USRE37323EExpiredUtility
Method for sticking an insulating film to a lead frame
Est. expiryMay 14, 2013(expired)· nominal 20-yr term from priority
Inventors:Toshio KawamuraTakashi SuzumuraMakoto AidaHiroshi SugimotoShigeharu TakahagiYuju EndoToshi SasakiHiroyuki Takasaka
H10W 72/865H10W 90/756H10W 90/736H10W 70/435H10W 70/415H10W 70/047H10P 72/0446H10W 72/071Y10T156/107Y10T83/06Y10T83/04Y10T156/1326Y10T83/9423
35
PatentIndex Score
5
Cited by
16
References
4
Claims
Abstract
A method for punching an insulating film is composed of using plural divided punches having a clearance between each two of the divided punches. The clearance absorbs thermal expansion of the divided punches caused by receiving a heat from a heater. A punched insulating film is stuck to a lead frame by being pressed between the divided punches and the heater.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method for sticking an insulating film to a lead frame comprising the steps of:
providing a punch for punching a thermally adhesive insulating film, said punch having a clearance within it for absorbing thermal expansion thereof;
punching said thermally adhesive insulating film to provide a punched film by said punch;
heating a lead frame placed on a heater by said heater; and
pressing said punched film to said lead frame on said heater by said punch, thereby sticking said punched film to said lead frame
wherein thermal expansion of said punch occupying as a result of carrying out the step of heating said lead frame is absorbed by said clearance of said punch.
2. A method for sticking an insulating film to a lead frame according to claim 1 , wherein:
said pressing step is carried out in a state where said heater is mounted on a heater fixing plate on an air cylinder.
3. A method for sticking an insulating film to a lead frame comprising the steps of:
providing a punch for punching thermally adhesive insulating film;
punching said thermally adhesive insulating film to provide a punched film by said punch;
providing a lead frame placed between a heater, for heating said lead frame, and said punch;
providing a means for maintaining a constant pressing force produced between said punched film and said lead frame, said means mounting said heater and functioning to move said heater up and down;
moving said heater up to a predetermined position level in accordance with the function of said means to contact and heat said lead frame; and
fixing said punched film on said heated lead frame in accordance with said pressing force.
4. The method as defined in claim 3 , wherein the step of moving said heater up to said predetermined position level is carried out in a state where said heater is mounted on a heater fixing plate on an air cylinder which is said means for maintaining a constant pressing force.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.