Jack including crosstalk compensation for printed circuit board

Abstract

A forward-reverse crosstalk compensation method is provided for compensating capacitance/inductance on a printed circuit board of a connector. The method includes a forward compensation process and a reverse compensation process. The forward compensation process compensates the unbalanced capacitance in the plug of the connector by using the parallel conductive lines or wires. The reverse compensation process can be used to compensate the unbalance capacitance/inductance caused by the forward compensations in the same pair combination of the connector. In both forward compensation and reverse compensation processes, electro-magnetic fields, such as capacitors, can be formed to balance the capacitance/inductance on the printed circuit board of the connector.

What is claimed is: 
     
       1. A method of compensating cross-talk in a connector arrangement which includes a plug and a circuit board, comprising:
 forward compensating unbalanced capacitance in the plug; and   reverse compensating unbalanced capacitance and inductance caused by the forward compensation.   
     
     
       2. The method of  claim 1 , wherein the forward compensating includes forming a capacitor by using additional parallel conductive lines on the circuit board, and the reverse compensating includes forming a capacitor by using additional parallel lines on the circuit board. 
     
     
       3. A connector arrangement for compensating cross-talk, comprising:
 a circuit board with front and rear terminals;   a plurality of pairs of conductors disposed on the circuit board, the pairs of conductors connecting to respective front and rear terminals, each pair of conductors including a ring conductor and a tip conductor, and the ring and tip conductors being substantially disposed in parallel;   a forward-compensating capacitance for compensating unbalanced capacitance, proximate the front terminals; and   a reverse-compensating capacitance for compensating unbalanced capacitance and inductance caused by the forward-compensating capacitance, proximate the rear terminals.   
     
     
       4. The connector arrangement of  claim 3 , wherein the forward-compensating capacitance is formed by using additional parallel conductors on the circuit board, and the reverse-compensating capacitance is formed by using additional parallel conductors on the circuit board. 
     
     
       5. The connector arrangement of  claim 3 , wherein the front terminals include contact springs. 
     
     
       6. The connector arrangement of  claim 3 , wherein the rear terminals include insulation displacement connectors. 
     
     
       7. The connector arrangement of  claim 3 , further comprising a housing holding the circuit board, the housing defining a plug port for receipt of a plug of a telecommunications cable. 
     
     
       8. The connector arrangement of  claim 3 , wherein the plurality of pairs of conductors are disposed on one side of the circuit board. 
     
     
       9. A method of compensating cross-talk in a connector arrangement which includes a plug and a circuit board with first and second sets of terminals, comprising:
 forward compensating unbalanced capacitance in the plug; and   reverse compensating unbalanced capacitance and inductance caused by the forward compensation,   wherein the connector arrangement includes a first and a second pair of conductors, each of the pairs including a ring conductor and a tip conductor, wherein each conductor includes at least a contact spring and a circuit board conductive path, wherein each circuit board conductive path includes a portion that interconnects respective terminals from the first and second sets of terminals,   wherein the forward compensating includes applying a first compensation coupling between a first conductor of the first conductor pair and a second conductor of the second conductor pair, and applying a second compensation coupling between a second conductor of the first conductor pair and a first conductor of the second conductor pair,   wherein the reverse compensating includes applying a third compensation coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair,   wherein at least one of the forward compensating and the reverse compensating uses a combination of a capacitor and an inductor.   
     
     
       10. The method of claim 9, wherein each of the first compensation coupling, second compensation coupling and third compensation coupling is implemented on the circuit board. 
     
     
       11. The method of claim 9, wherein each of the contact springs is connected to one of the terminals in the first set of terminals. 
     
     
       12. The method of claim 9, wherein the arrangement includes insulation displacement connectors connected to the second set of terminals. 
     
     
       13. The method of claim 9, wherein the interconnecting portions of the circuit board conductive paths for each of the pairs of conductors are substantially disposed in parallel. 
     
     
       14. The method of claim 9, wherein the inductor is formed on the circuit board. 
     
     
       15. The method of claim 9, wherein at least one of the first, second and third compensation couplings is located on a portion of the connector separate from the circuit board. 
     
     
       16. The method of claim 9, wherein the first, second and third compensation couplings are located on a portion of the connector separate from the circuit board. 
     
     
       17. The method of claim 9, wherein the reverse compensating further includes applying a fourth compensation coupling between the second conductor of the first conductor pair and the second conductor of the second conductor pair. 
     
     
       18. The method of claim 17, wherein the connector arrangement includes a fourth capacitor that provides the fourth compensation coupling. 
     
     
       19. The method of claim 9, wherein the connector arrangement includes a first capacitor that provides at least a portion of the first compensation coupling, a second capacitor that provides at least a portion of the second compensation coupling, and a third capacitor that provides at least a portion of the third compensation coupling. 
     
     
       20. The method of claim 19, wherein the first and second capacitors are located proximate the first set of terminals, and wherein the third capacitor is located proximate the second set of terminals. 
     
     
       21. The method of claim 19, wherein the circuit board is a multi-layered printed circuit board, and wherein at least one of the first, second, and third capacitors is located on the same layer as the interconnecting portions of the circuit board conductive paths for at least one of the pairs of conductors. 
     
     
       22. A method of compensating cross-talk in a connector arrangement which includes a plug and a multi-layered circuit board with first and second sets of terminals, comprising:
 forward compensating unbalanced capacitance in the plug; and   reverse compensating unbalanced capacitance and inductance caused by the forward compensation,   wherein the connector arrangement includes a first and a second pair of conductors, each of the pairs including a ring conductor and a tip conductor, wherein each conductor includes at least a contact spring portion and a circuit board trace portion that interconnects a terminal from the first set and a terminal from the second set, wherein the circuit board trace portions of at least one of the pairs are disposed in parallel along a majority of their lengths and are disposed on the same layer of the multi-layered circuit board,   wherein the forward compensating includes applying a first capacitive coupling between a first conductor of the first conductor pair and a second conductor of the second conductor pair, and applying a second capacitive coupling between a second conductor of the first conductor pair and a first conductor of the second conductor pair, and   wherein the reverse compensating includes applying a third capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair.   
     
     
       23. The method of claim 22, wherein each of the first capacitive coupling, second capacitive coupling and third capacitive coupling is formed on the circuit board. 
     
     
       24. The method of claim 22, wherein the circuit board trace portions of each of the first and second pairs of conductors are substantially disposed in parallel. 
     
     
       25. The method of claim 22, wherein the first pair is the 3-6 conductor pair, and wherein the second pair is the 4-5 conductor pair. 
     
     
       26. The method of claim 22, wherein the connector arrangement includes an inductor that provides at least part of the forward or reverse compensating. 
     
     
       27. The method of claim 22, wherein at least one of the first, second and third capacitive couplings is located on a portion of the connector separate from the circuit board. 
     
     
       28. The method of claim 22, wherein the first, second and third capacitive couplings are located on a portion of the connector separate from the circuit board. 
     
     
       29. The method of claim 22, wherein the reverse compensating further includes applying a fourth capacitive coupling between the second conductor of the first conductor pair and the second conductor of the second conductor pair. 
     
     
       30. The method of claim 29, wherein the connector arrangement includes a fourth capacitor that provides the fourth capacitive coupling. 
     
     
       31. The method of claim 22, wherein the connector arrangement includes a first capacitor that provides the first capacitive coupling, a second capacitor that provides the second capacitive coupling, and a third capacitor that provides the third capacitive coupling. 
     
     
       32. The method of claim 31, wherein at least one of the first, second or third capacitors is disposed on the same layer of the circuit board as the circuit board trace portions for at least one pair of the conductors. 
     
     
       33. The method of claim 31, wherein the first, second and third capacitors are formed on the circuit board. 
     
     
       34. The method of claim 33, wherein the first and second capacitors are located proximate the first set of terminals, and wherein the third capacitor is located proximate the second set of terminals. 
     
     
       35. The method of claim 34, wherein at least one of the first, second, and third capacitors is located on the same layer of the circuit board as the at least one pair of the circuit board trace portions.