Jack including crosstalk compensation for printed circuit board

Abstract

A forward-reverse crosstalk compensation method is provided for compensating capacitance/inductance on a printed circuit board of a connector. The method includes a forward compensation process and a reverse compensation process. The forward compensation process compensates the unbalanced capacitance in the plug of the connector by using the parallel conductive lines or wires. The reverse compensation process can be used to compensate the unbalance capacitance/inductance caused by the forward compensations in the same pair combination of the connector. In both forward compensation and reverse compensation processes, electro-magnetic fields, such as capacitors, can be formed to balance the capacitance/inductance on the printed circuit board of the connector.

1. A method of compensating cross-talk in a connector arrangement which includes a plug and a circuit board, comprising:
 forward compensating unbalanced capacitance in the plug; and   reverse compensating unbalanced capacitance and inductance caused by the forward compensation.   
     
     
       2. The method of  claim 1 , wherein the forward compensating includes forming a capacitor by using additional parallel conductive lines on the circuit board, and the reverse compensating includes forming a capacitor by using additional parallel lines on the circuit board. 
     
     
       3. A connector arrangement for compensating cross-talk, comprising:
 a circuit board with front and rear terminals;   a plurality of pairs of conductors disposed on the circuit board, the pairs of conductors connecting to respective front and rear terminals, each pair of conductors including a ring conductor and a tip conductor, and the ring and tip conductors being substantially disposed in parallel;   a forward-compensating capacitance for compensating unbalanced capacitance, proximate the front terminals; and   a reverse-compensating capacitance for compensating unbalanced capacitance and inductance caused by the forward-compensating capacitance, proximate the rear terminals.   
     
     
       4. The connector arrangement of  claim 3 , wherein the forward-compensating capacitance is formed by using additional parallel conductors on the circuit board, and the reverse-compensating capacitance is formed by using additional parallel conductors on the circuit board. 
     
     
       5. The connector arrangement of  claim 3 , wherein the front terminals include contact springs. 
     
     
       6. The connector arrangement of  claim 3 , wherein the rear terminals include insulation displacement connectors. 
     
     
       7. The connector arrangement of  claim 3 , further comprising a housing holding the circuit board, the housing defining a plug port for receipt of a plug of a telecommunications cable. 
     
     
       8. The connector arrangement of  claim 3 , wherein the plurality of pairs of conductors are disposed on one side of the circuit board. 
     
     
       9. A method of compensating cross-talk in a connector arrangement which includes a plug and a multi-layered circuit board with first and second sets of terminals, comprising:
 forward compensating unbalanced capacitance in the plug; and   reverse compensating unbalanced capacitance and inductance caused by the forward compensation,   wherein the connector arrangement includes:
 i) a first and a second pair of conductors on the circuit board, wherein each of the conductors interconnects respective terminals from the first and second sets of terminals, and wherein at least one pair has both conductors on the same layer of the multi-layered circuit board; 
 ii) first and second capacitors, wherein the first capacitor is formed between a first conductor of the first conductor pair and a second conductor of the second pair, and wherein the second capacitor is formed between a second conductor of the first pair and a first conductor of the second pair; and 
 iii) third and fourth capacitors, wherein the third capacitor is formed between the first conductor of the first pair and the first conductor of the second pair, and wherein the fourth capacitor is formed between the second conductor of the first pair and the second conductor of the second pair. 
   
     
     
       10. The method of claim 9, wherein the forward compensating includes forming a capacitor by using additional parallel conductive lines on the circuit board, and the reverse compensating includes forming a capacitor by using additional parallel lines on the circuit board. 
     
     
       11. The method of claim 9, wherein the first set of terminals is positioned on a front portion of the circuit board and the second set of terminals are positioned on a rear portion of the circuit board. 
     
     
       12. The method of claim 9, wherein the arrangement includes contact springs connected to the first set of terminals. 
     
     
       13. The method of claim 9, wherein the arrangement includes insulation displacement connectors connected to the second set of terminals. 
     
     
       14. The method of claim 9, wherein the conductors of each pair are substantially disposed in parallel. 
     
     
       15. The method of claim 9, wherein the first pair is the 3-6 conductor pair, and wherein the second pair is the 4-5 conductor pair. 
     
     
       16. The method of claim 9, wherein the first and second capacitors are located proximate the first set of terminals, and wherein the third and fourth capacitors are located proximate the second set of terminals. 
     
     
       17. The method of claim 9, wherein the multi-layered circuit board has four layers. 
     
     
       18. The method of claim 9, wherein the second set of terminals are arranged in pairs, each pair of terminals from the second set of terminals connected to one of said conductor pairs. 
     
     
       19. The method of claim 9, wherein the second set of terminals is arranged in two groups along opposite edges of the circuit board. 
     
     
       20. The method of claim 19, wherein the conductors of the at least one pair are substantially parallel. 
     
     
       21. The method of claim 19, wherein the terminals from at least one of the groups are unevenly spaced. 
     
     
       22. The method of claim 9, wherein at least one of the first, second, third and fourth capacitors is located on the same layer as the at least one pair of conductors. 
     
     
       23. The method of claim 22, wherein the at least one of the first, second, third and fourth capacitors is formed by using additional parallel conductive traces on the circuit board.