Orthopaedic implant with sensors
Abstract
A monitoring system includes: (1) an implant having at least one sensor and configured for at least partial insertion into a patient, a first one of sensors being in contact with a perimeter of a hole in a body portion of the implant for accepting a fastener; (2) a microchip associated with the implant and the sensor, the microchip configured to receive at least a first signal from the sensor; (3) a transmitter associated with the microchip for transmitting a second signal, representative of the first signal; (4) a receiver located outside of the patient, the receiver configured receive the transmitted second signal; and (5) a display device associated with the receiver, the display device configured to provide an audible or visual representation of the second signal to a user.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A method of mending a broken bone, comprising:
affixing a bone fixation implant to first and second portions of the broken bone using a plurality of fasteners, the implant including a microchip and a plurality of sensors arranged on the implant and connected to the microchip, a first one of the sensors being in contact with a perimeter of a hole in a body portion of the implant for accepting a fastener;
collecting data from the sensors by the microchip; and
transmitting the data from the microchip to an external receiving device.
2. The method of claim 1 , wherein at least one of the sensors is a thermocouple.
3. The method of claim 1 , wherein at least one of the sensors is a pressure transducer.
4. The method of claim 1 , wherein at least one of the sensors is a strain gauge.
5. The method of claim 1 , wherein at least one of the sensors is a digital imaging element.
6. A monitoring system comprising:
an implant having at least one sensor and configured for at least partial insertion into a patient, a first one of sensors being in contact with a perimeter of a hole in a body portion of the implant for accepting a fastener;
a microchip associated with the implant and the sensor, the microchip configured to receive at least a first signal from the sensor;
a transmitter associated with the microchip for transmitting a second signal, representative of the first signal;
a receiver located outside of the patient, the receiver configured receive the transmitted second signal; and
a display device associated with the receiver, the display device configured to provide an audible or visual representation of the second signal to a user.
7. The monitoring system of claim 6 , wherein the microchip further comprises a data logger.
8. The monitoring system of claim 6 , wherein the display device is further configured to continuously record the transmitted second signal.
9. The monitoring system of claim 6 , wherein the implant is a bone plate.
10. The monitoring system of claim 6 , wherein the at least one sensor is configured and adapted to receive a strain from at least a portion of the implant.
11. The monitoring system of claim 6 wherein the at least one sensor is configured and adapted to receive a pressure applied to at least a portion of the implant.
12. The monitoring system of claim 6 wherein the at least one sensor is configured and adapted to receive a temperature of at least a portion of the implant.
13. The monitoring system of claim 6 , wherein the implant further comprises a compartment for holding a therapeutic agent for release in response to a signal received by the microchip.
14. The method of claim 1, wherein the bone fixation implant is a bone plate.
15. A method of orthopaedic surgery, comprising:
attaching an orthopaedic device to a bone using a plurality of fasteners, the orthopedic device including a microchip and a plurality of sensors operably connected to the orthopaedic device to monitor the orthopaedic device, the plurality of sensors being connected to the microchip, intraoperatively adjusting the orthopaedic device, and intraoperatively receiving data from the sensors via the microchip, the data corresponding to an adjustment of the orthopaedic device to achieve a desired spatial relationship of bone segments to one another.
16. The method of orthopaedic surgery of claim 15, further comprising the step of:
intraoperatively adjusting the orthopaedic device based on the data from the sensors.
17. The method of orthopaedic surgery of claim 15, wherein the bone segments are vertebrae and the orthopaedic device is a spinal fixation implant comprising a spinal fusion rod assembly.
18. The method of orthopaedic surgery of claim 15, wherein the data is wirelessly transmitted to an external computing device.
19. A method of orthopaedic surgery, comprising:
attaching a first rod of an orthopaedic device along a first side of a first portion of a bone via a first transverse member extending from the first rod, the first rod having a first sensor operably connected thereto; attaching a second rod of the orthopaedic device along a second side of a second portion of the bone via a second transverse member extending from the second rod, the second rod having a second sensor operably connected thereto; receiving data via a microchip connected to the first and second sensors; and providing the data to a user to facilitate intraoperative adjustments to the orthopaedic device by the user.
20. The method of claim 19, wherein the first portion of bone is a vertebra and the orthopaedic device is a spinal fusion rod assembly.
21. The method of claim 19, wherein the data is configured to facilitate intraoperative adjustments to the orthopaedic device to achieve one of a desired stress, strain and pressure applied to the first portion of bone via the orthopaedic device.
22. The method of claim 19, wherein the data includes one of a stress, strain and pressure applied to the orthopaedic device.
23. A method of orthopaedic surgery, comprising:
attaching a spinal fixation member to a bone via a transverse member extending therefrom, the spinal fixation member including a sensor operably connected thereto to monitor the spinal fixation member; and intraoperatively receiving data from the sensor via a microchip connected to the sensor, the data corresponding to a desired intraoperative adjustment of the spinal fixation member.
24. The method of claim 23, wherein the spinal fixation member is a spinal fusion rod assembly.
25. The method of claim 23, wherein the spinal fixation member includes two rods configured to be attached to opposing sides of the bone.
26. The method of claim 23, wherein the sensor detects one of stress, strain and pressure applied to the bone.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.