Electro-optical module

Abstract

The electro-optical module has a substrate with a mounting surface that is free from depressions. A surface-mounted component unit is disosed on the mounting surface. The component unit contains as integral components an electro-optical component and a lens which are aligned directly with one another. The surface serves, furthermore, as a reference plane for assembling a receptacle for an optical fiber plug.

We claim: 
     
       1. An electro-optical module, comprising:
 a substrate formed with a mounting surface;   a receptacle for an optical fiber plug defining a beam path substantially perpendicular to said mounting surface; and   an integrated component unit mounted on said mounting surface, said component unit comprising an electro-optical component and a lens directly aligned with one another in the beam path between said electro-optical component and said receptacle.   
     
     
       2. The electro-optical module according to claim  1  7, wherein said mounting surface is substantially free from aligning structures. 
     
     
       3. The electro-optical module according to claim  1  7, wherein the receptacle is disposed so as not to touch said component unit, said receptacle making contact with and being connected substantially only to said mounting surface of said substrate. 
     
     
       4. The electro-optical module according to claim  1  7, wherein said substrate has a second surface on a side thereof averted from said receptacle, and including an electronic circuit carried on said second surface. 
     
     
       5. The electro-optical module according to claim  1  7, which further comprises a cap attached directly to said mounting surface of said substrate for electrically shielding said component unit. 
     
     
       6. The A rigid-flexible-rigid circuit carrier comprising:
 the electro-optical module according to claim  1  7, wherein said substrate forms a part of a rigid-flexible-rigid circuit carrier first rigid part; 
 a flexible part comprising flexible conductors connected to the substrate; and 
 a second rigid part comprising a printed circuit board. 
 
     
     
       7. An electro-optical module, comprising:
 a substrate formed with a mounting surface;   a receptacle for an optical fiber plug defining a beam path substantially perpendicular to said mounting surface; and   an integrated component unit mounted on said mounting surface, said integrated component unit comprising:
 a solid body defining at least first and second surfaces; 
 an electro-optical component mounted on the first surface; and 
 a lens formed on the second surface, wherein the lens and the electro-optical component are directly aligned with one another in the beam path between said electro-optical component and said receptacle, 
 wherein said first surface is opposite said second surface. 
   
     
     
       8. The electro-optical module according to claim 7, wherein said first surface is substantially parallel to said second surface. 
     
     
       9. The electro-optical module according to claim 7, wherein said first surface is substantially parallel to said mounting surface. 
     
     
       10. The electro-optical module according to claim 7, wherein said electro-optical component is embedded in a filling compound. 
     
     
       11. The electro-optical module according to claim 10, further comprising a bond wire partially embedded in said filling compound, said bond wire forming at least a portion of an electrical connection between said electro-optical component and said substrate. 
     
     
       12. An electro-optical module, comprising:
 a substrate formed with a mounting surface;   a receptacle for an optical fiber plug defining a beam path substantially perpendicular to said mounting surface; and   an integrated component unit mounted on said mounting surface, said integrated component unit comprising:
 a solid body defining at least first and second surfaces; 
 an electro-optical component mounted on the first surface; and 
 a focusing lens formed on the second surface, wherein the lens and the electro-optical component are directly aligned with one another in the beam path between said electro-optical component and said receptacle. 
   
     
     
       13. The electro-optical module according to claim 12, wherein the solid body further defines a depression on the first surface in which the electro-optical component is mounted. 
     
     
       14. The electro-optical module according to claim 12, wherein the receptacle includes a partition and wherein, upon insertion of the optical fiber plug, the partition is disposed between an end face of the optical fiber plug and the lens. 
     
     
       15. An electro-optical module, comprising:
 a substrate formed with a mounting surface;   a receptacle for an optical fiber plug defining a beam path substantially perpendicular to said mounting surface; and   an integrated component unit mounted on said mounting surface, said integrated component unit comprising:
 a lens component on which a lens is formed; 
 an electro-optical component directly aligned with the lens in the beam path between said electro-optical component and said receptacle; and 
 a first metallization extending over a portion of the lens component and connected in an electrically conducting fashion to the electro-optical component and to a first corresponding connector pad on the mounting surface of the substrate. 
   
     
     
       16. The electro-optical module according to claim 15, wherein the first metallization is electrically connected to an underside of the electro-optical component facing the lens. 
     
     
       17. The electro-optical module according to claim 15, wherein said integrated component unit further comprises a second metallization extending over a portion of the lens component and connected in an electrically conducting fashion to the electro-optical component and to a second corresponding connector pad on the mounting surface of the substrate. 
     
     
       18. The electro-optical module according to claim 17, wherein the second metallization is electrically connected to the electro-optical component via a bond wire.