USRE39453EExpiredUtility
Low profile inductive component
Est. expiryOct 28, 2019(expired)· nominal 20-yr term from priority
H01F 27/027H01F 17/045H01F 27/292H05K 1/18Y10T29/4902
71
PatentIndex Score
14
Cited by
50
References
55
Claims
Abstract
A low profile inductive component in accordance with the disclosure set forth here comprises a low profile body having spread apart soldering pads for electrically and mechanically attaching the structure to a printed circuit board and defining an aperture between the pads. A magnetic core is disposed in the aperture. A wire is wound around the core having a first and second end connected to the pads. One end of the core is disposed in the aperture of the low profile body and its other end, which is larger than the aperture, is spaced from the body by spacers extending from the body.
Claims
exact text as granted — not AI-modified1. An inductive component for mounting on a printed circuit board comprising:
a low profile body having spaced apart legs extending from said body and defining an aperture extending through said body between said legs and soldering pads on the ends of said legs for electrically and mechanically attaching said body to lands on the printed circuit board;
a core having an end portion disposed in said aperture and an opposite end portion extending from said body between said legs; and
a wire wound around said core having first and second ends electrically connected to respective soldering pads.
2. An The inductive component in accordance with claim 1 , wherein said core is comprised of a magnetic material.
3. An The inductive component in accordance with claim 1 , wherein said opposite end portion extends from said body between said legs to about the plane containing said soldering pads.
4. An The inductive component in accordance with claim 1 , wherein said opposite end portion extends from said body between said legs to a point beyond the plane containing said soldering pads.
5. An The inductive component in accordance with claim 4 , wherein said opposite end portion extends from said body between said legs and into an aperture in said printed circuit board in an amount no greater than the thickness of the printed circuit board.
6. An The inductive component in accordance with claim 1 , wherein the core has a reduced diameter central section on which the wire is wound, a first flange which fits snugly in the aperture, a second flange of larger diameter than the first flange which is spaced from the surface of the body by spacers extending from the lower surface of said body.
7. An The inductive component in accordance with claim 6 , wherein the spacers are of a height to position the second flange about even with the plane of the solder pads.
8. An The inductive component in accordance with claim 6 , wherein the spacers are of a height to position the second flange beyond the plane of the solder pads.
9. A method of mounting a low profile inductive component on a printed circuit board, comprising the steps of:
providing a low profile body having spaced apart legs extending from said body and defining an aperture extending through said body between said legs, and soldering pads on the ends of said legs;
providing a core having an end portion disposed in said aperture and an opposite end portion extending from said body between said legs;
providing a wire wound around said core and having a first and second end, wherein said wire ends are connected to said soldering pads;
inserting said low profile inductive component on said printed circuit board such that said soldering pads abut lands on the printed circuit board; and
soldering said soldering pads to said lands to electrically and mechanically attach said component to the lands.
10. The method of claim 9 , wherein said core extends from said body between said legs and further comprise the step of inserting the extending core into the aperture in said printed circuit board.
11. The method of claim 10 , wherein said core extends from said body between said legs and into said printed circuit board aperture an amount no greater than the thickness of the printed circuit board.
12. An inductive component for mounting on a printed circuit board comprising:
a low profile body having spaced apart soldering pads extending from said body for electrically and mechanically attaching said body to lands on the printed circuit board and defining an aperture extending through said body between said soldering pads;
a core having first and second flanged ends disposed in said aperture and extending from said body between said soldering pads; and
a wire wound around said core wherein said wire has a first and second end and wherein said wire ends are connected to said pads such that no portion of said wire is exposed externally when said inductive component is mounted on said printed circuit board; and
the component has a height of less than about 1 . 65 mm .
13. An The inductive component in accordance with claim 12 , wherein said first flanged end is disposed in said aperture of said body such that said first flanged end and said body create a generally planar top surface.
14. An The inductive component in accordance with claim 13 , wherein said second flanged end extends from said body between said soldering pads an amount no greater than the amount said solder pads extend from said body.
15. An The inductive component in accordance with claim 14 , wherein said first flanged end is smaller in diameter than said second flanged end.
16. An The inductive component in accordance with claim 13 , wherein said second flanged end extends from said body between said soldering pads an amount greater than the amount said solder pads extend from said body.
17. An The inductive component in accordance with claim 16 , wherein said second flanged end extends from said body between said soldering pads and into an aperture in said printed circuit board an amount no greater than the thickness of the printed circuit board.
18. An The inductive component in accordance with claim 17 , wherein said first flanged end is smaller in diameter than said second flanged end.
19. A method of making a low profile inductive component to be placed on a printed circuit board, wherein the method comprises:
providing a low profile body defining an aperture extending through said body and providing spaced apart soldering pads on said body adjacent said aperture;
providing a core;
wrapping a wire around said core so as to provide first and second ends;
inserting said core into said aperture; and
electrically connecting said wire ends to respective soldering pads on said body to form an assembled inductive component having a height of less than about 1 . 65 mm.
20. A method of making a low profile inductive component to be placed on a printed circuit board, wherein the method comprises:
providing a low profile body having spaced apart legs extending from said body soldering pads and defining an aperture extending through said body between said legs soldering pads, the body being made of at least one of a plastic or ceramic;
providing soldering pads on the ends of said legs;
providing a core;
wrapping a wire having first and second ends around said core so as to provide first and second ends ;
inserting said core into said aperture; and
electrically connecting said wire ends to respective soldering pads on said legs .
21. An inductive component for mounting on a printed circuit board comprising:
a low profile body having spaced apart soldering pads on said body for electrically and mechanically attaching said body to lands on the printed circuit board and defining an aperture extending through said body between said soldering pads;
a core disposed in said aperture; and
a wire wound around said core having first and second ends electrically connected to respective soldering pads.
22. An The inductive component in accordance with claim 21 , wherein said core has first and second flanged ends, and said second flanged end extends from said body.
23. An The inductive component in accordance with claim 21 , wherein said core has first and second flanged ends, and said second flanged end extends from said body beyond said soldering pads.
24. An The inductive component in accordance with claim 21 , wherein said core has first and second flanged ends, and said second flanged end extends from said body an amount no greater than the amount said solder pads extend from said body.
25. The inductive component in accordance with claim 21 , wherein said core has first and second flanged ends.
26. The inductive component in accordance with claim 25 , wherein said first flanged end is smaller in diameter than said second flanged end.
27. The inductive component in accordance with claim 26 , wherein said first flanged end is disposed in said aperture above said second flanged end.
28. The inductive component in accordance with claim 26 , wherein said inductive component is of a height range of about 1 . 1 mm to about 1 . 7 mm.
29. The inductive component in accordance with claim 21 , wherein said inductive component has a height of less than about 1 . 65 mm.
30. A low profile inductive component for mounting on a printed circuit board comprising:
a low profile body defining an aperture extending therethrough and having spaced apart soldering pads for electrically and mechanically connecting the body to lands on the printed circuit board; a core having first and second ends, wherein at least a portion of the core is disposed in the aperture of the body; a wire wound around at least a portion of the core and having first and second ends connected to respective soldering pads; and the component has a height of less than about 1 . 65 mm.
31. The inductive component in accordance with claim 30 , wherein the first and second core ends comprise first and second flanged ends, respectively, and the core is disposed in the aperture such that an upper surface of the first flange end is flush with an upper surface of the body and a lower surface of the second flange end is flush with a lower surface of the body.
32. The inductive component in accordance with claim 31 , wherein the upper flange end is smaller in diameter than the lower flange end.
33. The inductive component in accordance with claim 30 , wherein the core ends comprise first and second flanged ends of different diameters.
34. The inductive component in accordance with claim 30 , wherein the first core end is disposed in the aperture of the body and the second core end extends from the body.
35. The inductive component in accordance with claim 30 , wherein the body further comprises spaced apart legs extending from the body and at least a portion of each spaced apart soldering pad is connected to at least one leg.
36. The inductive component in accordance with claim 35 , wherein one of the first and second core ends extends from the body between the legs.
37. The inductive component in accordance with claim 30 , wherein the soldering pads lie within a plane and at least one of the first and second core ends extends from the body beyond the plane containing the soldering pads.
38. The inductive component in accordance with claim 30 , wherein the core has a reduced diameter central section on which the wire is wound, the first flange end is disposed in the aperture, and the second flange end is spaced from the body by spacers extending from a lower surface of the body.
39. The inductive component in accordance with claim 38 , wherein the first and second flange ends are of different diameters.
40. A low profile inductive component for mounting on a printed circuit board comprising:
a low profile body defining an aperture extending therethrough and having spaced apart soldering pads for electrically and mechanically connecting the body to lands on the printed circuit board; a core having first and second flange ends of different diameters, wherein at least a portion of the core is disposed in the aperture of the body; and a wire wound around at least a portion of the core and having first and second ends connected to said soldering pads.
41. The inductive component in accordance with claim 40 , wherein the assembled component has a height of less than about 1 . 65 mm.
42. The inductive component in accordance with claim 40 , wherein the core is disposed in the aperture such that an upper surface of the first flange end is flush with an upper surface of the body and a lower surface of the second flange end is flush with a lower surface of the body.
43. The inductive component in accordance with claim 40 , wherein the first flange end is disposed in the aperture of the body and the second flange end extends from the body.
44. The inductive component in accordance with claim 40 , wherein the body further comprises spaced apart legs extending from the body and at least a portion of each spaced apart soldering pad is connected to at least one leg.
45. The inductive component in accordance with claim 44 , wherein one of the first and second flange ends extends from the body between the legs.
46. The inductive component in accordance with claim 40 , wherein the soldering pads lie within a plane and one of the first and second flange ends extends from the body beyond the plane containing the soldering pads.
47. The inductive component in accordance with claim 40 , wherein the core has a reduced diameter central section on which the wire is wound, the first flange end is disposed in the aperture, and the second flange end is spaced from the body by spacers extending from a lower surface of the body.
48. An inductive component for mounting on a printed circuit board comprising:
a low profile body being made from at least one of a ceramic or plastic material and having spaced apart soldering pads connected to the body for electrically and mechanically attaching the body to lands on the printed circuit board and defining an aperture extending through the body between the soldering pads; a core disposed in the aperture defined by the body; and a wire wound around the core and having first and second wire ends connected to the soldering pads.
49. The inductive component in accordance with claim 48 , wherein the core has first and second flanged ends and the first flanged end is disposed in the aperture of the body such that the first flanged end and the body create a generally planar top surface.
50. The inductive component in accordance with claim 49 , wherein the second flanged end extends from the body between the soldering pads an amount no greater than the amount the solder pads extend from the body.
51. The inductive component in accordance with claim 49 , wherein the first flanged end is smaller in diameter than the second flanged end.
52. The inductive component in accordance with claim 49 , wherein the second flanged end extends from the body between the soldering pads an amount greater than the amount the solder pads extend from the body.
53. The inductive component in accordance with claim 52 , wherein the second flanged end extends from the body between the soldering pads and into an aperture in the printed circuit board an amount no greater than the thickness of the printed circuit board.
54. The inductive component in accordance with claim 52 , wherein the first flanged end is smaller in diameter than the second flanged end.
55. The inductive component in accordance with claim 48 , wherein the assembled component has a height of less than about 1 . 65 mm.Cited by (0)
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