Leadframe with power and ground planes

Abstract

A leadframe for use in an integrated circuit package is described. The leadframe comprises a plurality of electrically conductive leads, a die attach pad, and an electrically conductive ring or rings formed generally around the circumference of the die attach pad and between the die attach pad and leads. In one embodiment, at least one of the leads is formed integrally with each ring. The die attach pad may also be formed integrally with one or more leads. In another embodiment, the ring or rings are formed so that they are electrically isolated from the die attach pad, and the die attach pad, leads, and ring or rings are all formed in substantially the same plane. In some embodiments, the ring or rings are broken into electrically isolated sections. Each of the ring sections (and die attach pad, if appropriate) may be electrically connected to a voltage source outside the integrated circuit package (e.g., a power supply or ground). The leadframe is formed from a single sheet of material by, for instance, stamping or etching. The leadframe may be used in either ceramic or plastic packages. The leadframe reduces switching noise and crosstalk, allows more flexibility in placement of power and/or ground bond pads on the die, and allows provision of ground and power planes in an integrated circuit package that is thinner than previous integrated circuit packages containing both ground and power planes.

We claim: 
     
       1. A .[.leadframe,.]. .Iadd.structure .Iaddend.comprising .Iadd.a single layer, wherein the single layer comprises.Iaddend.: a plurality of electrically conductive leads;   a die attach pad on which a semiconductor die can be mounted; and   an electrically conductive ring outside a perimeter of the die attach pad, the electrically conductive ring being electrically isolated from the die attach pad and being located between one or more of the leads and the die attach pad, at least one of the leads being formed integrally with the ring.   
     
     
       2. A .[.leadframe.]. .Iadd.structure, .Iaddend.comprising: a plurality of electrically conductive leads;   a die attach pad on which a semiconductor die can be mounted, wherein the die attach pad is electrically conductive, and at least one of the leads is formed integrally with the die attach pad; .[.and.].   an electrically conductive ring outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad, at least one of the leads being formed integrally with the ring.Iadd.;   a semiconductor die mounted on the die attach pad, the semiconductor die including bond pads; and   electrically conductive bond wires that connect selected ones of the bond pads to selected ones of electrically conductive leads or selected bond locations on the electrically conductive ring.Iaddend..   
     
     
       3. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 1, wherein a plurality of leads are formed integrally with the die attach pad. 
     
     
       4. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 3, wherein a plurality of leads are formed integrally with the ring. 
     
     
       5. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 4, formed by stamping the .[.leadframe.]. .Iadd.die attach pad, the plurality of leads, and the ring .Iaddend.out of a single plate. 
     
     
       6. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 4, formed by etching the .[.leadframe.]. .Iadd.die attach pad, the plurality of leads, and the ring .Iaddend.out of a single plate. 
     
     
       7. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 1, wherein a plurality of leads are formed integrally with the ring. 
     
     
       8. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 7, wherein the ring is formed in sections that are electrically isolated from each other. 
     
     
       9. A .[.leadframe.]. .Iadd.structure .Iaddend.as in claim 1, further .[.comprising.]. .Iadd.comprises .Iaddend.a second electrically conductive ring outside a perimeter of the first electrically conductive ring and between one or more of the leads and the first electrically conductive ring, at least one of the leads being formed integrally with the second electrically conductive ring. 
     
     
       10. A leadframe, comprising: an electrically conductive die attach pad having a surface on which a semiconductor die can be mounted;   a plurality of electrically conductive leads, wherein each of the leads has a surface in substantially the same plane as the surface of the die attach pad, and wherein at least one of the leads is formed integrally with the die attach pad; and   an electrically conductive ring formed between one or more of the leads and the die attach pad, wherein the ring has a surface in substantially the same plane as the surface of the die attach pad, and wherein at least one of the leads is formed integrally with the ring.   
     
     
       11. A leadframe as in claim 10, wherein: a plurality of leads are formed integrally with the die attach pad; and   a plurality of leads are formed integrally with the ring.   
     
     
       12. A leadframe as in claim 11, wherein the ring is formed in sections that are electrically isolated from each other. 
     
     
       13. A leadframe as in claim 10, formed by stamping the leadframe out of a single plate. 
     
     
       14. A leadframe as in claim 10, formed by etching the leadframe out of a single plate. 
     
     
       15. A leadframe as in claim 10, further comprising a second electrically conductive ring formed between one or more of the leads and the first electrically conductive ring, wherein the second electrically conductive ring has a surface in substantially the same plane as the surface of the die attach pad. 
     
     
       16. A structure, comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed;   .[.a leadframe, the leadframe comprising:.]. a die attach pad on which the semiconductor die is mounted;   a plurality of electrically conductive leads; and   an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and   the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad;       a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and   at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and     protective, electrically insulative material enclosing the semiconductor die, .[.leadframe.]. .Iadd.the die attach pad, the ring.Iaddend., and .Iadd.the .Iaddend.bond wires.   
     
     
       17. A structure comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed;   .[.a leadframe, the leadframe comprising:.]. a die attach pad on which the semiconductor die is mounted, wherein the die attach pad is electrically conductive;   a plurality of electrically conductive leads, wherein at least one of the leads is formed integrally with the die attach pad; .[.and.].   an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and   the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad;       a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the die attach pack;   at least one bond wire is connected between a bond pad and the ring; and   at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and     protective, electrically insulative material enclosing the semiconductor die, .[.leadframe.]. .Iadd.the die attach pad, the ring.Iaddend., and .Iadd.the .Iaddend.bond wires.   
     
     
       18. A structure .Iadd.as .Iaddend.in claim 17, wherein a plurality of leads are formed integrally with the die attach pad. 
     
     
       19. A structure as in claim 18, wherein a plurality of leads are formed integrally with the ring. 
     
     
       20. A structure as in claim 19, wherein the .[.leadframe is.]. .Iadd.die attach pad, the plurality of leads, and the ring are .Iaddend.formed by stamping .[.the leadframe out.]. of a single plate. 
     
     
       21. A structure as in claim .[.19.]. .Iadd.20.Iaddend., wherein the .[.leadframe is.]. .Iadd.die attach pad, the plurality of leads, and the ring are .Iaddend.formed by etching .[.the leadframe out.]. of a single plate. 
     
     
       22. A structure as in claim .[.19.]. .Iadd.20.Iaddend., wherein: the die attach pad is a ground plane; and   the ring is a power plane.   
     
     
       23. A structure as in claim .[.19.]. .Iadd.20.Iaddend., wherein: the die attach pad is a power plane; and   the ring is a ground plane.   
     
     
       24. A structure as in claim .[.16.]. .Iadd.17.Iaddend., wherein a plurality of leads are formed integrally with the ring. 
     
     
       25. A structure as in claim 24, wherein the ring is formed in sections that are electrically isolated from each other. 
     
     
       26. A structure as in claim 25, wherein: a first section of the ring is a ground plane; and   a second section of the ring is a power plane.   
     
     
       27. A structure as in claim 25, wherein at least one section of the ring is held at a different voltage potential than other sections of the ring. 
     
     
       28. A structure as in claim 17, wherein: the die attach pad is a ground plane; and   the ring is a power plane.   
     
     
       29. A structure as in claim 17, wherein: the die attach pad is a power plane; and   the ring is a ground plane.   
     
     
       30. A structure as in claim 16, .[.wherein: the leadframe.]. further .[.comprises.]. .Iadd.comprising .Iaddend.a second electrically conductive ring.[.;.]..Iadd., wherein:.Iaddend.   at least one of the leads is formed integrally with the second electrically conductive ring;   the second electrically conductive ring is formed outside the perimeter of the die attach pad and between one or more of the leads and the first electrically conductive ring such that the second electrically conductive ring is electrically isolated from the first electrically conductive ring; and   at least one bond wire is connected between a bond pad and the second electrically conductive ring.   
     
     
       31. A structure as in claim 30, wherein: the first electrically conductive ring is a ground plane; and   the second electrically conductive ring is a power plane.   
     
     
       32. A structure as in claim 30, wherein: the first electrically conductive ring is a power plane; and   the second electrically conductive ring is a ground plane.   
     
     
       33. A structure, comprising: a semiconductor die on which electrical circuitry and a plurality of bond pads are formed;   a leadframe, the leadframe comprising: a die attach pad having a surface on which the semiconductor die is mounted;   a plurality of electrically conductive leads, each having a surface in the same plane as the surface of the die attach pad; and   an electrically conductive ring, wherein: the electrically conductive ring is outside a perimeter of the die attach pad and between one or more of the leads and the die attach pad such that the ring is electrically isolated from the die attach pad; and   the ring has a surface in substantially the same plane as the surface of the die attach pad;       a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and   at least one bond wire is connected between a bond pad and a selected one of the plurality of leads; and   protective, electrically insulative material enclosing the semiconductor die, leadframe, and bond wires.     
     
     
       34. A structure as in claim 33, wherein: the die attach pad is electrically conductive;   at least one of the leads is formed integrally with the die attach pad; and   at least one of the leads is formed integrally with the ring;   at least one bond wire is connected between a bond pad and the die attach pad.   
     
     
       35. A structure as in claim 34, wherein: a plurality of leads are formed integrally with the die attach pad; and   a plurality of leads are formed integrally with the ring.   
     
     
       36. A structure as in claim 35, wherein: the die attach pad is a ground plane; and   the ring is a power plane.   
     
     
       37. A structure as in claim 35, wherein: the die attach pad is a power plane; and   the ring is a ground plane.   
     
     
       38. A structure as in claim 35, wherein the ring is formed in sections that are electrically isolated from each other. 
     
     
       39. A structure as in claim 38, wherein: a first section of the ring is a ground plane; and   a second section of the ring is a power plane.   
     
     
       40. A structure as in claim 38, wherein at least one section of the ring is held at a different voltage potential than other sections of the ring. 
     
     
       41. A structure as in claim 33, wherein the leadframe is formed by stamping the leadframe out of a metal plate. 
     
     
       42. A structure as in claim 33, wherein the leadframe is formed by etching the leadframe out of a metal plate. 
     
     
       43. A structure as in claim 33, wherein: the die attach pad is a ground plane; and   the ring is a power plane.   
     
     
       44. A structure as in claim 33, wherein: the die attach pad is a power plane; and   the ring is a ground plane.   
     
     
       45. A structure as in claim .[.34.]. .Iadd.33.Iaddend., wherein: the leadframe further comprises a second electrically conductive ring;   the second electrically conductive ring is outside the perimeter of the die attach pad and between one or more of the leads and the first electrically conductive ring such that the second electrically conductive ring is electrically isolated from the first electrically conductive ring;   the second electrically conductive ring has a surface in substantially the same plane as the surface of the die attach pad; and   at least one bond wire is connected between a bond pad and the second electrically conductive ring.   
     
     
       46. A structure as in claim 45, wherein: the first electrically conductive ring is a ground plane; and   the second electrically conductive ring is a power plane.   
     
     
       47. A structure as in claim 45, wherein: the first electrically conductive ring is a power plane; and   the second electrically conductive ring is a ground plane. .Iadd.48. A structure as in claim 1, further comprising:   a semiconductor die mounted on the die attach pad, the semiconductor die including bond pads; and   electrically conductive bond wires that connect selected ones of the bond pads to selected ones of electrically conductive leads or selected bond locations on the electrically conductive ring..Iaddend..Iadd.49. A structure as in claim 1, wherein the leads, the die attach pad, and the ring are coplanar..Iaddend..Iadd.50. A structure as in claim 2, wherein a single layer comprises the leads, the die attach pad, and the ring..Iaddend..Iadd.51. A structure as in claim 2, wherein the leads, the die attach pad, and the ring are coplanar..Iaddend..Iadd.52. A structure comprising:   a semiconductor die on which electrical circuitry and a plurality of bond pads are formed;   a plurality of electrically conductive leads;   an electrically conductive ring that includes a plurality of sections, wherein: the ring and the leads are coplanar;   each section of the ring has at least one of the leads formed integrally with the section; and   the ring is outside a perimeter of the semiconductor die and between one or more of the leads and the semiconductor die; and     a plurality of electrically conductive bond wires, wherein: at least one of the bond wires is connected between a bond pad and the ring; and   at least one of the bond wires is connected between a bond pad and a     
     
     
        selected one of the plurality of leads..Iaddend..Iadd.53.  A structure as in claim 52, further comprising a protective, electrically insulative material enclosing the semiconductor die, the ring, and the bond wires..Iaddend..Iadd.54. A structure as in claim 52, wherein for each section of the ring, at least one bond wire is connected between the section and a bond pad on the semiconductor die..Iaddend..Iadd.55. A structure as in claim 52, wherein the sections of the ring include a 
     
     
        ground plane..Iaddend..Iadd.56.  A structure as in claim 52, wherein the sections of the ring include a power plane..Iaddend..Iadd.57. A structure as in claim 52, wherein the sections of the ring are electrically isolated from each other, whereby each section can be at a voltage that is independent of voltages of the other sections..Iaddend..Iadd.58. A structure as in claim 57, wherein the sections of the ring include a power plane and a ground plane..Iaddend..Iadd.59. The structure of claim 52, wherein the plurality of leads and the ring are formed by stamping of a single plate..Iaddend..Iadd.60. The structure of claim 52, wherein the plurality of leads and the ring are formed by etching of a single plate..Iaddend..Iadd.61. A structure comprising: a semiconductor die on which circuitry and a plurality of bond pads are formed;   a conductive surface on which the semiconductor die is mounted;   a plurality of electrically conductive leads; and   an electrically conductive ring, wherein: at least one of the leads is formed integrally with the ring; and     the electrically conductive ring is and between one or more of the leads and the semiconductor die, the ring being electrically isolated from the electrically conductive surface on which the semiconductor die is mounted; and   a plurality of electrically conductive bond wires, wherein: at least one bond wire is connected between a bond pad and the ring; and   at least one bond wire is connected between a bond pad and a selected one     
     
     
        of the plurality of leads..Iaddend..Iadd.62.  A structure as in claim 61, further comprising a protective, electrically insulative material enclosing the semiconductor die, the ring, and the bond wires..Iaddend..Iadd.63. A structure as in claim 61, further comprising a second electrically conductive ring, wherein: at least one of the leads is formed integrally with the second electrically conductive ring;   the second electrically conductive ring is outside the perimeter of the semiconductor die and between one or more of the leads and the first electrically conductive ring such that the second electrically conductive ring is electrically isolated from the first electrically conductive ring; and   at least one bond wire is connected between a bond pad and the second   
     
     
        electrically conductive ring..Iaddend..Iadd.64.  A structure as in claim 63, wherein: the first electrically conductive ring is a ground plane; and   the second electrically conductive ring is a power plane..Iaddend..Iadd.65. A structure as in claim 63, wherein:   the first electrically conductive ring is a power plane; and   the second electrically conductive ring is a ground plane..Iaddend..Iadd.66. A structure as in claim 61, wherein the plurality of leads and the ring are formed by stamping of a single plate..Iaddend..Iadd.67. A structure as in claim 61, wherein the plurality of leads and the ring are formed by etching of a single plate..Iaddend.