Structure for removable cooler

Abstract

A removable cooler on the memory module wherein the PC board is able to attach on the memory module without any modification. The cooler contains a heat sink module and a cooler module. The heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on the memory module to stimulate heat exchange above the extension part of the heat sinks. The cooler module could be a fan or heat conductive tube. As a fan, it could be buckled on the memory module socket for the extension part of the heat sinks to stimulate heat exchange. As a heat conduction tube screwed or tenoned against the extension part of the heat sinks, it stimulates heat exchange and provides heat dispensation function to assure the performance of the memory module.

1. A structure for a removable cooler on a memory module inside a PC, comprising:
 a heat sink module is combined by two heat conductive heat sinks placed oppositely and screwed or tenoned on said memory module, stimulating heat exchange by transmitting heat generated by said memory module to space above an extension part of said heat sink;    a cooler module consisting of a frame and at least a pair of fans, on both sides of said frame there are flexible frame's legs and two holes on top of said frame stretching to both sides of said frame for ventilation; one of the at least a pair of fans is placed above each of said frame's holes to enhance ventilation;    thus, several memory modules are inserted separately in memory module sockets of a board and said frame's legs pushed outward are stuck with a hook, allowing a frame's top and said at least a pair of fans to be placed above said extension part of said heat sinks for ventilation, stimulating heat exchange to said extension parts, thus to provide heat dispensation for said memory module.    
     
     
       2. The removable cooler for a memory module of  claim 1 , wherein a cavity and a bevel are set at inner bottom of two frame's legs. 
     
     
       3. The removable cooler on a memory module of  claim 1 , wherein said bevels on both frame's legs are pushed toward a hook on both sides of said memory module to have said cavity inside said frame's legs stuck on said hook and secure said frame above said memory module socket. 
     
     
       4. The removable cooler on a memory module of  claim 1 , wherein there is a concave on said heat sink's opposite side that protects and contacts with a chip protruding from said memory module for direct heat conduction. 
     
     
       5. The removable cooler on a memory module of  claim 1 , wherein a plurality of chips of said memory module and a concave provide heat conduction through a heat conduction interface and said heat conduction interface is one of a heat dispensation ointment and a heat dispensation tape. 
     
     
       6. The removable cooler on a memory module of  claim 1 , wherein there are holes on said heat sinks corresponding to holes on said memory module so as to be screwed or tenoned and secure two heat sinks on said memory module. 
     
     
       7. The removable cooler on a memory module of  claim 1 , wherein there are one of heat dispensation fins and ventilators on said extension part of said heat sinks for ventilation and heat dispensation. 
     
     
       8. The removable cooler on a memory module of  claim 1 , wherein a fan of said frame is placed on a location selected from said frame's top, bottom and two sides for ventilation. 
     
     
       9. The removable cooler on a memory module of  claim 1 , wherein said cooler module is a heat conduction tube; said heat conduction tube is located against said extension part of said heat sink and has heat dispensation fins at an extended end so as to transmit heat of said extension part of said heat sinks; on one side of said heat dispensation fins there is a fan to stimulate heat exchange above said heat dispensation fins, thus provide heat dispensation for said memory module. 
     
     
       10. A removable cooler module for a memory module, the memory module being mounted in a memory socket that is secured to a printed circuit board such that a plane of the memory module extends perpendicular to the printed circuit board, the cooler module comprising:
   a frame including parallel side legs and an upper section extending perpendicular to the parallel side legs and attached to upper ends of the side legs, wherein a lower end of each of the side legs includes an engaging structure, and wherein the upper section defines at least one opening; and        at least one fan mounted on the frame,        wherein, when the cooler module is mounted on the memory socket over the memory module, the engagement structures engage the memory socket, and the side legs extend perpendicular to the printed circuit board and the upper section of the frame is maintained over an upper edge of the memory module and parallel to the printed circuit board, whereby the fan is positioned to generate air flow over the memory module, and        wherein the lower end of each of the side legs includes a bevel, and wherein the engaging structure comprises a cavity defined in said each of the side legs adjacent an upper end of a corresponding one of said bevels.     
     
     
       11. The removable cooler module according to  claim 10 , wherein each of the side legs comprises a flexible material selected such that when the lower ends of the side legs are pressed against the memory socket and the bevels contact hook structures attached to the memory sockets, the side legs flex to accommodate engagement of the hook structures inside corresponding ones of said cavities. 
     
     
       12. The removable cooler according to  claim 10 , wherein said at least one fan comprises:
   a first fan mounted over said at least one opening adjacent a first end of said upper section, and        a second fan mounted over said at least one opening adjacent a second end of said upper section.     
     
     
       13. An assembly comprising:
   a module socket mounted on a printed circuit board;        a memory module mounted in the module socket such that a plane of the memory module extends perpendicular to the printed circuit board; and        a cooler module including:      a frame including a plurality of side legs and an upper section extending between upper ends of the side legs, and        at least one fan mounted on the frame,          wherein a lower end of each of the side legs is removably engaged with the module socket,        wherein the upper section is positioned over an upper edge of the memory module, and        wherein the fan is arranged on the frame such that air flow generated by the fan passes along opposing surfaces of the memory module,        wherein the module socket includes a hook that is engaged with a side edge of the memory module,        wherein the lower end of each of the side legs includes an bevel and defines a cavity, and        wherein a portion of the hook is received in the cavity defined by at least one of the side legs of the frame.     
     
     
       14. The assembly according to  claim 13 , wherein each of the side legs comprises a flexible material selected such that when the lower ends of the side legs are pressed against the module socket and the bevels contact first and second hooks attached to opposite ends of the module sockets, the side legs flex to accommodate engagement of the hook structures inside corresponding ones of said cavities. 
     
     
       15. The assembly according to  claim 13 , wherein said at least one fan comprises:
   a first fan mounted over a first opening defined in said upper section adjacent to a first end of said memory module, and        a second fan mounted over a second opening defined in said upper section adjacent to a second end of said memory module.     
     
     
       16. The assembly according to  claim 13 , further comprising a heat sink module including first and second conductive heat sinks mounted over said opposing surfaces of the memory module. 
     
     
       17. The assembly according to  claim 16 , wherein at least one of the first and second conductive heat sinks includes a concave section that contacts a chip protruding from the memory module. 
     
     
       18. The assembly according to  claim 16 , wherein the memory module comprises a plurality of chips that contact at least one of the first and second conductive heat sinks by way of one of a heat dispensation ointment and a heat dispensation tape. 
     
     
       19. The assembly according to  claim 16 , wherein the first and second conductive heat sinks define holes that correspond to holes defined on said memory module, and wherein the first and second conductive heat sinks are secured by fasteners that extend through the holes.