Top load socket for ball grid array devices

Abstract

A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit includes an array of contacts each including two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the device.

I claim: 
     
       1. A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit, the test socket comprising: a base of electrically insulating material;   an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, each contact including a set of two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the ball grid array integrated circuit device;   means for simultaneously separating each of said sets of said array of contacts so that the balls of the ball grid array device maybe inserted one within each of said set of contact arms.   
     
     
       2. A test socket according to claim 1 wherein said tips of said contacts are offset with respect to the direction of movement of said tips and wherein said tips are twisted toward each other to engage the balls over a maximum area. 
     
     
       3. A test socket according to claim 1 wherein said means for separating said contact tips includes a rack associated with each of said tips and means for forcing adjacent racks in opposite directions. 
     
     
       4. A test socket according to claim 3 wherein said means for forcing said racks in opposite directions includes a linkage of two U-shaped pieces each of a cross piece and two upstanding arms, and wherein said arms are connected such that pressure on said arms at a point distant from said cross pieces causes said cross pieces to approach each other, and wherein said racks are disposed between said cross pieces and move with motion of said cross pieces. 
     
     
       5. A test socket according to claim 4 further including a cover including an opening for accepting a ball grid array device and a surface contacting said arm ends to pressure said arms as said cover is depressed and thus cause said cross pieces to approach each other. 
     
     
       6. A test socket according to claim 5 further including means on said base and said cover for cooperatively guiding said cover with respect to said base as said cover is depressed. .Iadd. 
     
     
       7.  A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit, the test socket comprising: a base of electrically insulating material;   an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, each contact including a set of two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the ball grid array integrated circuit device; and   an engagement member within said test socket, said engagement member proximate said contacts to simultaneously separate each of said sets of arms of said array of contacts when said engagement member engages said contacts so that the balls of the ball grid array device maybe inserted one within each of said set of contact arms. .Iaddend..Iadd.8. The test socket according to claim 7, wherein the tips of the contacts are offset with respect to the direction of movement of the tips and wherein the tips are twisted toward each other to engage the balls over a maximum area. .Iaddend..Iadd.9. A test socket according to claim 7, wherein the engagement member includes at least one rack. .Iaddend..Iadd.10. The test socket according to claim 7, wherein the engagement member includes a plurality of racks, at least one of the racks operating on a plurality of arms. .Iaddend..Iadd.11. The test socket according to claim 7, said socket further comprising at least one bracket coupled to the engagement member, the bracket operating as a lever such that pressure on the bracket causes the engagement member to move and separate the contact arms. .Iaddend..Iadd.12. A test socket according to claim 7, wherein the engagement member includes a plurality of racks, the socket further comprising at least two brackets operating as levers for forcing the racks in opposite directions, the brackets including a linkage of two U-shaped pieces each of a cross piece and two bracket arms, and wherein the bracket arms are connected such that pressure on the bracket arms at a point distant from the cross pieces causes the cross pieces to approach each other, and wherein the racks are disposed between the cross pieces and move with motion of the cross pieces. .Iaddend..Iadd.13. The test socket according to claim 12, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the brackets to cause the cross pieces to approach each other as the cover is depressed. .Iaddend..Iadd.14. The test socket according to claim 7, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the engagement member such that the engagement member separates the contact arms when the cover is depressed and allows the arms to capture balls of the ball grid array when the cover is released. .Iaddend..Iadd.15. The test socket according to claim 7, the engagement member engaging at least one arm of each of the contacts. .Iaddend..Iadd.16. The test socket according to claim 7, the engagement member engaging both arms of each of the contacts. .Iaddend..Iadd.17. A socket for connection of a ball grid array integrated circuit device to a circuit, the socket comprising:   a base;   an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, at least some of said contacts including a set of two cantilever contact arms biased toward each other and terminating in tips adapted to receive one ball of the ball grid array integrated circuit device; and   a sliding plate within said test socket, said sliding plate adapted to separate said arms so that a ball of the ball grid array device may be   
     
     
        received within one set of said contact arms. .Iaddend..Iadd.18.  The socket according to claim 17, the socket further comprising a plurality of the sliding plates. .Iaddend..Iadd.19. The socket according to claim 17, the socket further comprising a bracket coupled to the sliding plate, pressure on the bracket causing the sliding plate to move and thus separate the contact arms. .Iaddend..Iadd.20. The socket according to claim 19, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the bracket to cause the contact arms to separate when the cover is depressed. .Iaddend..Iadd.21. The socket according to claim 17, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the sliding plate such that the sliding plate separates the contact arms when the cover is depressed. .Iaddend..Iadd.22. The socket according to claim 17, the sliding plate engaging at least one arm of each of the contacts. 
     
     
        .Iaddend..Iadd.23.  The socket according to claim 22, the socket being a test socket for temporary connection of the ball grid array device to a test circuit. .Iaddend..Iadd.24. A socket for connection of a ball grid array integrated circuit device to a circuit, the socket comprising: a base;   an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, at least some of said contacts including a set of two cantilever arms biased toward each other and terminating in tips adapted to receive one ball of the ball grid array integrated circuit device; and   a rack within said test socket, said rack separating at least one arm of each of said sets of arms so that at least one ball of the ball grid array device may be inserted within at least one of said set of contact arms. .Iaddend..Iadd.25. The socket according to claim 24, said socket further comprising a bracket coupled to the rack, pressure on the bracket causing the rack to move and thus separate the contact arms. .Iaddend..Iadd.26. The socket according to claim 25, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the bracket to cause the contact arms to separate when the cover is depressed. .Iaddend..Iadd.27. The test socket of claim 25, said socket further comprising a plurality of said racks, said racks being slidable to engage   
     
     
        at least two arms of each of said contacts. .Iaddend..Iadd.28.  The test socket of claim 24, said rack being slidable to engage one arm of each of said contacts. .Iaddend..Iadd.29. The socket according to claim 24, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the rack such that the rack separates the contact arms when cover is depressed. .Iaddend..Iadd.30. The socket according to claim 24, the socket being a test socket for temporary connection of the ball grid array device to a test circuit. .Iaddend..Iadd.31. A socket for connection of a ball grid array integrated circuit device to a circuit, the socket comprising: a plurality of contacts within said socket, at least some of said contacts including a set of at least two arms, said arms terminating in tips adapted to receive one ball of the ball grid array integrated circuit device; and   a moveable engagement member proximate said plurality of contacts, said member capable of separating said sets of arms when said member is moved so that at least one ball of the ball grid array device maybe inserted within one of said sets of contact arms. .Iaddend..Iadd.32. The socket according to claim 31, said socket further comprising a bracket coupled to the engagement member, pressure on the bracket causing the engagement member to move and thus separate the contact arms. .Iaddend..Iadd.33. The socket according to claim 32, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the bracket to cause the contact arms to separate when the cover is depressed.   
     
     
        .Iaddend..Iadd.34.  The socket according to claim 31, the socket further comprising a cover for accepting the ball grid array device, the cover coupled to the engagement member such that the engagement member separates the contact arms when the cover is depressed. .Iaddend..Iadd.35. The socket of claim 34, said engagement member being formed of multiple sub-members to slidably engage at least two arms of each of said contacts. .Iaddend..Iadd.36. The socket of claim 34, said engagement member being slidable to engage one arm of each of said contacts. .Iaddend..Iadd.37. The socket according to claim 36, the socket being a test socket for temporary connection of the ball grid array device to a test circuit. .Iaddend..Iadd.38. A test socket for temporary connection of a ball grid array integrated circuit device to a test circuit, the test socket comprising: a base;   an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, each contact including a set of two cantilever arms biased toward each other and terminating in tips to receive one ball of the ball grid array integrated circuit device;   a moveable contact engagement member within said test socket, said contact engagement member proximate said contacts;   a moveable cover having an opening for accepting the ball grid array device; and   at least one moveable bracket coupled to said contact engagement member and said cover, said cover engaging said bracket when said cover is depressed, said bracket transmitting force to said engagement member to simultaneously separate each of said sets arms when said cover is depressed so that the balls of the ball grid array device may be inserted   
     
     
        within the sets of said contact arms. .Iaddend..Iadd.39.  The test socket of claim 38, further comprising a plurality of said brackets. .Iaddend..Iadd.40. The test socket of claim 38, wherein said bracket is U-shaped. .Iaddend..Iadd.41. The test socket of claim 38, wherein at least one arm of each of said set of arms is moved to accomplish said separation of said arms. .Iaddend..Iadd.42. The test socket of claim 38, wherein one arm of each of said set of arms is engaged by said engagement member. .Iaddend..Iadd.43. The test socket of claim 42 wherein both arms of each of said set of arms are moveable. .Iaddend..Iadd.44. A method of operating a test socket for temporary connection of a ball grid array integrated circuit device to a test circuit, the method comprising: providing a base of electrically insulating material;   providing an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, each contact including a set of two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the ball grid array integrated circuit device; and   simultaneously separating each of said sets of arms so that the balls of the ball grid array device may be inserted one within each of said set of contact arms. .Iaddend..Iadd.45. The method of claim 44, said separating step further comprising depressing a cover of said socket to actuate the separation of said arms. .Iaddend..Iadd.46. The method of claim 45, wherein said cover presses against a bracket when said cover is depressed. .Iaddend..Iadd.47. The method of claim 44, said separating step further comprising:   depressing a cover of said test socket to move at least one bracket within said test socket; and   engaging at least one arm of each of said sets of contact arms when said bracket is moved so as to separate each of said sets of arms. .Iaddend..Iadd.48. A method of operating a test socket for temporary connection of a ball grid array integrated circuit device to a test circuit, the method comprising:   providing a base of electrically insulating material;   providing an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to at least a subset of balls of the ball grid array of the integrated circuit device, each contact including a set of two cantilever arms biased toward each other and terminating in tips adapted to capture one ball of the ball grid array integrated circuit device;   depressing a cover of said test socket to move at least one bracket within said test socket; and   engaging at least one arm of each of said sets of contact arms when said bracket is moved so as to separate each of said sets of arms a distance sufficient to allow at least one of the balls of the ball grid array device to be inserted within at least one of said set of contact arms. .Iaddend..Iadd.49. The method of claim 48, wherein depressing said cover moves a plurality of brackets. .Iaddend..Iadd.50. The method of claim 48, wherein said movement of said bracket actuates an engagement member to cause movement of at least one arm of each of said sets of contact arms. .Iaddend..Iadd.51. The method of claim 48, said method further comprising placing a ball grid array device within said set of contact arms. .Iaddend..Iadd.52. The method of claim 51, said method further comprising releasing said cover to allow said contact arms to contact the balls of said ball grid array. .Iaddend..Iadd.53. A method of operating a socket for connection of a ball grid array integrated circuit device to a circuit, the method comprising:   providing an array of contacts, at least some of said contacts including a set of at least two arms, said arms terminating in tips adapted to receive one ball of the ball grid array integrated circuit device; and   separating each of said sets arms so that the balls of the ball grid array device may be inserted within said sets of contact arms.   
     
     
        .Iaddend..Iadd.     The method of claim 53, said contact arms being cantilevered to allow movement of at least two arms of each set of arms. .Iaddend..Iadd.55. The method of claim 54, said separating step further comprising depressing a cover of said socket to actuate the separation of said arms. .Iaddend..Iadd.56. The method of claim 55, wherein said cover presses against a bracket when said cover is depressed. .Iaddend..Iadd.57. The method of claim 53, said separating step further comprising: depressing a cover of said test socket to move at least one bracket within said test socket; and   engaging at least one arm of each of said sets of contact arms when said bracket is moved so as to separate each of said sets of arms. .Iaddend..Iadd.58. A method of forming a test socket for the temporary connection of a ball grid array integrated circuit device to a test circuit, the method comprising:   forming a base; and   forming an array of contacts supported by said base, said array at least including a pattern of contacts corresponding to the ball grid array of the integrated circuit device, each contact including a set of two cantilever arms biased toward each other and terminating in tips adapted to receive one ball of the ball grid array integrated circuit device; wherein each of said sets of arms are separable so that the balls of the ball grid array device maybe inserted within said sets of contact arms. .Iaddend..Iadd.59. The method of claim 58, further comprising coupling a cover to said socket so that actuation of the separation of said arms may be accomplished by depressing said cover. .Iaddend..Iadd.60. The method of claim 59, further comprising coupling a moveable bracket to said cover. .Iaddend..Iadd.61. The method of claim 58, further comprising:     coupling a cover of said socket to at least one bracket within said test socket so that depressing said cover moves said bracket; and   coupling said bracket to a slidable member, said slidable member proximate at least one arm of each of said sets of contact arms such that movement of said bracket may separate each of said sets of arms when said cover is depressed and may allow closure of the arms when said cover is released. .Iaddend..Iadd.62. The method of claim 61, said contact arms being cantilevered to allow movement of at least two arms of each set of arms. .Iaddend..Iadd.63. The method of claim 58, said contact arms being cantilevered to allow movement of at least two arms of each set of arms. .Iaddend.