P
USRE41510EExpiredUtilityPatentIndex 45

Lead frame

Assignee: INFINEON TECHNOLOGIES AGPriority: Feb 1, 2002Filed: Mar 20, 2009Granted: Aug 17, 2010
Est. expiryFeb 1, 2022(expired)· nominal 20-yr term from priority
Inventors:HONG HENG WANYIP TIAN SIANGTAN JOO HONGLEE CHOON MUAHKOH LIANG KNG IAN
H10W 90/756H10W 74/00H10W 72/07554H10W 72/951H10W 72/551H10W 72/547H10W 72/075H10W 40/778H10W 70/421H10W 70/427
45
PatentIndex Score
0
Cited by
13
References
29
Claims

Abstract

A lead frame ( 1 ) has a first portion ( 2 ) adapted to have a semiconductor device ( 10 ) mounted thereon and a second portion ( 3 ) including a main member ( 5 ), a number of first contact members ( 6 ) and a number of second contact members ( 7 ). The first and second contact members ( 6, 7 ) depend from the main member ( 5 ). The second portion ( 3 ) at least partially surrounds the first portion ( 6 ). The first contact members ( 6 ) extend form the main member ( 5 ) in a direction away for the first portion ( 2 ) and the second contact members ( 7 ) extend from the main member ( 5 ) in a direction towards the first portion ( 2 ).

Claims

exact text as granted — not AI-modified
1. A lead frame comprising a first portion adapted to have a semiconductor device mounted thereon and a second portion comprising a main member, a first set of electrical contact members and a second set of electrical contact members, the contact members of the first and second sets extending in directions away from the main member, the second portion at least partially surrounding the first portion, wherein the first set of electrical contact members extend from the main member in a direction away train  from the first portion and the second set of electrical contact members extend from the main member in a direction towards the first portion, and wherein the first set of electrical contact members is electrically isolated from the second set of electrical contact members. 
     
     
       2. A lead frame according to  claim 1 , wherein the ends of the first and second sets of electrical contact members remote from the main member are substantially coplanar. 
     
     
       3. A lead frame according to  claim 1 , wherein the first portion is substantially co-planar with the remote ends of the second set of electrical contact members. 
     
     
       4. A lead frame according to  claim 1 , wherein the first set of electrical contact members are offset along the main member from the second set of electrical contact members. 
     
     
       5. A lead frame according to  claim 1 , wherein the spacing between the first set of electrical contact members adjacent the main member is greater than the width of the second set of electrical contact members adjacent to the main member. 
     
     
       6. A lead frame according to  claim 1 , wherein the spacing between the second set of electrical contact members adjacent to the main member is greater than the width of the first set of electrical contact members adjacent to the main member. 
     
     
       7. A lead frame according to  claim 1 , wherein the second portion further comprises a bond member for each of the first set of electrical contact members. 
     
     
       8. A lead frame according to  claim 7 , wherein the bond members extend from the main member in a direction towards the first portion. 
     
     
       9. A lead frame according to  claim 8 , wherein the bond members are in line with the first set of electrical contact members. 
     
     
       10. A lead frame according to  claim 8 , wherein each of the second set of electrical contact members is separated from its adjacent second set of electrical contact members by a bond member. 
     
     
       11. A semiconductor device package comprising a substrate, a semiconductor device mounted on the substrate and a number of electrical interconnects electrically coupling electrical contacts on the semiconductor device to contact members on the substrate, the semiconductor device and the electrical interconnects being encapsulated in an electrically insulating material, and the contact members comprising a first set of electrical contact members extending from the encapsulation material, and a second set of electrical contact members located on a surface of the encapsulating material, wherein the second set of electrical contact members have a different pitch as compared to the first set of electrical contact members, and wherein the first set of contact members is electrically isolated from the second set of contact members. 
     
     
       12. A semiconductor device package according to  claim 11 , wherein the substrate comprises a lead frame having a first portion having the semiconductor device mounted thereon and a second portion comprising a main member, wherein the electrical contact members of the first and second sets depend from the main member, the second portion at least partially surrounding the first portion, wherein the first set of electrical contact members extend from the main member in a direction away from the first portion and the second set of electrical contact members extend from the main member in a direction towards the first portion. 
     
     
       13. A semiconductor device package according to  claim 11 , wherein the second set of electrical contact members located on the surface of the encapsulating material are substantially co-planar with the ends of the first set of electrical contact members extending from the encapsulating material. 
     
     
       14. A semiconductor device package according to  claim 11 , wherein the second set of electrical contact members are substantially flush with the surface of the encapsulating material. 
     
     
       15. A semiconductor device package according to  claim 11 , wherein the surface of the encapsulating material on which the second set of electrical contact members are located is the surface of the encapsulating material adjacent to the underside of the substrate, which is the side opposite to the side on which the semiconductor device is mounted. 
     
     
       16. A semiconductor device package according to  claim 15 , wherein the underside of the substrate is exposed on the same surface of the encapsulating material on which the second set of electrical contact members are exposed. 
     
     
       17. A semiconductor device package according to  claim 16  wherein the exposed underside at the substrate is substantially co-planar with the second set of electrical contact members. 
     
     
       18. A semiconductor component comprising:
   a die pad adapted to have a semiconductor device mounted thereon;        a first set of electrical contact members, wherein the first set of electrical contact members comprises a first set of gull wing formed electrical contact members; and        a second set of electrical contact members;        wherein the contact members of the first and second sets extend in directions away from a region;        wherein the first set of electrical contact members extends from the region in a direction away from the die pad and the second set of electrical contact members extends from the region in a direction towards the die pad;        wherein ends of the first set of electrical contact members in the direction away from the die pad and ends of the second set of electrical contact members in the direction towards the die pad are substantially coplanar; and        wherein the first set of electrical contact members is electrically isolated from the second set of electrical contact members.     
     
     
       19. The semiconductor component according to  claim 18 , wherein the die pad is substantially coplanar with the ends of the second set of electrical contact members in the direction towards the die pad. 
     
     
       20. The semiconductor component according to  claim 18 , wherein a spacing between the first set of electrical contact members is greater than a width of the second set of electrical contact members. 
     
     
       21. The semiconductor component according to  claim 18 , wherein a spacing between the second set of electrical contact members is greater than a width of the first set of electrical contact members. 
     
     
       22. The semiconductor component according to  claim 18 , further comprising a semiconductor device mounted to the die pad. 
     
     
       23. A semiconductor component comprising:
   a die pad;        a first set of electrical contact members;        a second set of electrical contact members, the contact members of the first and second sets extending in directions away from a region, wherein the first set of electrical contact members extends from the region in a direction away from the die pad and the second set of electrical contact members extends from the region in a direction towards the die pad, and wherein the first set of electrical contact members is electrically isolated from the second set of electrical contact members;        a semiconductor device mounted to the die pad;        a plurality of electrical interconnects electrically coupling electrical contacts on the semiconductor device to contact members of the first set of electrical contact members and to contact members of the second set of electrical contact members; and        an electrically insulating material encapsulating the semiconductor device and the electrical interconnects, wherein ends of the first set of electrical contact members in the direction away from the die pad extend from the encapsulating material, and wherein ends of the second set of electrical contact members in the direction towards the die pad are exposed through a surface of the encapsulating material.     
     
     
       24. The semiconductor component according to  claim 23 , wherein an underside of the die pad and the ends of the second set of electrical contact members in the direction towards the die pad are exposed through the surface of the encapsulating material. 
     
     
       25. The semiconductor component according to  claim 23 , wherein the first set of electrical contact members is essentially gull wing formed. 
     
     
       26. The semiconductor component according to  claim 23 , wherein the ends of the first set of electrical contact members in the direction away from the die pad and the ends of the second set of electrical contact members in the direction towards the die pad are substantially coplanar. 
     
     
       27. The semiconductor component according to  claim 23 , wherein the ends of the second set of electrical contact members in the direction towards the die pad are substantially flush with the surface of the encapsulating material. 
     
     
       28. The semiconductor component according to  claim 23 , wherein an underside of the die pad is exposed on the same surface of the encapsulating material on which the second set of electrical contact members is exposed. 
     
     
       29. The semiconductor component according to  claim 23 , wherein the exposed ends of the second set of electrical contact members are substantially coplanar with the ends of the first set of electrical contact members in the direction away from the die pad.

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