System and method for mounting a cooling device and method of fabrication

Abstract

A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.

What is claimed as new and desired to be protected by Letters Patent of the United States is: 
     
       1. A mounting apparatus for a cooling device, comprising:
 a plurality of connectorsat least one connector extending outwardly from the cooling device and configured to orient the cooling device at an angle transverse to a substrate; and 
 at least one mounting post coupled to the plurality of connectors at least one connector and configured to mount the cooling device on the substrate, 
 wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air blown in a direction towards the substrate. 
 
     
     
       2. The mounting apparatus of  claim 1 , wherein each of the plurality of connectors the at least one connector comprises a compliant material. 
     
     
       3. The mounting apparatus of  claim 2 , wherein the compliant material comprises an elastomeric material. 
     
     
       4. The mounting apparatus of  claim 1 , wherein the plurality of connectors at least one connector comprises a plurality of tendons. 
     
     
       5. The mounting apparatus of  claim 1 , wherein the plurality of connectors at least one connector comprises a plurality of tabs. 
     
     
       6. The mounting apparatus of  claim 1 , wherein the plurality of connectors at least one connector is formed integral into an E-clip mounting apparatus. 
     
     
       7. The mounting apparatus of  claim 1 , wherein the plurality of connectors at least one connector is configured to mount the cooling device in a plane perpendicular to a plane of the substrate. 
     
     
       8. The mounting apparatus of  claim 1 , wherein the substrate is a printed circuit board assembly. 
     
     
       9. A method of mounting a cooling device, comprising:
 disposing at least one mounting post on a substrate; and 
 mounting a cooling device on the mounting post at an angle transverse to a plane of the substrate by way of a plurality of connectors at least one connector extending outwardly from the cooling device, wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air blown in a direction towards the substrate. 
 
     
     
       10. The method of  claim 9 , wherein the mounting by way of a plurality of connectors at least one connector comprises extending a compliant material outwardly to form the plurality of connectors at least one connector. 
     
     
       11. The method of  claim 10 , wherein the extending comprises forming a plurality of tendons. 
     
     
       12. The method of  claim 10 , wherein the extending comprises forming a plurality of tabs. 
     
     
       13. The method of  claim 10 , wherein the extending comprises forming an E-clip. 
     
     
       14. A method of mounting a cooling device on a printed circuit board comprising:
 disposing a plurality of mounting posts on the cooling device to orient the cooling device at an angle relative to the circuit board and forming a region under the cooling device; and 
 disposing a plurality of electronic components that do not require cooling in the region under the cooling device, wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air blown in a direction towards the circuit board. 
 
     
     
       15. A cooling system for a printed circuit board comprising:
 a printed circuit board having a plurality of electronic components mounted thereon, wherein at least one of the plurality of electronic components does not require cooling; and   a cooling device coupled to a plurality of mounting posts, wherein the plurality of mounting posts orient the cooling device at an angle to the printed circuit board and form a region under the cooling device;   wherein the at least one of the plurality of electronic components not requiring cooling is disposed in the region under the cooling device.    
     
     
       16. A cooling system for a printed circuit board comprising:
 a printed circuit board having at least one electronic component mounted thereon; and   at least one through-board clip insertable and mateable with the printed circuit board so as to extend therethrough; and   a cooling device coupled to the at least one through-board clip to secure the cooling device in-place relative to the at least one electronic component, the cooling device comprising an active material that is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air being blown out therefrom;   wherein the through-board clip disposes the cooling device above the at least one electronic component and orients the cooling device at an angle transverse to the printed circuit so as to cool the at least one electronic component.    
     
     
       17. A cooling system for a circuit board comprising:
 a printed circuit board having a plurality of electronic components mounted thereon; and   a cooling device attached to the printed circuit board with an adhesive;   wherein the cooling device comprises an active material and the active material is electrically stimulated to cause an out of plane deformation of the cooling device resulting in a jet stream of air being blown out therefrom;   wherein the cooling device is attached to the printed circuit board such that it is at an angle transverse to the printed circuit board; and   wherein at least one of the plurality of electronic components is encased within the adhesive.    
     
     
       18. The cooling system of claim 17 wherein the cooling device is a piezoelectric cooling device.