Modular semiconductor power device

Abstract

A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.

We claim:  
     
       1. A modular semiconductor power  device, comprising: 
       a conductive member comprising:  
       first conductive-sheet means formed from  a plurality of copper strips,  
       an intermediate layer of alumina to which said first-conductive sheet means is  plurality of copper strips are directly soldered  attached, and  
       a further conductive copper sheet directly soldered  attached onto a side of said intermediate layer opposite said conductive first conductive-sheet means  plurality of copper strips;  
       a plurality of chips solderedat least one semiconductor chip attached to at least one of said copper strips of said first conductive sheet means ;  
       a heat-dissipating metal plate for dissipating heat generated by the Joule effect and soldered  to which said further conductive sheet is attached; and  
       a one-piece frame formed with connection strips adapted to form signal and power terminals of said device having temporary connections between outer ends of said connection strips, said connection strips having inner ends selectively soldered  attached to points of said first conductive sheet means  copper strips connected to said at least one semiconductor chips and to said strips .  
     
     
       2. The device defined in  claim 1 , further comprising a body of an insulating resin encapsulating at least active parts of said conductive member, said at least one semiconductor chips  and said heat dissipating metal plate leaving only said outer ends of said connection strips and an outer surface of said plate uncovered by said resin. 
     
     
       3. A modular semiconductor power  device, comprising: 
       a conductive member comprising:  
       first conductive-sheet means formed from  a plurality of coplanar copper strips,  
       an intermediate layer of alumina to which said first-conductive sheet means is  copper strips are directly soldered  attached, and  
       a further conductive copper sheet directly soldered  attached onto a side of said intermediate layer opposite said conductive first conductive-sheet means  copper strips;  
       a plurality of semiconductor chips soldered  attached to said copper strips of said first conductive sheet means ;  
       a heat-dissipating metal plate for dissipating heat generated by the Joule effect and soldered  and attached to said further conductive sheet; and  
       an array of conductor strips selectively soldered  connected to points of said first conductive-sheet means  copper strips and to said semiconductor chips, said device being encapsulated in an insulating resin so that only outer ends of said conductor strips and an outer surface of said plate remain uncovered by said resin.  
     
     
       4. The modular semiconductor device defined in  claim 3  wherein said heat-dissipating metal plate is formed with respective grooves on opposite sides of said conductive member along a surface of said heat-dissipating metal plate soldered  attached to said further conductive sheet. 
     
     
       5. The modular semiconductor device defined in  claim 3  wherein said heat-dissipating metal plate is formed along a side thereof opposite that at which said further conductive sheet is soldered  connected to said heat-dissipating metal plate with S-shaped formations in which said insulating resin is anchored. 
     
     
       6. A modular semiconductor device, comprising: 
       
         a conductive member comprising:  
       
       
         a first conductive sheet,  
       
       
         an intermediate layer to which said first conductive sheet is directly attached, and  
       
       
         a second conductive sheet directly attached to said intermediate layer on a side opposite said first conductive sheet;  
       
       
         a semiconductor chip attached to said first conductive sheet;  
       
       
         a heat dissipating plate attached to said second conductive sheet; and  
       
       
         a frame formed with strips to provide signal and power terminals for said device, said strips having inner ends for attachment to contact points for selective connection to said chip. 
       
     
     
       7. The device defined in  claim 6 , further comprising a body of an insulating resin encapsulating at least portions of said frame, said semiconductor chip, and said heat dissipating plate. 
     
     
       8. The device defined in  claim 6 , wherein said first and second conductive sheets are copper and said intermediate layer is alumina. 
     
     
       9. The device defined in  claim 6 , further comprising a layer between said semiconductor chip and said first conductive sheet. 
     
     
       10. The device defined in  claim 6 , further comprising a plurality of conductive strips directly attached to said intermediate layer and coplanar with said first conductive sheet, providing connection points for said inner ends of said frame. 
     
     
       11. The device defined in  claim 9 , wherein said layer comprises molybdenum.