USRE40386EExpiredUtility
Chrome plated parts and chrome plating method
Est. expiryNov 6, 2018(expired)· nominal 20-yr term from priority
B32B 15/01C25D 5/48C25D 5/617C25D 3/04C25D 5/14C25D 5/625C25D 5/627C25D 5/18C25D 3/10Y10T428/12493
59
PatentIndex Score
3
Cited by
31
References
30
Claims
Abstract
Using a chrome plating bath containing organic sulfonic acid, plating is conducted by application of a pulse current to thereby form a crack-free lower chrome layer on a steel substrate. The lower chrome layer has a compressive residual stress of 100 MPa or more and a crystal grain size of from 9 nm to less than 16 nm. Subsequently, by application of a direct current, a cracked upper chrome layer is formed on the lower chrome layer, to thereby obtain a chrome plated part. The lower chrome layer imparts the chrome plated part with heat resistance and corrosion resistance, and the upper chrome layer imparts the chrome plated part with wear resistance and good sliding properties.
Claims
exact text as granted — not AI-modified1. A chrome plated part comprising a substrate having a crack-free chrome layer on a surface thereof, the crack-free chrome layer having compressive residual stress of 100 MPa or more and being formed by electroplating.
2. A chrome plated part according to claim 1 comprising a substrate having a crack- free chrome layer on a surface thereof, the crack - free chrome layer having compressive residual stress of 100 MPa or more and being formed by electroplating with a pulse current , wherein the chrome layer has a crystal grain size of 9 nm or more.
3. A chrome plated part according to claim 2 , wherein the crystal grain size of the chrome layer is from 9 nm to less than 16 nm.
4. A chrome plated part according to claim 1 claim 2 , wherein the crack-free chrome layer is a lower chrome layer and the chrome plated part further comprises a cracked upper chrome layer which is formed on the lower chrome layer by electroplating.
5. A chrome plated part according to claim 4 , wherein the upper chrome layer has tensile residual stress.
6. A chrome plated part according to claim 5 comprising a substrate having a crack- free chrome layer on a surface thereof, the crack - free chrome layer having compressive residual stress of 100 MPa or more and being formed by electroplating with a pulse current , wherein:
the crack - free chrome layer is a lower chrome layer and the chrome plated part further comprises a cracked upper chrome layer which is formed on the lower chrome layer by electroplating with a pulse current;
the upper chrome layer has tensile residual stress; and
the upper chrome layer has a crystal grain and the crystal grain has a size less than 9 nm.
7. A chrome plated part according to claim 4 , comprising a substrate having a crack- free chrome layer on a surface thereof, the crack - free chrome layer having compressive residual stress of 100 MPa or more and being formed by electroplating with a pulse current, wherein the crack - free chrome layer is a lower chrome layer and the chrome plated part further comprises a cracked upper chrome layer which is formed on the lower chrome layer by electroplating with a pulse current, the chrome plated part further comprising at least one intermediate chrome layer which is formed between the lower chrome layer and the upper chrome layer by electroplating.
8. A chrome plated part according to any one of claims 1 , 4 and 7 , further comprising comprising a substrate having a crack- free chrome layer on a surface thereof, the crack - free chrome layer having compressive residual stress of 100 MPa or more and being formed by electroplating with a pulse current and an oxide film containing Cr 2 O 3 as an outermost layer thereof.
9. A chrome plated part comprising a substrate having a crack-free chrome layer on a surface thereof, the crack-free chrome layer having compressive residual stress of 150 MPa or more and being formed by electroplating.
10. A chrome plated part according to claim 9 comprising a substrate having a crack- free chrome layer on a surface thereof, the crack - free chrome layer having compressive residual stress of 150 MPa or more and being formed by electroplating with a pulse current , wherein the crack-free chrome layer has a crystal grain size of 9 nm or more.
11. A chrome plated part according to claim 10 , wherein the crystal grain size of the crack-free chrome layer is from 9 nm to less than 16 nm.
12. A chrome plated part comprising:
a substrate having a surface; and a chrome layer deposited on the surface of the substrate by electroplating, the chrome layer having compressive residual stress of 100 MPa or more.
13. A chrome plating method comprising the step of conducting electroplating of a work in a chrome plating bath by application of a pulse current, the chrome plating bath containing organic sulfonic acid, to thereby deposit a crack-free chrome layer on a surface of the work, the crack-free chrome layer having compressive residual stress of 150 MPa or more.
14. A chrome plating method comprising the step of conducting electroplating of a work in a chrome plating bath by application of a pulse current, the chrome plating bath containing organic sulfonic acid, to thereby deposit a crack-free chrome layer on a surface of the work, the crack-free chrome layer having compressive residual stress of 100 MPa or more.
15. A chrome plating method according to claim 14 or 13 , wherein the crack-free chrome layer is formed to have a crystal grain size of from 9 nm to less than 16 nm by adjusting a waveform of the pulse current.
16. A method for producing a chrome plated part, comprising the steps of:
conducting the chrome plating method of claim 14 ;
polishing the crack-free chrome layer on the surface of the work; and
conducting heat oxidation, to thereby form an oxide film containing Cr 2 O 3 on a surface of the crack-free chrome layer.
17. A method according to claim 16 , wherein the heat oxidation is conducted under the same conditions as conditions of a baking process.
18. A method according to claim 16 , wherein the heat oxidation is conducted by high-frequency heating.
19. A chrome plating method according to claim 14 , further comprising the step of conducting, after the pulse plating, electroplating of the work in the same chrome plating bath as the chrome plating bath for the pulse plating, by one of adjustment of a waveform of the pulse current and application of a direct current, to thereby deposit a cracked upper chrome layer on the crack-free chrome layer.
20. A chrome plating method according to claim 14 , further comprising the steps of:
conducting, after the pulse plating, electroplating of the work in the same chrome plating bath as the chrome plating bath for the pulse plating, by one of adjustment of a waveform of the pulse current and application of a direct current, to thereby deposit an intermediate chrome layer on the crack-free chrome layer; and
conducting electroplating of the work in the same chrome plating bath as the chrome plating bath for the pulse plating, by one of adjustment of the waveform of the pulse current and application of the direct current, to thereby deposit a cracked upper chrome layer on the intermediate chrome layer.
21. A chrome plating method according to claim 19 or 20 , wherein the chrome layers are deposited by continuous operation by continuously moving the work in the chrome plating bath.
22. A chrome plating method according to claim 19 or 20 , wherein the chrome layers are deposited by batchwise operation by immersing the work in the chrome plating bath.
23. A method for producing a chrome plated part, comprising the steps of:
conducting the chrome plating method of claim 19 or 20 ;
polishing the upper chrome layer formed on the crack-free chrome layer on the surface of the work; and
conducting heat oxidation, to thereby form an oxide film containing Cr 2 O 3 on a surface of the upper chrome layer.
24. A method according to claim 23 , wherein the heat oxidation is conducted under the same conditions as conditions of a baking process.
25. A method according to claim 23 , wherein the heat oxidation is conducted by high-frequency heating.
26. A chrome plating method comprising the steps of:
providing a substrate having a surface; and depositing a chrome layer on the surface of the substrate by electroplating so that the chrome layer has compressive residual stress of 100 MPa or more.
27. The method according to claim 17 , wherein said baking process is at 191 ± 14 ° for 3 hours or more.
28. A method of chrome plating comprising the steps of:
providing a substrate having a surface; depositing a crack - free chrome layer on the surface of the substrate by electroplating by application of a pulse current so that the crack - free chrome layer has compressive residual stress of 100 MPa or more, wherein said electroplating is in the presence of an organic sulfonic acid, and forming an oxide film containing Cr 2 O 3 on the surface of the crack - free chrome layer as an outermost layer.
29. A chrome plated part according to claim 7 , further comprising an oxide film containing Cr 2 O 3 as an outermost layer thereof.
30. A chrome plated part comprising a substrate having a crack- free chrome layer on a surface thereof, the crack - free chrome layer having a compressive residual stress of 100 MPa or more and being formed by electroplating with a pulse current, wherein: the crack - free chrome layer is a lower chrome layer and the chrome plated part further comprises a cracked upper chrome layer which is formed on the lower chrome layer by electroplating with a pulse current; and the chrome plated part further comprises an oxide film containing Cr 2 O 3 as an outermost layer thereof.Cited by (0)
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