Method of manufacturing a memory card package

Abstract

A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

We claim: 
     
       1. A method of manufacturing a package for a memory card.Iadd., the method .Iaddend.comprising the .[.following.]. steps of: A. .[.Stamping.]. .Iadd.stamping .Iaddend.metal covers to a size marginally larger than a mold in an injection molding process;   B. .[.Bending.]. .Iadd.bending .Iaddend.edges of said covers to conform to an intended shape of a frame element, the edges including fingers extending from the cover sides;   C. .[.Inserting.]. .Iadd.inserting .Iaddend.the covers into a mold in an injection molding process where they are slightly sprung and thus secure themselves in position;   D. .[.Shooting.]. .Iadd.shooting .Iaddend.plastic frame elements into the mold so that fingers included on the covers become embedded in the frames;   E. .[.Removing.]. .Iadd.removing .Iaddend.said covers from said mold;   F. .[.Positioning.]. .Iadd.positioning .Iaddend.a PCB between two covers, the PCB being held in the proper location by means of ejector pins on the plastic frames, the ejector pins being formed as a part of the molding process; .Iadd.and .Iaddend.   G. .[.Bonding.]. .Iadd.bonding .Iaddend.the plastic frame elements together so that a package is formed.   
     
     
       2. The .[.process as claimed in claim.]. .Iadd.method of claim .Iaddend.1 wherein.[.:.]. the bonding process .[.(G).]. is sonic welding. 
     
     
       3. The .[.process as claimed in claim.]. .Iadd.method of claim .Iaddend.1 wherein.[.:.]. the bonding process .[.(G).]. is resistance welding. 
     
     
       4. The .[.process as claimed in claim.]. .Iadd.method of claim .Iaddend.1 wherein.[.:.]. the bonding process .[.(G).]. utilizes adhesives. 
     
     
       5. The .[.process as claimed in claim.]. .Iadd.method of claim .Iaddend.1 wherein.[.:.]. interior surfaces of the covers are coated with a thin layer of nonconductive material before the PCB is positioned between the two covers. .Iadd.6. A method of manufacturing a package for a memory card, the method comprising the steps of: A. stamping metal covers;   B. bending edges of said covers to conform to an intended shape of a frame element, the edges including fingers extending from the cover sides;   C. inserting the covers into a mold;   D. shooting plastic into the mold to form the frame element around the fingers;   E. removing said covers from said mold;   F. positioning a PCB between two covers; and   G. bonding the plastic frame elements together so that a package is   
     
     
        formed..Iaddend..Iadd.7.  The method of claim 6 wherein the bonding process is sonic welding..Iaddend..Iadd.8. The method of claim 6 wherein the bonding process is resistance welding..Iaddend..Iadd.9. The method of claim 6 wherein the bonding process utilizes adhesives..Iaddend..Iadd.10. The method of claim 6 wherein interior surfaces of the covers are coated with a thin layer of nonconductive material before the PCB is positioned 
     
     
        between the two covers..Iaddend..Iadd.11.  A method of manufacturing a package for a memory card, the method comprising the steps of: A. stamping metal covers to a size larger than a mold in an injection molding process;   B. bending edges of said covers to conform to an intended shape of a frame element, the edges including fingers;   C. inserting the covers into a mold in an injection molding process where they are slightly sprung and thus secure themselves in position;   D. shooting plastic into the mold to form the frame element around the fingers;   E. removing said covers from said mold;   F. positioning a PCB between two covers; and   G. bonding the plastic frame elements together so that a package is formed..Iaddend..Iadd.12. The method of claim 11 wherein the bonding process Is sonic welding..Iaddend..Iadd.13. The method of claim 11 wherein the bonding process is resistance welding..Iaddend..Iadd.14. The method of claim 11 wherein the bonding process utilizes adhesives..Iaddend..Iadd.15. The method of claim 11 wherein interior surfaces of the covers are coated with a thin layer of nonconductive material before the PCB is positioned between the two covers..Iaddend.