof, said solder layer extending over the edge of said burr. .Iaddend..Iadd.11. An assemblage of leads, each as in claim 8, each lead being integral with a carrier strip at one end of each lead and said leads being uniformly spaced along said carrier strip. .Iaddend..Iadd.12. A method of producing a lead soldered to a conductive area of a substrate comprising the steps of: providing a lead having an elongated body with a body portion intended for soldering to said conductive area, said body portion having a first surface for facing said conductive area and a second surface opposite said first surface, with a plating-like layer of solder of substantially uniform thickness overlying said body portion on said second surface and extending around the edges of said body portion but short of said first surface;   maintaining said first surface in contact with said substrate conductive area,   heating said lead to melt said solder layer and cause said solder to flow around the edge of said lead adjacent the region between said first surface and said conductive area;   whereby on cooling, said conductive area is soldered to said one surface. .Iaddend..Iadd.13. A solderable lead for connection to a device having a conductive area, comprising:   an elongated body, said body having a substantially flat contact portion having a first surface and a second surface, said first surface being adapted to contact said conductive area of said device; and   a plating-like substantially uniform thickness layer of solder overlying said second surface and having a portion extending around the edge thereof and immediately adjacent said first surface, said solder layer overlying substantially the entire thickness of said edge, but without having solder on said first surface, whereby upon heating, said layer of solder will liquefy and migrate to form a solder joint between said first surface and said conductive area. .Iaddend..Iadd.14. A method of producing solderable leads soldered to conductive areas of a substrate, comprising the steps of:   providing a substantially flat sheet of conductive material having a band of solder thereon,   stamping from said sheet a series of leads, each lead having an elongated body with a body portion intended for soldering to said conductive area, said body portion having a first surface for facing said conductive area and a second surface opposite said first surface, with a layer of solder overlying said body portion on said second surface,   said stamping including causing solder from said band to extend around the edge of the body portion of each lead. .Iaddend..Iadd.15. A method as in claim 14, wherein said step of stamping further comprises forming a carrier section of said sheet joined to each lead at one end thereof. .Iaddend.