Semiconductor package with high density I/O lead connection

Abstract

Disclosed is a semiconductor package which permits coupling of semiconductor bond pads to I/O leads where a high density of connections is needed. Conductive fingers backed by an insulating tape are bonded to the ends of the ringers on a lead frame. The tape fingers are electrically coupled to the bond pads on one major surface of the semiconductor chip by wire bonding. In one embodiment, the opposite major surface of the chip is bonded to a paddle on the lead frame through an aperture in the tape for maximum heat dissipation.

What is claimed is: 
     
       1. A semiconductor device package comprising: a mounting pad;   a plurality of first conductive lead frame fingers with one end of each in close lateral proximity to the pad and defining a first gap therebetween; and   a plurality of second conductive fingers formed on an insulating tape layer and extending over the .Iadd.first .Iaddend.gap, one end of said second conductive fingers being bonded to corresponding first conductive fingers and the opposite end of the second conductive fingers terminating in close lateral proximity to the pad to define a second gap therebetween which is less than the first gap.   
     
     
       2. The package according to claim 1 further comprising a semiconductor device with two major surfaces, said device having one major surface bonded to the mounting pad and the opposite major surface including a plurality of bonding pads. 
     
     
       3. The package according to claim 2 further comprising electrical wire connections between the bonding pads on the device and corresponding second conductive fingers. 
     
     
       4. The package according to claim 3 wherein the length of the wire is less than 150 mils. 
     
     
       5. The package according to claim 3 wherein the number of electrical connections between the pads and second conductive fingers is at least 15 per side. 
     
     
       6. The package according to claim 1 wherein the pitch of the second conductive fingers is less than 16 mils. 
     
     
       7. The package according to claim 1.[.wherein.]. .Iadd., further comprising .Iaddend.a conductive .[.paddle is.]. .Iadd.paddle, the conductive paddle being .Iaddend.formed on a plane with the first conductive fingers .[.and.]. .Iadd., .Iaddend.the insulating layer .[.is.]. mounted on the paddle. 
     
     
       8. The package according to claim 7 wherein the insulating layer includes a hole therein so that the mounting pad is defined by the portion of the underlying paddle exposed by said hole. 
     
     
       9. The package according to claim 1 wherein the mounting pad is formed on the same surface of the insulating layer as the second conductive fingers. 
     
     
       10. The package according to claim 1 wherein the mounting pad has four sides and there are at least 15 conductive fingers in close proximity to each side. .Iadd. 
     
     
       11.  A semiconductor device package comprising; a mounting pad;   a plurality of first conductive lead frame fingers with one end of each in close lateral proximity to the pad and defining a first gap therebetween;   and a plurality of second conductive fingers formed on an insulating organic dielectric layer and extending over the first gap, one end of said second conductive fingers being bonded to corresponding first conductive fingers and the opposite end of the second conductive fingers terminating in close lateral proximity to the pad to define a second gap therebetween which is less than the first gap..Iaddend..Iadd.   
     
     
       12.  The package according to claim 11 further comprising a semiconductor device with two major surfaces, said device having one major surface bonded to the mounting pad and the opposite major surface including a plurality of bonding pads..Iaddend..Iadd.13. The package according to claim 12 further comprising electrical wire connections between the bonding pads on the device and corresponding second conductive fingers..Iaddend..Iadd.14. The package according to claim 13 wherein the length of the wire is less than 150 mils..Iaddend..Iadd.15. The package according to claim 13 wherein the number of electrical connections between the pads and second conductive fingers is at least 15 per 
     
     
        side..Iaddend..Iadd.16.  The package according to claim 11 wherein the pitch of the second conductive fingers is less than 16 mils..Iaddend..Iadd.17. The package according to claim 11, further comprising a conductive paddle, the conductive paddle being formed on a plane with the first conductive fingers, the insulating layer mounted on the paddle..Iaddend..Iadd.18. The package according to claim 17 wherein the insulating layer includes a hole therein so that the mounting pad is defined by the portion of the underlying paddle exposed by said hole..Iaddend..Iadd.19. The package according to claim 11 wherein the mounting pad is formed on the same surface of the insulating layer as the second conductive fingers..Iaddend..Iadd.20. The package according to claim 11 mounting pad has four sides and there are at least 15 conductive fingers in close proximity to each side..Iaddend.