Electronic component support for memory card and product obtained thereby

Abstract

The disclosure relates to memory cards having an electronic component housed in a cavity. The electronic support has a first base made of silicon, with a small thickness (between 50 and 100 microns) and a thicker (between 200 and 300 microns) second base, which is deposited on the first base and is formed by a material which is harder than silicon, such as cobalt, vanadium, titanium or ceramic.

What is claimed is: 
     
       1. An electronic component support for a memory card which as a cavity to house sad component, said support comprising a first silicon base of 50 to 100 microns thickness one side of which is used as the substrate for the manufacture of the different elements of the electronic component, and comprising a second base of 100 to 300 microns thickness made of a harder material than silicon, and selecting from the group consisting of titanium, cobalt, vanadium, ceramic, and fiber-glass-charged plastic, which is fixed to the other side of the fist base, the second base being fixed to a film which acts as an element to close the cavity. 
     
     
       2. An electronic component support according to claim 1, wherein the material of the second base is titanium. 
     
     
       3. An electronic component support according to claim 1, wherein the material of the second base is cobalt. 
     
     
       4. An electronic component support for identification cards according to claim 1, wherein the material of the second base is vanadium. 
     
     
       5. An electronic component support according to claim 1, wherein the material of the second base is of ceramic. 
     
     
       6. An electronic component support according to claim 1, wherein the material of the second base is fiber-glass-charged plastic. 
     
     
       7. An electronic component support according to claim 1, wherein the thickness of the first base is about 50 microns. 
     
     
       8. An electronic component support according to claim 1, wherein the thickness of the second base ranges between 200 and 250 microns. 
     
     
       9. A memory card provided with a cavity to house an electronic component, wherein a said component lies on a support according to claim 1. .Iadd. 
     
     
       10.  An electronic component support for a memory card, which has a cavity to house an electronic component, said support comprising: a first silicon base, one side of which is used as the substrate for the manufacture of the different elements of the electronic component, and a second base which is thicker than said first base and which is made of a material having a greater mechanical strength than silicon, said second base being fixed to the other side of said first base, said second base being fixed to a film which acts as an element to close the cavity. .Iaddend..Iadd.11. An electronic component support according to claim 10, wherein the second base is made of a material selected from the group consisting of titanium, cobalt, vanadium, ceramic, and fiberglass-charged plastic. .Iaddend..Iadd.12. An electronic component support according to claim 11, wherein the material of the second base comprises titanium. .Iaddend..Iadd.13. An electronic component support according to claim 11, wherein the material of the second base comprises cobalt. .Iaddend..Iadd.14. An electronic component support according to claim 11, wherein the material of the second base comprises vanadium. 
     
     
        .Iaddend..Iadd.5.  An electronic component support according to claim 11, wherein the material of the second base comprises ceramic. .Iaddend..Iadd.16. An electronic component support according to claim 11, wherein the material of the second base comprises fiberglass-charged plastic. .Iaddend..Iadd.17. An electronic component support according to claim 10, wherein the thickness of the first base is between approximately 50 to 100 microns. .Iaddend..Iadd.18. An electronic component support according to claim 17, wherein the thickness of the first base is about 50 microns. .Iaddend..Iadd.19. An electronic component support according to claim 10, wherein the thickness of the second base ranges between approximately 100 to 300 microns. .Iaddend..Iadd.20. An electronic component support according to claim 19, wherein the thickness of the 
     
     
        second base ranges between 200 and 250 microns. .Iaddend..Iadd.21.  An electronic component support module for a memory card having a cavity to house an electronic component, said support module comprising: a chip having an electronic component manufactured on a first side of said chip;   a material having a greater mechanical strength than silicon on a second side of said chip, opposite to said first side;   a resin material encapsulating exposed surfaces of said electronic component and said material having a greater mechanical strength than silicon;   wherein said electronic component support module has a thickness not exceeding about 600 microns. .Iaddend..Iadd.22. An electronic component support module as in claim 21, wherein said chip consists essentially of silicon. .Iaddend..Iadd.23. An electronic component support module as in claim 21, wherein said material having a greater mechanical strength than silicon comprises titanium. .Iaddend..Iadd.24. An electronic component support module as in claim 21, wherein said material having a greater   
     
     
        mechanical strength than silicon comprises cobalt. .Iaddend..Iadd.25.  An electronic component support module as in claim 21, wherein said material having a greater mechanical strength than silicon comprises vanadium. .Iaddend..Iadd.26. An electronic component support module as in claim 21, wherein said material having a greater mechanical strength than silicon comprises ceramic. .Iaddend..Iadd.27. An electronic component support module as in claim 21, wherein said material having a greater mechanical strength than silicon comprises fiberglass-charged plastic. .Iaddend..Iadd.28. An electronic component support module as in claim 21, wherein the thickness of said material having a greater mechanical strength than silicon ranges between approximately 200 to 250 microns. .Iaddend.