Imaging device and method of manufacturing the same and electronic apparatus

Abstract

A solid-state imaging device includes: an optical filter in which a filter layer is formed on a transparent substrate; a solid-state imaging component that is arranged to be opposed to the optical filter and in which plural pixels that receive light made incident via the filter layer are arrayed in a pixel area of a semiconductor substrate; and a bonding layer that is provided between the optical filter and the solid-state imaging component and sticks the optical filter and the solid-state imaging component together.

What is claimed is: 
     
       1. A solid-state An imaging device comprising:
 an optical filter in which a filter layer is formed on a transparent substrate of the optical filter; 
 a solid-state imaging component that is arranged to be opposed to the optical filter and in which plural pixels that receive light made incident via the filter layer are arrayed in a pixel area of a semiconductor substrate; and 
 a bonding layer that is provided between the optical filter and the solid-state imaging component and sticks the optical filter and the solid-state imaging component together, wherein 
 the filter layer is a dielectric multilayer film in which plural dielectric layers having a high refractive index and plural dielectric layers having a low refractive index are alternately stacked and is formed to cover a portion corresponding to the pixel area and a part of an area located around the pixel area on a surface of the transparent substrate on a side opposed to the solid-state imaging component, and 
 the bonding layer is provided to be at least in contact with, in relative to a peripheral portion of surfaces of the solid-state imaging component and the optical filter opposed to each other, a portion of the optical filter not covered by the filter layer and a peripheral portion of the filter layer on the transparent substrate, 
 a cavity section is provided between the optical filter and the solid-state imaging component opposed to each other, 
 the filter layer is formed on a side of the transparent substrate facing the solid-state imaging component, and the filter layer is located between the transparent substrate and the solid-state imaging component, 
 the filter layer is provided in an entire area of the cavity section in a width direction in a cross section view, 
 a side end face of the filter layer inclines to be reduced in width from a side of the transparent substrate toward a side of the solid-state imaging component, and 
 on the transparent substrate.the bonding layer is provided to cover a tilting side end face of the filter layer.  
 
     
     
       2. The solid-state imaging device according to  claim 1 , wherein
 a cavity section is provided between the optical filter and the solid-state imaging component opposed to each other, 
 in the solid-state imaging component, the pixel area is provided such that the pixels receive light made incident via the cavity section, and 
 the bonding layer is provided to surround a periphery of the cavity section between the optical filter and the solid-state imaging component opposed to each other. 
 
     
     
       3. The solid-state imaging device according to  claim 1 , wherein the bonding layer is provided over the surfaces of the optical filter and the solid-state imaging component opposed to each other. 
     
     
       4. The solid-state imaging device according to  claim 2 , wherein
 a side end face of the filter layer inclines to be reduced in width from a side of the transparent substrate toward a side of the solid-state imaging component, and   the bonding layer is provided to cover a tilting side end face of the filter layer.   
     
     
       5. A method of manufacturing a solid-state an imaging device, comprising the steps of:
 forming an optical filter by forming a filter layer on a transparent substrate of the optical filter; 
 forming a solid-state imaging component by providing, in a pixel area of a semiconductor substrate, plural pixels which receive light; and 
 sticking the optical filter and the solid-state imaging component together by providing a bonding layer between the optical filter and the solid-state imaging component opposed to each other such that the pixels receive light made incident via the filter layer, wherein 
 in the step of forming an optical filter, the filter layer is formed by providing, to cover a portion corresponding to the pixel area and a part of an area located around the pixel area on a surface of the transparent substrate on a side opposed to the solid-state imaging component, a dielectric multilayer film in which plural dielectric layers having a high refractive index and plural dielectric layers having a low refractive index are alternately stacked, and 
 in the step of sticking the optical filter and the solid-state imaging component together, the optical filter and the solid-state imaging component are stuck together by providing the bonding layer to be at least in contact with, in relative to a peripheral portion of a surface opposed to the semiconductor substrate on the transparent substrate, a portion of the optical filter not covered by the filter layer and a peripheral portion of the filter layer, 
 a cavity section is provided between the optical filter and the solid-state imaging component opposed to each other, 
 the filter layer is formed on a side of the transparent substrate facing the solid-state imaging component, and the filter layer is located between the transparent substrate and the solid-state imaging component, 
 the filter layer is provided in an entire area of the cavity section in a width direction in a cross section view, 
 a side end face of the filter layer inclines to be reduced in width from a side of the transparent substrate toward a side of the solid-state imaging component, and 
 the bonding layer is provided to cover a tilting side end face of the filter layer. 
 
     
     
       6. The method of manufacturing a solid-state an imaging device according to  claim 5 , wherein
 in the step of forming an optical filter, a plurality of the optical filters are formed on the transparent substrate, 
 in the step of forming a solid-state imaging component, a plurality of the solid-state imaging components are formed on the semiconductor substrate, 
 in the step of sticking the optical filter and the solid-state imaging component together, the transparent substrate and the semiconductor substrate are aligned and stuck together such that each of the plural optical filters and each of the plural solid-state imaging components correspond to each other, and 
 dicing is carried out for the transparent substrate and the semiconductor substrate stuck together to divide transparent substrate and the semiconductor substrate into plural solid-state imaging devices. 
 
     
     
       7. The method of manufacturing a solid-state an imaging device according to  claim 6 , wherein, in the step of forming an optical filter, the filter layer is formed on the transparent substrate by a lift-off method. 
     
     
       8. The method of manufacturing a solid-state an imaging device according to  claim 7 , wherein
 the step of forming an optical filter includes the steps of:
 forming a photoresist pattern to be located above an area other than an area where the filter layer is formed on a surface of the transparent substrate; 
 forming, to cover an upper surface of the transparent substrate and an upper surface of the photoresist pattern, a filter layer on the surface of the transparent substrate on which the photoresist pattern is formed; and 
 removing the photoresist pattern, the upper surface of which is covered with the filter layer, and 
 
 in the step of forming a photoresist pattern, the photoresist pattern is formed to have a sectional shape having small width on a side close to the transparent substrate and gradually having larger width farther away from the transparent substrate. 
 
     
     
       9. The method of manufacturing a solid-state an imaging device according to  claim 7 , further comprising:
 forming a notch shape on the semiconductor substrate,  
 wherein in the step of forming an optical filter, a notch pattern same as a the notch shape formed on the semiconductor substrate is formed on the transparent substrate simultaneously with the formation of the filter layer, and 
 in the step of sticking the optical filter and the solid-state imaging component together, the semiconductor substrate and the transparent substrate are aligned using the notch shape of the semiconductor substrate and the notch pattern of the transparent substrate. 
 
     
     
       10. An electronic apparatus comprising:
 an optical filter in which a filter layer is formed on a transparent substrate of the optical filter; 
 a solid-state imaging component that is arranged to be opposed to the optical filter and in which plural pixels that receive light made incident via the filter layer are arrayed in a pixel area of a semiconductor substrate; and 
 a bonding layer that is provided between the optical filter and the solid-state imaging component and sticks the optical filter and the solid-state imaging component together, wherein 
 the filter layer is a dielectric multilayer film in which plural dielectric layers having a high refractive index and plural dielectric layers having a low refractive index are alternately stacked and is formed to cover a portion corresponding to the pixel area and a part of an area located around the pixel area on a surface of the transparent substrate on a side opposed to the solid-state imaging component, and 
 the bonding layer is provided to be at least in contact with, in relative to a peripheral portion of surfaces of the solid-state imaging component and the optical filter opposed to each other, a portion of the optical filter not covered by the filter layer and a peripheral portion of the filter layer on the transparent substrate, 
 a cavity section is provided between the optical filter and the solid-state imaging component opposed to each other, 
 the filter layer is formed on a side of the transparent substrate facing the solid-state imaging component, and the filter layer is located between the transparent substrate and the solid-state imaging component, 
 the filter layer is provided in an entire area of the cavity section in a width direction in a cross section view, 
 a side end face of the filter layer inclines to be reduced in width from a side of the transparent substrate toward a side of the solid-state imaging component, and 
 the bonding layer is provided to cover a tilting side end face of the filter layer. 
 
     
     
       11. The imaging device according to claim 1, wherein
 the bonding layer sticks the optical filter and the solid-state imaging component together in non-touching non-directly-touching fashion.   
     
     
       12. The imaging device according to claim 1, wherein
 the portion of surfaces is a peripheral portion, and   the bonding layer is provided to be at least in contact with, relative to the peripheral portion of surfaces of the solid-state imaging component and the optical filter opposed to each other, the portion of the optical filter not covered by the filter layer and the peripheral portion of the filter layer.   
     
     
       13. The imaging device according to claim 1, wherein
 the peripheral portion of the filter layer includes a lateral side of the filter layer and a bottom surface of the filter layer facing the solid-state imaging component.