Clamp for use with electroplating apparatus and method of using the same

Abstract

A clamp for use in an electrolytic plating bath is disclosed. The clamp comprises two levers at least two opposing levers, at least one lever being pivotally attached to each other at a fulcrum wherein the clamp, when floating on top of a liquid, is in an open position but when submerged is caused, by virtue of its buoyancy, to move to a closed position. Each lever comprises a first part integrally attached to a second part. The first part and the second part are situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position. In operation, at least one substrate is supported in a substantially vertical plane for submersion into an electrolyte bath. The substrate is positioned over the electrolyte bath and then is submersed into it. The clamp clamps the substrate at its lower edge as the substrate enters the electrolyte bath.

I claim:  
     
       1. A clamp for use in an electrolytic plating bath, the clamp comprising: two levers  at least two opposing levers, at least one lever being pivotally attached to each other at a fulcrum and movable between an open and a closed position, each lever comprising a first part and a second part, the first part being integrally attached to the second part, the first part comprising a guide member for guiding an object to be clamped, each part being situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position when the clamp is submersed into a liquid, the clamp further comprising at least two gripping members, at least one griping member being situated on each lever, wherein when the levers are in a closed position the gripping members are adjacent to each other and are on either side of the object to be clamped, and wherein when the levers are in an open position, the gripping members are spaced apart from each other , said clamp being operable between the open and closed positions by virtue of its buoyancy. 
     
     
       2. The clamp for use in an electrolytic plating bath of claim  1 , wherein when the levers are in the open position, the guide members of each lever guide an object to be clamped into the space between the gripping members. 
     
     
       3. The clamp for use in an electrolytic plating bath of claim  1   18 , wherein the guide members extend upwardly and outwardly in substantially a v-shape from the space between the gripping members when the levers are in the open position. 
     
     
       4. The clamp for use in an electrolytic plating bath of claim  3 , wherein the two guide members form an angle therebetween, wherein the angle between the guide members is smaller when the levers are in the open position than when the levers are in the closed position. 
     
     
       5. A method for electrolytic deposition of a coating of metal on an electroplatable substrate, the substrate having a lower edge, the method comprising the following steps: 
       supporting at least one substrate in a substantially vertical plane; for submersion into an electrolyte bath;  
       positioning the substrate over the electrolyte bath;  
       submersing the substrate into the electrolyte bath; and  
       clamping the substrate at its lower edge as the substrate enters the electrolyte bath,  
       wherein the step of clamping the substrate comprises the step of moving a clamp between an open position and a closed position as the substrate is submersed into the electrolyte bath, the clamp comprising at least two levers pivotally attached to each other at a fulcrum, and at least one gripping member located on each lever for gripping the substrate, wherein the clamp, when floating on top of the electrolyte bath is in an open position, but when submersed into the electrolyte bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the open position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side on the substrate so as to grip the substrate with the gripping members.  
     
     
       6. A cathode shielding device for use in an electrolyte plating bath, said device comprising: 
       an elongated trough in a frame, the trough capable of housing at least one electroplatable substrate in a substantially vertical plane; and  
       aat least one clamp disposed in the trough for clamping the electroplatable substrate, thesaid clamp comprising at least two opposing levers, at least one lever being pivotally attached to each other at  a fulcrum and movable between an open and a closed position, each lever comprising a first part and a second part, the first part being integrally attached to the second part, the first part comprising a guide member for guiding an object to be clamped, each part being situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position when the clamp is submersed into the electrolyte plating bath.  
     
     
       7. The cathode shielding device for use in an electrolyte plating bath of claim  6 , wherein the clamp further comprises at least two gripping members, at least one griping  gripping member being situated on each lever  at least two levers, wherein when the levers are in a closed position the gripping members are adjacent to each other and are on either side of the object to be clamped, and wherein when the levers are in an open position, the gripping members are spaced apart from each other. 
     
     
       8. The cathode shielding device for use in an electrolyte plating bath of claim  7 , wherein the levers are in the open position, the guide members of each lever guide an object to be clamped into the space between the gripping members. 
     
     
       9. The cathode shielding device for use in an electrolyte plating bath of claim  8 , wherein the guide members extend upwardly and outwardly in substantially a v-shape from the space between the gripping members when the levers are in the open position. 
     
     
       10. The cathode shielding device for use in an electrolyte plating bath of claim  9 , wherein the two  guide members form an angle therebetween, wherein the angle between the guide members is smaller when the levers are in the open position than when the levers are in the closed position. 
     
     
       11. The cathode shielding device for use in an electrolyte plating bath of claim  10 , wherein the substrate comprises a printed circuit board. 
     
     
       12. An apparatus for electrolytic deposition of metal on a substrate, said apparatus comprising a container for containing electrolytic fluid; a cathode and an anode mounted in the container, and a cathode shielding device, the cathode shielding device comprising: 
       an elongated trough, the trough comprising an upper edge in a plane, the trough capable of housing an electroplatable substrate in a substantially vertical plane, the substrate having a lower edge in a plane, the lower edge of the substrate located in the same plane in which lies the upper edge of the trough; and  
       at least one clamp disposed inside  in the trough for clamping the electroplatable substrate, the clamp comprising two levers  at least two opposing levers, at least one lever being pivotally attached to each other at  a fulcrum and movable between an open and a closed position, wherein each lever comprises a first part and a second part, the first part being integrally attached to the second part, the first part comprising a guide member for guiding an object to be clamped, each part being situated on opposite sides of the fulcrum from each other such that rotational movement about the fulcrum between the open position and the closed position causes the second parts of each lever to move from an upper position to a lower position when the clamp is submersed into a liquid.  
     
     
       13. The cathode shielding device for use in an electrolyte plating bath of claim  12 , wherein the clamp further comprises at least two gripping members, at least one griping  gripping member being situated on each of lever  at least two levers, wherein when the levers are in a closed position the gripping members are adjacent to each other and are on either side of the object to be clamped, and wherein when the levers are in an open position, the gripping members are spaced apart from each other. 
     
     
       14. The cathode shielding device for use in an electrolyte plating bath of claim  13 , wherein when the levers are in the open position, the guide members of each lever guide an object to be clamped into the space between the gripping members. 
     
     
       15. The cathode shielding device for use in an electrolyte plating bath of claim  14 , wherein the guide members extend upwardly and outwardly in substantially a v-shape from the space between the gripping members when the levers are in the open position. 
     
     
       16. The cathode shielding device for use in an electrolyte plating bath of claim  15 , wherein the two  guide members form an angle therebetween, wherein the angle between the guide members is smaller when the levers are in the open position than when the levers are in the closed position. 
     
     
       17. The cathode shielding device for use in an electrolyte plating bath of claim  12 , wherein the substrate comprises a printed circuit board. 
     
     
       18. The clamp for use in an electrolytic bath according to claim  1  further comprising at least two gripping members, at least one gripping member being situated on at least two levers, wherein when the levers are in a closed position the gripping members are adjacent to each other and are on either side of the object to be clamped, and wherein when the levers are in an open position, the gripping members are spaced apart from each other.  
     
     
       19. A clamp for use in an electrolytic plating bath, comprising: 
       
         at least two opposing gripping members, at least one gripping member being pivotally disposed about a fulcrum so as to be capable of gripping the substrate and movable between opened and closed positions wherein said clamp, when floating on top of the electrolyte bath is in an open position, but when submersed in the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side of the substrate so as to grip the substrate with the gripping members.  
       
     
     
       20. The method for electrolyte deposition of a coating of metal on an electroplatable substrate according to claim  5  wherein said clamping step further comprises at least two gripping members, at least one gripping member being situated on at least two levers for gripping the substrate, wherein when the clamp, when floating on top of the electrolytic bath is in an opened position, but when submersed into the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side on the substrate so as to grip the substrate with the gripping members.  
     
     
       21. A method for electrolytic deposition of a coating of metal on an electroplatable substrate, the substrate having lower edge, the method comprising the following steps: 
       
         supporting at least one substrate in a substantially vertical plane over an electrolytic bath;  
       
       
         submersing the substrate in the electrolytic bath; and  
       
       
         clamping the substrate at its lower edge as the substrate enters the electrolytic bath;  
       
       
         wherein the step of clamping the substrate comprises moving a clamp between an opened position and a closed position as the substrate is submersed into the electrolytic bath, the clamp comprising at least two opposing gripping members, at least one gripping member being pivotally disposed about a fulcrum so as to be capable of gripping the substrate and movable between opened and closed positions wherein said clamp, when floating on top of the electrolytic bath is in an opened position, but when submersed in the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side on the substrate so as to grip the substrate with the gripping members.  
       
     
     
       22. A cathode shielding device for use in an electrolytic plating bath, said device comprising: 
       
         an elongated trough in a frame, the trough capable of housing at least one electroplatable substrate in a substantially vertical plane; and  
       
       
         at least one clamp disposed in said trough for clamping the electroplatable substrate, said clamp comprising at least two opposing gripping members, at least one gripping members being pivotally disposed about a fulcrum so as to be capable of gripping the substrate and movable between opened and closed positions wherein said clamp, when floating on top of the electrolytic bath is in an opened position, but when submersed in the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position, the gripping members are adjacent to each other and on either side of the substrate so as to grip the substrate with the gripping members.  
       
     
     
       23. An apparatus for electrolytic deposition of metal on a substrate, said apparatus comprising a container for containing electrolytic fluid; a cathode and an anode mounted in the container, and a cathode shielding device, the cathode shielding device comprising: 
       
         an elongated trough, the trough comprising an upper edge in a plane, the trough capable of housing an electroplatable substrate in a substantially vertical plane, the substrate having a lower edge in a plane, the lower edge of the substrate located in the same plane in which lies the upper edge of the trough; and  
       
       
         at least one clamp disposed in said trough the clamping the electroplatable substrate, the clamp comprising at least two opposing gripping members, at least one gripping member being pivotally disposed about a fulcrum so as to be capable of gripping the substrate and movable between opened and closed positions wherein said clamp, when floating on top of the electrolytic bath is in an opened position, but when submersed in the electrolytic bath is caused, by virtue of its buoyancy, to move to a closed position, such that in the opened position the gripping members are spaced apart from each other, and such that in the closed position the gripping members are adjacent to each other and on either side of the substrate so as to grip the substrate with the gripping members.