USRE45390EExpiredUtility

Integrated transceiver with lightpipe coupler

Assignee: LUXTERA INCPriority: Jan 14, 2004Filed: Feb 22, 2013Granted: Feb 24, 2015

Est. expiryJan 14, 2024(expired)· nominal 20-yr term from priority

Inventors:Peter De Dobbelaere Thierry Pinguet Mark Peterson Mark Harrison Alexander G. Dickinson Lawrence C. Gunn, Iii

G02B 6/3885G02B 6/4214G02B 6/12004G02B 6/4246G02B 6/4295H04B 10/40G02B 2006/12121G02B 6/12019G02B 6/43B82Y 20/00H04B 10/25G02B 6/1225

PatentIndex Score

Cited by

References

Claims

Abstract

A transceiver comprising a CMOS chip and a laser coupled to the chip may be operable to communicate an optical source signal from a semiconductor laser into the CMOS chip. The optical source signal may be used to generate first optical signals that are transmitted from the CMOS chip to optical fibers coupled to the CMOS chip. Second optical signals may be received from the optical fibers and converted to electrical signals via photodetectors in the CMOS chip. The optical source signal may be communicated from the semiconductor laser into the CMOS chip via optical fibers in to a top surface and the first optical signals may be communicated out of a top surface of the CMOS chip. The optical source signal may be communicated into the CMOS chip and the first optical signals may be communicated from the CMOS chip via optical couplers, which may comprise grating couplers.

Claims

exact text as granted — not AI-modified

The invention claimed is:

1. A communication system comprising:
a transceiver comprising a CMOS chip and a semiconductor laser coupled with said CMOS chip;
wherein said semiconductor laser communicates an optical source signal into said CMOS chip, said optical source signal for generating first optical signals that are transmitted from said CMOS chip to optical fibers coupled to said CMOS chip; and
wherein second optical signals are received from optical fibers and converted to electrical signals for use by said CMOS chip.

2. The communication system according to claim 1 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.

3. The communication system according to claim 1 , wherein said CMOS chip comprises optical devices, and said optoelectronic devices comprise modulators and optical switches.

4. The communication system according to claim 1 , wherein said transceiver is operable to convert said second optical signals to electrical signals utilizing one or more photodetectors of said CMOS chip.

5. The communication system according to claim 4 , wherein said one or more photodetectors are integrated in said CMOS chip.

6. The communication system according to claim 4 , wherein said one or more photodetectors are mounted on said CMOS chip.

7. The communication system according to claim 1 , wherein semiconductor laser is mounted on said CMOS chip.

8. The communication system according to claim 1 , wherein said transceiver is operable to communicate said optical source signal from said semiconductor laser into said CMOS chip via one or more optical fibers.

9. The communication system according to claim 1 , wherein said transceiver is operable to communicate said optical source signal into a top surface of said CMOS chip.

10. The communication system according to claim 1 , wherein said transceiver is operable to communicate said first optical signals out of a top surface of said CMOS chip.

11. The communication system according to claim 1 , wherein said transceiver is operable to communicate said optical source signal into said CMOS chip via one or more optical couplers.

12. The communication system according to claim 11 , wherein said one or more optical couplers comprise grating couplers.

13. The communication system according to claim 1 , wherein said transceiver is operable to communicate said first optical signals from said CMOS chip via one or more optical couplers.

14. The communication system according to claim 13 , wherein said one or more optical couplers comprise grating couplers.

15. A method for communicating signals, the method comprising:
in a transceiver comprising a CMOS chip and a semiconductor laser coupled to said CMOS chip:
communicating an optical source signal from said semiconductor laser into said CMOS chip;
generating using said optical source signal, first optical signals;
transmitting said first optical signals from said CMOS chip to optical fibers coupled to said CMOS chip;
receiving second optical signals from optical fibers; and
converting said second optical signals to electrical signals for use by said CMOS chip.

16. The method according to claim 15 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.

17. The method according to claim 15 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators and optical switches.

18. The method according to claim 15 , comprising converting said second optical signals to electrical signals via one or more photodetectors.

19. The method according to claim 15 , wherein said one or more photodetectors are integrated in said CMOS chip.

20. The method according to claim 15 , wherein said one or more photodetectors are mounted on said CMOS chip.

21. The method according to claim 15 , wherein semiconductor laser is mounted on said CMOS chip.

22. The method according to claim 15 , comprising communicating said optical source signal from said semiconductor laser into said CMOS chip via one or more optical fibers.

23. The method according to claim 15 , comprising communicating said optical source signal into a top surface of said CMOS chip.

24. The method according to claim 15 , comprising communicating said first optical signals out of a top surface of said CMOS chip.

25. The method according to claim 15 , comprising communicating said optical source signal into said CMOS chip via one or more optical couplers.

26. The method according to claim 25 , wherein said one or more optical couplers comprise grating couplers.

27. The method according to claim 15 , comprising communicating said first optical signals from said CMOS chip via one or more optical couplers.

28. The method according to claim 25 , wherein said one or more optical couplers comprise grating couplers.

29. A communication system comprising a CMOS chip, and a semiconductor laser coupled with said CMOS chip;
wherein said semiconductor laser communicates an optical source signal into said CMOS chip, said optical source signal for generation of first optical signals that are transmitted from said CMOS chip to optical fibers coupled to said CMOS chip; and
wherein second optical signals are received from said optical fibers and converted to electrical signals for use by said CMOS chip.

30. The system of claim 29 , wherein said first optical signals are communicated out of, and said optical source signal and said second optical signals are communicated into, a top surface of said CMOS chip.

31. The system according to claim 29 , wherein said CMOS chip is operable to convert said second optical signals to electrical signals via one or more photodetectors of said first CMOS chip.

32. The system according to claim 31 , wherein said one or more photodetectors are integrated in said CMOS chip.

33. The system according to claim 31 , wherein said one or more photodetectors are mounted on said CMOS chip.

34. The system according to claim 29 , wherein said semiconductor laser is operable to communicate said source optical signal into said CMOS chip via grating couplers integrated in said CMOS chip.

35. The system according to claim 29 , wherein said CMOS chip is operable to transmit said first optical signals from said CMOS chip via grating couplers integrated in said CMOS chip.

36. A system for two-way communication of optical signals comprising:
a CMOS chip and a semiconductor laser; wherein:
an optical source signal is communicated into said CMOS chip utilizing said semiconductor laser;
optical signals representative of electronic signals received from the electronic circuitry of said CMOS chip are communicated from said CMOS chip over one or more optical fibers coupled to a top surface of said CMOS chip; and
electronic signals representative of optical signals received over one or more optical fibers coupled to said top surface of said CMOS chip are communicated to electronic circuitry of said CMOS chip.

37. The communication system according to claim 36 , wherein said CMOS chip comprises optical devices, and said optical devices comprise waveguides and couplers.

38. The communication system according to claim 36 , wherein said CMOS chip comprises optoelectronic devices, and said optoelectronic devices comprise modulators and optical switches.

39. The communication system according to claim 36 , wherein said CMOS chip is operable to generate said electronic signals representative of received optical signals utilizing one or more photodetectors.

40. The communication system according to claim 39 , wherein said one or more photodetectors are integrated in said CMOS chip.

41. The communication system according to claim 39 , wherein said one or more photodetectors are mounted on said CMOS chip.

42. The communication system according to claim 36 , wherein semiconductor laser is mounted on said CMOS chip.

43. The communication system according to claim 36 , wherein said optical source signal is communicated from said semiconductor laser into said CMOS chip via one or more optical fibers.

44. The communication system according to claim 36 , wherein said optical source signal is communicated into a top surface of said CMOS chip.

45. The communication system according to claim 36 , wherein said first optical signals are communicated out of a top surface of said CMOS chip.

46. The communication system according to claim 36 , wherein said optical source signal is communicated into said CMOS chip via one or more optical couplers.

47. The communication system according to claim 46 , wherein said one or more optical couplers comprise grating couplers.

48. The communication system according to claim 36 , wherein said first optical signals are communicated from said CMOS chip via one or more optical couplers.

49. The communication system according to claim 48 , wherein said one or more optical couplers comprise grating couplers.

50. A method for communicating signals, the method comprising:
in a transceiver comprising a CMOS chip and a semiconductor laser coupled with said CMOS chip:
communicating an optical source signal into said CMOS chip utilizing said semiconductor laser;
generating first optical signals in said CMOS chip based on said optical source signal;
transmitting said first optical signals from said CMOS chip to optical fibers coupled to said CMOS chip; and
receiving second optical signals from optical fibers and converting said second optical signals to electrical signals for use by said CMOS chip.

51. The method according to claim 50 , comprising communicating said optical source signal and receiving said second optical signals into, and transmitting said first optical signals out of, a top surface of said CMOS chip.

52. The method according to claim 50 , comprising converting said second optical signals to electrical signals utilizing one or more photodetectors.

53. The method according to claim 52 , wherein said one or more photodetectors are integrated in said CMOS chip.

54. The method according to claim 52 , wherein said one or more photodetectors are mounted on said CMOS chip.

55. The method according to claim 50 , wherein said CMOS chip comprises optical and electronic devices.

56. The method according to claim 50 , comprising communicating said optical source signal into said CMOS chip via grating couplers.

57. The method according to claim 50 , comprising transmitting said first optical signals from said CMOS chip via grating couplers.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.