Jack including crosstalk compensation for printed circuit board

Abstract

A forward-reverse crosstalk compensation method is provided for compensating capacitance/inductance on a printed circuit board of a connector. The method includes a forward compensation process and a reverse compensation process. The forward compensation process compensates the unbalanced capacitance in the plug of the connector by using the parallel conductive lines or wires. The reverse compensation process can be used to compensate the unbalance capacitance/inductance caused by the forward compensations in the same pair combination of the connector. In both forward compensation and reverse compensation processes, electro-magnetic fields, such as capacitors, can be formed to balance the capacitance/inductance on the printed circuit board of the connector.

1. A method of compensating cross-talk in a connector arrangement which includes a plug and a circuit board, comprising:
 forward compensating unbalanced capacitance in the plug; and    reverse compensating unbalanced capacitance and inductance caused by the forward compensation.    
     
     
       2. The method of  claim 1 , wherein the forward compensating includes forming a capacitor by using additional parallel conductive lines on the circuit board, and the reverse compensating includes forming a capacitor by using additional parallel lines on the circuit board. 
     
     
       3. A connector arrangement for compensating cross-talk, comprising:
 a circuit board with front and rear terminals;    a plurality of pairs of conductors disposed on the circuit board, the pairs of conductors connecting to respective front and rear terminals, each pair of conductors including a ring conductor and a tip conductor, and the ring and tip conductors being substantially disposed in parallel;    a forward-compensating capacitance for compensating unbalanced capacitance, proximate the front terminals; and    a reverse-compensating capacitance for compensating unbalanced capacitance and inductance caused by the forward-compensating capacitance, proximate the rear terminals.    
     
     
       4. The connector arrangement of  claim 3 , wherein the forward-compensating capacitance is formed by using additional parallel conductors on the circuit board, and the reverse-compensating capacitance is formed by using additional parallel conductors on the circuit board. 
     
     
       5. The connector arrangement of  claim 3 , wherein the front terminals include contact springs. 
     
     
       6. The connector arrangement of  claim 3 , wherein the rear terminals include insulation displacement connectors. 
     
     
       7. The connector arrangement of  claim 3 , further comprising a housing holding the circuit board, the housing defining a plug port for receipt of a plug of a telecommunications cable. 
     
     
       8. The connector arrangement of  claim 3 , wherein the plurality of pairs of conductors are disposed on one side of the circuit board. 
     
     
       9. A method of compensating cross- talk in a connector arrangement which includes a plug and a multi - layered circuit board with first and second sets of terminals, comprising:      forward compensating unbalanced capacitance in the plug; and        reverse compensating unbalanced capacitance and inductance caused by the forward compensation;        wherein the connector arrangement includes:      i )  a first and a second pair of conductors, each of the pairs including a ring conductor and a tip conductor, wherein each conductor includes at least a contact spring portion and a circuit board trace portion, wherein each of the circuit board trace portions of the conductors interconnects respective terminals from the first and second sets of terminals, and wherein the circuit board trace portions of at least one pair include at least a signal pathway portion, the signal pathway portions being formed on a single layer of the multi - layered circuit board and electrically connecting respective terminals of said first and second sets of terminals;          ii )  first and second capacitors, wherein the first capacitor is formed between a first conductor of the first conductor pair and a second conductor of the second pair, and wherein the second capacitor is formed between a second conductor of the first pair and a first conductor of the second pair; and        iii )  a third capacitor formed between the first conductor of the first pair and the first conductor of the second pair.     
     
     
       10. The method of  claim 9 , further comprising a fourth capacitor formed between the second conductor of the first pair and the second conductor of the second pair. 
     
     
       11. The method of  claim 10 , wherein the third and fourth capacitors are formed on the circuit board. 
     
     
       12. The method of  claim 11 , wherein the first and second capacitors are formed on the circuit board and are electrically located closer to the first set of terminals than the third and fourth capacitors, and wherein the third and fourth capacitors are electrically located closer to the second set of terminals than the first and second capacitors. 
     
     
       13. The method of  claim 9 , wherein the connector arrangement includes insulation displacement connectors connected to the second set of terminals. 
     
     
       14. The method of  claim 13 , wherein the second set of terminals is arranged in two groups along opposite edges of the circuit board. 
     
     
       15. The method of  claim 14 , wherein the terminals from at least one of the groups are unevenly spaced. 
     
     
       16. The method of  claim 9 , wherein at least one of the first, second, and third capacitors is formed on the circuit and is formed on the same layer as the circuit board trace portions of at least one pair of conductors. 
     
     
       17. The method of  claim 10 , wherein at least one of the first, second, third, and fourth capacitors is formed on the circuit board and is formed on the same layer as the circuit board trace portions of at least one pair of conductors. 
     
     
       18. The method of  claim 17 , wherein the at least one of the first, second, third and fourth capacitors is formed by using additional parallel conductive traces on the circuit board. 
     
     
       19. The method of  claim 9 , wherein the multi- layered circuit board has four layers.   
     
     
       20. A method of compensating cross- talk in a connector arrangement which includes a plug and a multi - layered circuit board with first and second sets of terminals, comprising:      forward compensating unbalanced capacitance in the plug; and        reverse compensating unbalanced capacitance and inductance caused by the forward compensation;        wherein the connector arrangement includes:      i )  a first and a second pair of conductors, each of the pairs including a ring conductor and a tip conductor, wherein each conductor includes at least a contact spring portion and a circuit board trace portion, wherein each of the circuit board trace portions of the conductors interconnects respective terminals from the first and second sets of terminals, and wherein the circuit board trace portions of at least one pair include at least a signal pathway portion, the signal pathway portions being formed on a single layer of the multi - layered circuit board and electrically connecting respective terminals of said first and second sets of terminals;          ii )  first and second capacitors, wherein the first capacitor is electrically connected to a first conductor of the first conductor pair and to a second conductor of the second pair, and wherein the second capacitor is electrically connected to a second conductor of the first pair and to a first conductor of the second pair; and        iii )  a third capacitor electrically connected to the first conductor of the first pair and to the first conductor of the second pair.     
     
     
       21. The method of  claim 20 , further comprising a fourth capacitor electrically connected to the second conductor of the first pair and to the second conductor of the second pair. 
     
     
       22. The method of  claim 21 , wherein the third and fourth capacitors are formed on the circuit board. 
     
     
       23. The method of  claim 22 , wherein the first and second capacitors are formed on the circuit board and are electrically located closer to the first set of terminals than the third and fourth capacitors, and wherein the third and fourth capacitors are electrically located closer to the second set of terminals than the first and second capacitors. 
     
     
       24. The method of  claim 20 , wherein the connector arrangement includes insulation displacement connectors connected to the second set of terminals. 
     
     
       25. The method of  claim 24 , wherein the second set of terminals is arranged in two groups along opposite edges of the circuit board. 
     
     
       26. The method of  claim 25 , wherein the terminals from at least one of the groups are unevenly spaced. 
     
     
       27. The method of  claim 20 , wherein at least one of the first, second, and third capacitors is formed on the circuit board and is formed on the same layer as the circuit board trace portions of at least one pair of conductors. 
     
     
       28. The method of  claim 21 , wherein at least one of the first, second, third, and fourth capacitors is formed on the circuit board and is formed on the same layer as the circuit board trace portions of at least one pair of conductors. 
     
     
       29. The method of  claim 28 , wherein the at least one of the first, second, third and fourth capacitors is formed by using additional parallel conductive traces on the circuit board. 
     
     
       30. The method of  claim 20 , wherein the multi- layered circuit board has four layers.   
     
     
       31. A method of compensating cross- talk in a connector arrangement which includes a plug and a multi - layered circuit board with first and second sets of terminals, comprising:      forward compensating unbalanced capacitance in the plug; and        reverse compensating unbalanced capacitance and inductance caused by the forward compensation;        wherein the connector arrangement includes:      i )  a first and a second pair of conductors, each of the pairs including a ring conductor and a tip conductor, wherein each conductor includes at least a contact spring portion and a circuit board trace portion, wherein each of the circuit board trace portions of the conductors forms a signal pathway between a terminal from the first set and a terminal from the second set, wherein the signal pathway for at least one of the conductors from the first pair is positioned on a single layer of the multi - layered circuit board, and wherein the signal pathway for at least one of the conductors from the second pair is positioned on a single layer of the multi - layered circuit board;          ii )  first and second capacitors, wherein the first capacitor is electrically connected to a first conductor of the first conductor pair and to a second conductor of the second pair, and wherein the second capacitor is electrically connected to a second conductor of the first pair and to a first conductor of the second pair; and        iii )  a third capacitor electrically connected to the first conductor of the first pair and to the first conductor of the second pair.     
     
     
       32. The method of  claim 31 , further comprising a fourth capacitor electrically connected to the second conductor of the first pair and the second conductor of the second pair. 
     
     
       33. The method of  claim 32 , wherein the third and fourth capacitors are formed on the circuit board. 
     
     
       34. The method of  claim 33 , wherein the first and second capacitors are formed on the circuit board and are electrically located closer to the first set of terminals than the third and fourth capacitors, and wherein the third and fourth capacitors are electrically located closer to the second set of terminals than the first and second capacitors. 
     
     
       35. The method of  claim 31 , wherein the connector arrangement includes insulation displacement connectors connected to the second set of terminals. 
     
     
       36. The method of  claim 35 , wherein the second set of terminals is arranged in two groups along opposite edges of the circuit board. 
     
     
       37. The method of  claim 36 , wherein the terminals from at least one of the groups are unevenly spaced. 
     
     
       38. The method of  claim 31 , wherein at least one of the first, second, and third capacitors is formed on the circuit and is formed on the same layer as the circuit board trace portions of at least one pair of conductors. 
     
     
       39. The method of  claim 32 , wherein at least one of the first, second, third, and fourth capacitors is formed on the circuit board and is formed on the same layer as the circuit board trace portions of at least one pair of conductors. 
     
     
       40. The method of  claim 38 , wherein the at least one of the first, second, third and fourth capacitors is formed by using additional parallel conductive traces on the circuit board. 
     
     
       41. The method of  claim 31 , wherein the multi- layered circuit board has four layers.