Smart cards having thin die

Abstract

Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.

The invention claimed is:  
     
       1. A semiconductor die for use in a smart card, characterized in that the semiconductor die is less than 0.008  between  0 . 004  and  0 . 007 inches thick. 
     
     
       2. A semiconductor die for use in a smart card, characterized in that: 
       (a) the semiconductor die is less than 0.008  between  0 . 004  and  0 . 007 inches thick; and  
       (b) the semiconductor die includes an active device equipped to operate at an RF frequency greater than 20 Khz.  
     
     
       3. A smart card including: 
       (a) a memory device, and/or  
       (b) a processing device,  
       wherein the memory device and the processing device are fabricated using a semiconductor die having a thickness of 0.008 inches or less  between  0 . 004  and  0 . 007  inches. 
     
     
       4. A smart card including: 
       (a) a memory device, and/or  
       (b) a processing device,  
       wherein the memory device and the processing device are fabricated using a semiconductor die having a thickness of 0.008 inches or less  between  0 . 004  and  0 . 007  inches, and wherein the processing device operates at a speed greater than or equal to 4.0 Mhz. 
     
     
       5. A semiconductor die for use in a smart card package having a neutral plane defined as the plane of substantially zero mechanical strain during mechanical flexure of the smart card package, characterized in that: 
       (a) the semiconductor die is less than 0.008  between  0 . 004  and  0 . 007 inches thick, and  
       (b) at least a portion of the semiconductor die is positioned within the neutral plane of the smart card package.  
     
     
       6. A semiconductor die as set forth in  claim 5  further including a plurality of diodes and transistors defining an active surface within the semiconductor die, the active surface being positioned within the neutral plane of the smart card package. 
     
     
       7. A semiconductor die as set forth in  claim 5  further including a plurality of diodes and transistors defining an active surface within the semiconductor die, the active surface being positioned within the neutral plane of the smart card package, and at least one of the plurality of transistors adapted for operation at an RF frequency greater than 20 KHz.