Method to install an electronic component and its electrical connections on a support, and product obtained thereby

Abstract

Disclosed is a method for installing an electronic component and its electrical connections on a support provided with a cavity to house said component. A metallic layer is cut out into zones on which there is deposited a layer of polyimide which mechanically holds the said zones during the operations for the electrical connection of the electronic component and for encapsulation and installation on the support. This method avoids the use of a supporting film and of a bonder to fix the metallic joints to the film, namely elements that do not withstand high temperatures during encapsulation.

What is claimed is: 
     
       1. A method for installing an electronic component and its, electrical connections in a support having a cavity to house said component, said method comprising the following operations: (a) depositing of a metallic layer;   (b) cutting up of this metallic layer into zones that are electrically insulated from one another,   (c) depositing of a polyimide layer on one side of these metallic zones,   (d) laying, on one side of these metallic zones, the electronic component having output terminals,   (e) electrically connecting the output terminals of the electronic component to the metallic zones,   (f) coating of the electrical component by a resin,   (g) heating of the entire unit at a high temperature so as to quickly obtain the hardening of the resin,   (h) positioning of the unit on the support, so that the encapsulated electronic component is housed in the cavity.   
     
     
       2. A method according to claim 1 wherein the electronic component is laid on that side of the metallic layer which is opposite the polyimide layer and wherein it comprises the following additional operation: the removal of the polyimide layer so as to clear the metallic zones without damaging the polyimide joints between the metallic zones.   
     
     
       3. A method according to claim 2, wherein the operation for the removal of the polyimide is designed also to remove the polyimide joints between the metallic zones. 
     
     
       4. A method according to claim 1, wherein the electronic component is laid on the side of the polyimide layer and wherein the operation for the electrical connection of the output terminals of the electronic component is preceded by an operation to remove the layer of polyimide at least at the positions of the metallic zones designed to set up the electrical connections. 
     
     
       5. A method according to claim 4, wherein the operation to remove the polyimide layer also concerns the position where the electronic component has to be laid. 
     
     
       6. A method according to claim 4 or 5, wherein the operation to install the unit on the support is preceded by an operation to remove the polyimide layer without damaging the polyimide joints between the metallic zones. 
     
     
       7. A method for installing an electronic component and its electrical connections in a support having a cavity to house said component, said method comprising the following operations: (a) depositing of a metallic layer;   (b) cutting up of this metallic layer into zones that are electrically insulated from one another,   (c) depositing of a silicone and/or epoxy resin layer on one side of these metallic zones,   (d) laying, on one side of these metallic zones, the electronic component having output terminals,   (e) the electrically connecting the output terminals of the electric component to the metallic zones,   (f) coating of the electrical component by a resin,   (g) heating of the entire unit at a high temperature so as to quickly obtain the hardening of the resin,   (h) positioning of the unit on the support, so that the encapsulated electronic component is housed in the cavity. .Iadd.   
     
     
       8.  A method for installing an electronic component in a housing, comprising the steps of: forming a conducting layer having a plurality of zones electrically insulated from each other;   forming an insulating layer on a first side of the conducting layer, wherein the insulating layer is resistant to relatively high temperature processing;   placing the electronic component on a second side of the conducting layer opposite the first side;   electrically connecting output terminals of the electronic component to the zones of the conducting layer;   covering the electronic component with a resin; and   heating the resin to a relatively high temperature to quickly harden it..Iaddend..Iadd.   
     
     
       9.  The method of claim 8, wherein the conducting layer is formed from metal..Iaddend..Iadd. 
     
     
       10.  The method of claim 9, wherein the metal comprises copper..Iaddend..Iadd.11. The method of claim 9, wherein the metal comprises nickel..Iaddend..Iadd.12. The method of claim 8, wherein the 
     
     
        insulating layer comprises polyimide..Iaddend..Iadd.13.  The method of claim 8, wherein the insulating layer comprises silicone..Iaddend..Iadd.14. The method of claim 8, wherein the insulating 
     
     
        layer comprises epoxy resin..Iaddend..Iadd.15.  The method of claim 8, further comprising the step of: placing the covered electronic component into a support structure having a cavity therein for receiving the covered electronic   
     
     
        component..Iaddend..Iadd.16.  The method of claim 15, wherein portions of the conducting layer zones contact electrically conductive structures in 
     
     
        the support structure..Iaddend..Iadd.17.  A method for installing an electronic component in a housing, comprising the steps of: forming a conducting layer having a plurality of zones electrically insulated from each other;   forming an insulating layer on a first side of the conducting layer, wherein the insulating layer is resistant to relatively high temperature processing;   placing the electronic component on the first side of the conducting layer and separated therefrom by the insulating layer;   electrically conducting output terminals of the electronic component to the zones of the conducting layer;   covering the electronic component with a resin; and   heating the resin to a relatively high temperature to quickly harden it..Iaddend..Iadd.18. The method of claim 13, further comprising the step of:   before said placing step, forming openings in the insulating layer to expose portions of the conducting layer zones therein suitable for making   
     
     
        electrical connection therewith..Iaddend..Iadd.19.  The method of claim 18, wherein said step of forming openings includes forming an opening in a central region suitable for placement of the electrical component, and wherein said placing step includes placing the electrical component into the central region opening..Iaddend.