Method for connecting microchips to an antenna arranged on a support strip for producing a transponder

Abstract

The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.

1. A method of connecting micro-chips to antennas arranged  formed on a first carrier tape for the manufacture of a transponder, wherein the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape, the spacing of the chip modules on the second carrier tape being different than the spacing of the antennas on the first carrier tape, and wherein the two carrier tapes are unwound from a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. 
     
     
       2. A method according to  claim 1 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape in synchronism with the passing antenna spaces via an indexer. 
     
     
       3. A method according to  claim 1 , wherein the chip module is electrically connected to the appropriate antenna by soldering or crimping immediately after placement on the first carrier tape. 
     
     
       4. A method according to  claim 1 , wherein the transponder is tested immediately after the connection of the chip module to the antenna. 
     
     
       5. A method according to  claim 1 , wherein the chip module is held by a transponder tape, circulating endlessly at the same speed as the first carrier tape, on the first carrier tape during the placement onto the first carrier tape until the chip module is firmly connected to the appropriate antenna. 
     
     
       6. A method according to  claim 1 , wherein the electrical connection of the chip module to the antenna occurs by laser soldering. 
     
     
       7. A method of connecting micro-chips to antennas as part of the manufacture of transponders, the micro-chips having been packaged in a preceding bonding process to form chip modules with electrical terminals, the method comprising the steps of:
 providing first and second carrier tapes, each of which is wound onto a reel, the first carrier tape bearing the  having antennas formed thereon, and the second carrier tape bearing the chip modules, the spacing of the chip modules on the second carrier tape being different than the spacing of the antennas on the first carrier tape, 
 unwinding the first and second carrier tapes, bringing one carrier tape above the other,  
 removing the chip modules from the second carrier tape, placing the chip modules at a predetermined point on the first carrier tape, and electrically connecting each chip module to a corresponding antenna.  
 
     
     
       8. A method according to  claim 7 , wherein, during the unwinding process, the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape in synchronism with the passing antenna spaces via operation of an indexer. 
     
     
       9. A method according to  claim 7 , wherein the electrically connecting step comprises, for each chip module, soldering or crimping the terminals of the chip module to the corresponding antenna immediately after placing the chip module on the first carrier tape. 
     
     
       10. A method according to  claim 7 , further comprising testing each transponder immediately after connecting the corresponding chip module to the corresponding antenna. 
     
     
       11. A method according to  claim 7 , wherein the removing step includes holding the chip module on the first carrier tape by a transport tape until the chip module is firmly connected to the corresponding antenna, the transport tape circulating endlessly at the same speed as the first carrier tape. 
     
     
       12. A method according to  claim 7 , wherein the electrically connecting step comprises, for each chip module, laser soldering the terminals of the chip module to the corresponding antenna. 
     
     
       13. A method according to  claim 1 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape at varying speeds.  
     
     
       14. A method according to  claim 7 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape at varying speeds.  
     
     
       15. A method of connecting micro-chips to antennas formed on a first carrier tape for the manufacture of a transponder, wherein the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are located on a second carrier tape, the spacing of the chip modules on the second carrier tape being different than the spacing of the antennas on the first carrier tape, and wherein the two carrier tapes are each unwound from respective reels and brought one above the other, whereby the chip modules are placed at a predetermined point on the first carrier tape.  
     
     
       16. A method according to  claim 15 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape in synchronism with the passing antennas via an indexer.  
     
     
       17. A method according to  claim 15 , wherein the chip module is electrically connected to the appropriate antenna by soldering or crimping immediately after placement on the first carrier tape.  
     
     
       18. A method according to  claim 15 , wherein the chip module is held by a transport tape, circulating endlessly at the same speed as the first carrier tape, on the first carrier tape during the placement onto the first carrier tape until the chip module is firmly connected to the appropriate antenna.  
     
     
       19. A method according to  claim 15 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape at varying speeds.  
     
     
       20. A method of connecting micro-chips to antennas formed on a first carrier tape for the manufacturing of a transponder, wherein the micro-chips are packaged in a preceding bonding process to form chip modules, wherein a second carrier tape comprises a plurality of said chip modules, the spacing of the chip modules on the second carrier tape being different than the spacing of the antennas on the first carrier tape, comprising:
   moving the first carrier tape at a continuous speed;        indexing the chip modules with respect to the antennas on the first carrier tape by moving the second carrier tape with respect to the first carrier tape so that chip modules are sequentially in position to be placed on respective antennas;        placing the chip modules at predetermined points on the antennas on the first carrier tape.      
     
     
       21. The method of  claim 20 , wherein the second carrier tape is fed to the first carrier tape in synchronism with the passing antennas via an indexer.  
     
     
       22. A method according to  claim 20 , wherein the first carrier tape runs at a continuous speed while the second carrier tape is fed to the first carrier tape at varying speeds.