Semiconductor device

Abstract

In the semiconductor device, a control power MOSFET chip 2 is disposed on the input-side plate-like lead 5, and the drain terminal DT 1 is formed on the rear surface of the chip 2, and the source terminal ST 1 and gate terminal GT 1 are formed on the principal surface of the chip 2, and the source terminal ST 1 is connected to the plate-like lead for source 12. Furthermore, a synchronous power MOSFET chip 3 is disposed on the output-side plate-like lead 6, and the drain terminal DT 2 is formed on the rear surface of the chip 3 and the output-side plate-like lead 6 is connected to the drain terminal DT 2. Furthermore, source terminal ST 2 and gate terminal GT 2 are formed on the principal surface of the synchronous power MOSFET chip 3, and the source terminal ST 2 is connected to the plate-like lead for source 13. The plate-like leads for source 12 and 13 are exposed, and therefore, it is possible to increase the heat dissipation capability of the MCM 1.

1. A semiconductor device comprising a first transistor and a second transistor, each of which has an input electrode, first output electrode and second output electrode, wherein
 the current path connecting between said first output electrode and said second output electrode of said first transistor are connected in series to the current path connecting between said first output electrode and said second output electrode of said second transistor;  
 either said first output electrode or said second output electrode of said first transistor is connected to a first conductive member; and  
 the other output electrode of said first transistor is connected to a second conductive member;  
 either said first output electrode or said second output electrode of said second transistor is connected to said second conductive member;  
 the other output electrode of said second transistor is connected to a third conductive member;  
 said first conductive member, said second conductive member and said third conductive member are electrically isolated from one another; and  
 said first conductive member, said second conductive member, said third conductive member, said first transistor and said second transistor are mechanically integrated.  
 
     
     
       2. A semiconductor device according to  claim 1 , wherein said second conductive member has two or more bends. 
     
     
       3. A semiconductor device according to  claim 1 , wherein said second conductive member is a nearly S-shape. 
     
     
       4. A semiconductor device according to  claim 1 , wherein in said second conductive member, the surface to which an output electrode of said first transistor is connected is located on the same side of the surface to which an output electrode of said second transistor is connected. 
     
     
       5. A semiconductor device comprising
 a plurality of semiconductor chips, each of which has a terminal on its principal surface,  
 a conductive plate which has electrical connections to at least two semiconductor chips' terminals among said plurality of semiconductor chips,  
 a sealed body which encapsulates said plurality of semiconductor chips, and  
 a plurality of external connection terminals which have individual electrical connections to the plurality of semiconductor chips, wherein  
 at least two semiconductor chips which are connected by the conductive plate have an individual transistor circuit, and the conductive plate is exposed outside said sealed body.  
 
     
     
       6. A semiconductor device according to  claim 5 , wherein among said plurality of semiconductor chips, each of a first semiconductor chip and a second semiconductor chip has a power-supply transistor circuit; and
 said semiconductor device further comprising  
 a first conductive plate which connects to a drain terminal of said first semiconductor chip,  
 a second conductive plate which connects to a source terminal of said first semiconductor chip,  
 a third conductive plate which connects to a dram terminal of said second semiconductor chip, and  
 a fourth conductive plate which connects to a source terminal of said second semiconductor chip, wherein  
 said second conductive plate has an electrical connection to said third conductive plate, and said second and third conductive plates are at least partially exposed outside said sealed body.  
 
     
     
       7. A semiconductor device according to  claim 6 , wherein said second conductive plate and said third conductor plate are integrated. 
     
     
       8. A semiconductor device according to  claim 5 , wherein
 among said plurality of semiconductor chips,  
 each of a first semiconductor chip and a second semiconductor chip has a power-supply transistor circuit, and a third semiconductor chip has a driver circuit which controls said first and second semiconductor chips.  
 
     
     
       9. A semiconductor device according to  claim 6 , wherein said second and fourth conductive plates are partially exposed on either the principal or rear surface of said sealed body, and said first and third conductive plates are partially exposed on the other surface of said sealed body. 
     
     
       10. A semiconductor device according to  claim 9 , wherein said second conductive plate and said third conductor plate are integrated. 
     
     
       11. A semiconductor device according to  claim 5 , wherein among said plurality of semiconductor chips,
 at least one semiconductor chip is installed upside down in relation to the other semiconductor chips.  
 
     
     
       12. A semiconductor device according to  claim 6 , wherein said second semiconductor chip is installed upside down in relation to said first semiconductor chip,
 said second and third conductive plates are partially exposed on either the principal or rear surface of said sealed body; and  
 said first and fourth conductive plates are partially exposed on the other surface of said sealed body.  
 
     
     
       13. A semiconductor device according to  claim 12 , wherein said second conductive plate and said third conductive plate are integrated. 
     
     
       14. A semiconductor device according to  claim 5 , wherein a heat radiating member is installed in the exposed area of said conductive plate exposed outside said sealed body. 
     
     
       15. A semiconductor device comprising
 a plurality of semiconductor chips, each of which has a terminal on its principal surface,  
 a conductive plate which has electrical connections to at least two semiconductor chips' terminals among said plurality of semiconductor chips,  
 a sealed body which encapsulates said plurality of semiconductor chips by resin,  
 a plurality of external connection terminals which have individual electrical connections to the plurality of semiconductor chips, wherein  
 said conductive plate is exposed outside said sealed body, and  
 the connecting portion of said conductive plate at which said conductive plate is connected to one semiconductor chip is joined to the connecting portion at which said conductive plate is connected to the other semiconductor chip, on either the principal or rear surface of said sealed body, or on the outside of said semiconductor chips inside said sealed body.  
 
     
     
       16. A semiconductor device according to  claim 15 , wherein among said plurality of semiconductor chips,
 each of a first semiconductor chip and a second semiconductor chip has a power-supply transistor circuit, and a third semiconductor chip has a driver circuit which controls said first and second semiconductor chips.  
 
     
     
       17. A semiconductor device according to  claim 15 , wherein a heat radiating member is installed in the exposed area of said conductive plate exposed outside said sealed body. 
     
     
       18. A semiconductor device according to  claim 15 , wherein said conductive plate has an electrical connection to the semiconductor chip via a plurality of gold bumps. 
     
     
       19. A semiconductor device according to  claim 16 , wherein the terminal of said first semiconductor chip has an electrical connection to the terminal of said third semiconductor chip by said conductive plate, and the terminal of said second semiconductor chip has an electrical connection to the terminal of said third semiconductor chip by another conductive plate. 
     
     
       20. A semiconductor device comprising
 a plurality of semiconductor chips, each of which has a terminal on its principal surface,  
 a conductive plate which has electrical connections to at least two semiconductor chips' terminals among said plurality of semiconductor chips,  
 a sealed body which encapsulates said plurality of semiconductor chips by resin,  
 a plurality of external connection terminals which have individual electrical connections to said plurality of semiconductor chips and are disposed on the peripheral edge of the rear surface of said sealed body, wherein  
 said conductive plate is exposed on the at least either principal or rear surface of said sealed body.  
 
     
     
       21. A semiconductor device according to  claim 20 , wherein among said plurality of semiconductor chips,
 each of a first semiconductor chip and a second semiconductor chip has a power-supply transistor circuit, and  
 a third semiconductor chip has a driver circuit which controls said first and second semiconductor chips.  
 
     
     
       22. A semiconductor device according to  claim 20 , wherein a heat radiating member is installed in the exposed area of said conductive plate exposed outside said sealed body. 
     
     
       23. A semiconductor device according to  claim 20 , wherein
 said conductive plate has an electrical connection to the semiconductor chip via a plurality of gold bumps.  
 
     
     
       24. A semiconductor device according to  claim 20 , wherein
 among said plurality of semiconductor chips,  
 each of a first semiconductor chip and a second semiconductor chip has a power-supply transistor circuit, and  
 said second semiconductor chip is installed upside down compared to said first semiconductor chip; and  
 said semiconductor device further comprising  
 a first conductive plate which connects to a drain terminal of said first semiconductor chip,  
 a second conductive plate which connects to a source terminal of said first semiconductor chip,  
 a third conductive plate which connects to a drain terminal of said second semiconductor chip, and  
 a fourth conductive plate which connects to a source terminal of said second semiconductor chip, wherein  
 said second and third conductive plates are partially exposed on either the principal or rear surface of said sealed body, aid said first and fourth conductive plates are partially exposed on the other surface of said sealed body.  
 
     
     
       25. A semiconductor device formed in a single package, the semiconductor device comprising:
   a first external terminal;        a second external terminal;        a third external terminal;        a first semiconductor chip formed above the first external terminal;        a second semiconductor chip formed above the second external terminal; and        a source terminal and a first terminal formed on a main surface of the first semiconductor chip;        a drain terminal formed on a rear surface of the first semiconductor chip;        a drain terminal formed on a main surface of the second semiconductor chip;        a source terminal formed on a rear surface of the second semiconductor chip;        a conductor member formed above the source terminal of the first semiconductor chip, and above the drain terminal of the second semiconductor chip and the third external terminal;        wherein the conductor member is electrically connected with the source terminal of the first semiconductor chip, the drain terminal of the second semiconductor chip and the third external terminal;        a wire is connected with the first terminal of the first semiconductor chip;        the first, second and third external terminals are formed on the rear surface of the package;        the first external terminal is electrically connected with the drain terminal of the first semiconductor chip; and        the second external terminal is the source terminal of the second semiconductor chip.     
     
     
       26. The semiconductor device according to  claim 25 , wherein a sectional area of the conductor member is larger than that of the wire. 
     
     
       27. The semiconductor device according to  claim 25 , wherein the first terminal of the first semiconductor chip comprises a gate terminal of the first semiconductor chip. 
     
     
       28. The semiconductor device according to  claim 27 , which further comprises a driver chip for controlling the first and second semiconductor chips, wherein the first terminal of the first semiconductor chip is electrically connected with the driver chip. 
     
     
       29. The semiconductor device according to  claim 25 , wherein the first terminal of the first semiconductor chip is the source terminal formed in an area where the first terminal is not connected with the conductor member. 
     
     
       30. The semiconductor device according to  claim 25 , which further comprises a driver chip for controlling the first and second semiconductor chips, wherein the first terminal of the first semiconductor chip is the source terminal formed in an area where the first terminal is not connected with the conductor member, and the wire for electrically connecting the first terminal of the first semiconductor chip to the drive chip is connected with an area which is not connected with the conductor member. 
     
     
       31. The semiconductor device according to  claim 25 , wherein the first terminal of the first semiconductor chip comprises a gate terminal of the first semiconductor chip; and another wire is connected with an area with which the source terminal of the first semiconductor chip and the conductor member are not connected. 
     
     
       32. The semiconductor device according to  claim 31 , which further comprises a driver chip for controlling the first and second semiconductor chips, wherein the first terminal of the first semiconductor chip is electrically connected with the driver chip and the another wire is electrically connected with the driver chip. 
     
     
       33. The semiconductor device according to  claim 25 , which further comprises a driver for controlling the first and second semiconductor chips, wherein a gate terminal is formed on the rear surface of the second semiconductor chip, and the gate terminal of the second semiconductor chip is electrically connected with the driver chip. 
     
     
       34. The semiconductor device according to  claim 25 , which further comprises a driver chip for controlling the first and second semiconductor chips, wherein the first terminal of the first semiconductor chip is electrically connected with the driver chip. 
     
     
       35. The semiconductor device according to  claim 25 , wherein the semiconductor device is adapted for use in a DC/DC converter. 
     
     
       36. The semiconductor device according to  claim 25 , wherein the first and second semiconductor chips are power transistors. 
     
     
       37. A semiconductor device formed in a single package comprising:
   a first semiconductor chip;        a second semiconductor chip;        a source terminal and a first terminal formed on a main surface of the first semiconductor chip;        a drain terminal formed on a rear surface of the first semiconductor chip;        a drain terminal formed on a main surface of the second semiconductor chip;        a source terminal formed on a rear surface of the second semiconductor chip;        a conductive member formed above one of the source terminal of the first semiconductor chip and the drain terminal of the second semiconductor chip; and        the conductive member is electrically connected with the source terminal of the first semiconductor chip and the drain terminal of the second semiconductor chip, and        a wire is connected with the first terminal of the first semiconductor surface.     
     
     
       38. A semiconductor device formed in a single package comprising:
   a first semiconductor chip;        a second semiconductor chip;        a driver chip for controlling the first and second semiconductor chips;        a source terminal formed on a main surface of the first semiconductor chip;        a drain terminal formed on a rear surface of the first semiconductor chip;        a drain terminal formed on a main surface of the second semiconductor chip;        a source terminal formed on a rear surface of the second semiconductor chip;        a conductor member formed above the source terminal of the first semiconductor chip and the drain terminal of the second semiconductor chip;        wherein the conductor member is electrically connected with the source terminal of the first semiconductor chip and the drain terminal of the second semiconductor chip; and        a wire for electrically connecting the driver chip with the source terminal for the first semiconductor chip.     
     
     
       39. The semiconductor device according to  claim 38 , wherein the wire is connected to a source area with which the conductor member of the first semiconductor chip is not connected. 
     
     
       40. A semiconductor device formed in a single package comprising:
   a first semiconductor chip;        a second semiconductor chip;        a driver chip for controlling the first and second semiconductor chips;        a source terminal formed on a main surface of the first semiconductor chip;        a drain terminal formed on a rear surface of the first semiconductor chip;        a drain terminal formed on a main surface of the second semiconductor chip;        a source terminal formed on a rear surface of the second semiconductor chip;        a conductive member formed above one of the second terminal of the first semiconductor chip and the drain terminal of the second semiconductor chip;        wherein the conductor member is electrically connected with the source terminal of the first semiconductor chip and the drain terminal of the second semiconductor chip, and the driver chip has a terminal for connecting the source terminal of the first semiconductor chip.     
     
     
       41. The semiconductor device according to  claim 40 , wherein a wire for electrically connecting the gate terminal with the driver chip is connected to a source terminal area with which the conductor member is not connected. 
     
     
       42. The semiconductor device according to  claim 40 , wherein the gate terminal is connected to the main surface of the first semiconductor chip, and the gate terminal is electrically connected with the wire. 
     
     
       43. The semiconductor device according to  claim 40 , wherein the gate terminal is formed on the rear surface of the second semiconductor chip, and the gate terminal of the second semiconductor chip is electrically connected with the terminal of the driver chip. 
     
     
       44. The semiconductor device according to  claim 40 , wherein a sectional area of the conductor member is larger than that of the wire. 
     
     
       45. A semiconductor device formed in a single package, the semiconductor device comprising:
   a first external terminal;        a second external terminal;        a third external terminal;        a first semiconductor chip formed above the first external terminal;        a second semiconductor chip formed above the second external terminal; and        a driver chip for controlling the first and second semiconductor chips; wherein        a source terminal is formed on a main surface of the first semiconductor chip;        a drain terminal is formed on a rear surface of the first semiconductor chip;        a drain terminal is formed on a main surface of the second semiconductor chip;        a source terminal and gate terminal are formed on a rear surface of the second semiconductor chip;        a single conductive member is formed above the source terminal of the first semiconductor chip, the drain terminal of the second semiconductor chip, and the third external terminal;        the conductive member is electrically connected to the source terminal of the first semiconductor chip, the drain terminal of the second semiconductor chip, and the third external terminal of the first semiconductor;        the first terminal is formed on the main surface of the driver chip;        a wire is electrically connected with the first terminal of the driver chip and with the gate terminal of the second semiconductor chip;        the first, second, and third external terminals are formed on the rear surface of the package;        the first external terminal is electrically connected with the drain terminal of the first semiconductor chip; and        the second external terminal is electrically connected with the source terminal of the second semiconductor chip.     
     
     
       46. The semiconductor device according to  claim 25 , wherein the gate terminal is formed on the main surface of the first semiconductor chip;
   the second terminal is formed on the driver chip; and        the wire is electrically connected with the second terminal of the driver chip and the gate terminal of the first semiconductor chip.     
     
     
       47. The semiconductor device according to  claim 45 , wherein the gate terminal is formed on the main surface of the first semiconductor chip;
   the second terminal is formed on the driver chip; and        the wire is electrically connected with the second terminal of the driver chip and the gate terminal of the first semiconductor chip.