Automated fillet inspection system with closed loop feedback and methods of use

Abstract

Systems and methods for automated inspection of fillet formation along on or more peripheral edges ( 13 a) of a packaged microelectronic device ( 14 ) that is attached to a supporting substrate ( 16 ), such system ( 10 ) including a feedback loop for controlling fillet formation. More specifically, the system ( 10 ) includes a dispensing system ( 18 ) configured for dispensing underfill material ( 22 ) onto the supporting substrate ( 16 ). The system ( 19 ) further includes an automated optical inspection (AOI) system ( 19 ) configured for determining a value of a measurable attribute of the fillet ( 12 ), such as whether the fillet ( 12 ) is properly dimensioned, i.e., sized and shaped. A feedback loop ( 66 ) is included between the dispensing system ( 18 ) and automated optical inspection system ( 19 ). The feedback loop ( 66 ) is configured to communicate information from the AOI system ( 19 ) to the dispensing system ( 18 ) to permit adjustment of one or more operating parameters thereof, thereby maintaining proper dimensions of the fillet ( 12 ).

What is claimed is: 
     
       1. A method for use in analyzing an underfill material dispensed onto at least a first and a second a supporting substrate, the method comprising:
 dispensing the underfill material in a dispensing system onto the a first supporting substrate adjacent to a first packaged microelectronic device attached to the first supporting substrate so that the underfill material can flow under the first packaged microelectronic device and form a fillet along at least one peripheral edge or corner of the first packaged microelectronic device, the dispensing system being in a single chassis configured to house the first supporting substrate; 
 after the underfill material is dispensed and flows under the first packaged microelectronic device to form the fillet, transferring the first supporting substrate, the first packaged microelectronic device, and the fillet as an assembly from the dispensing system to an automated optical inspection system; 
 capturing an image of all of the edges of the fillet using the at least one camera of an automated optical inspection system in the single chassis; 
 analyzing the image using an image-processing computer to determine one or more values of a measurable property of the fillet; 
 comparing the one or more values of a the measurable property of the fillet with a predetermined value of the measurable property to generate an output from the comparison; 
 automatically adjusting an operating parameter of the dispensing system based upon the output from the comparison; and 
 dispensing the underfill material in the dispensing system onto the a second supporting substrate adjacent to a second packaged microelectronic device attached to the second supporting substrate based on the adjusted operating parameter, 
 wherein the location of the first supporting substrate is the same in the dispensing and capturing steps. 
 
     
     
       2. The method of  claim 1  further comprising:
 communicating the output from the comparison to the dispensing system. 
 
     
     
       3. The method of  claim 2  wherein communicating the one or more values of a measurable property of the fillet output from the comparison comprises:
 communicating the one or more values of a the measurable property of the fillet over a feedback loop connecting a controller at the automated optical inspection system with a controller at the dispensing system. 
 
     
     
       4. The method of  claim 1  wherein automatically adjusting the operating parameter comprises:
 maintaining effective operation of the underfill dispensing system. 
 
     
     
       5. The method of  claim 1  further comprising:
 before dispensing the underfill material, defining parameters used by the image-processing computer to determine whether the underfill dispensing system is effectively operating. 
 
     
     
       6. The method of  claim 1  wherein the fillet defines one of a no-flow underfill fillet, a corner bond fillet, an edge bond fillet, or a capillary underfill fillet. 
     
     
       7. The method of  claim 1  wherein dispensing the underfill material in the dispensing system onto the first supporting substrate comprises:
 dispensing the underfill material onto the first supporting substrate adjacent to the peripheral edge or the corner of the packaged microelectronic device. 
 
     
     
       8. The method of  claim 1  wherein the one or more values of a the measurable property are values of a dimension or a shape. 
     
     
       9. An automated system for use in analyzing an underfill material dispensed onto at least a first and a second a supporting substrate, the system comprising:
 a dispensing system including a dispensing device configured to dispense the underfill material onto the first and second supporting substrates and adjacent to a first and second packaged microelectronic devices attached to the first and second supporting substrates, respectively, so that the underfill material can flow under the first and second packaged microelectronic device devices and form a fillet fillets along at least one peripheral edge or corner of the first and second packaged microelectronic device devices; 
 an automated optical inspection system comprising at least one camera configured to capture an image of all of the edges of the fillet and along the packaged microelectronic device, the automated optical inspection system comprising a controller configured to analyze the image to determine one or more values of a measurable property of the fillet; 
 a machine configured to transfer the first packaged microelectronic device, and the fillet as an assembly from the dispensing system to the automated optical inspection system, and 
 a feedback loop coupling the automated optical inspection system with the dispensing system, 
 wherein the automated optical inspection system is configured to communicate the one or more values of a the measurable property of the fillet over the feedback loop to the dispensing system so that an operating parameter of the dispensing system is automatically adjusted, and the dispensing system is configured to dispense the underfill material onto the second supporting substrate based on the one or more values of a measurable property of the fillet communicated to the dispensing system adjusted operating parameter, and 
 wherein the dispensing system and the automated optical inspection system are in a single chassis configured to house the first and second supporting substrates. 
 
     
     
       10. The system of  claim 9  wherein the automated optical inspection system includes at least one camera configured to capture the image, and a controller coupled with the at least one camera, the at least one camera being adapted to communicate the image to the controller, and the controller configured to analyze the image for determining the one or more values of a measurable property of the fillet. 
     
     
       11. The system of  claim 9  wherein the machine comprises further comprising a conveyor sub-system adapted to convey and hold the first supporting substrate. 
     
     
       12. The system of  claim 9  further comprising:
 a loader configured for loading to load the first packaged microelectronic device and the first supporting substrate into the dispensing system; and 
 an unloader configured for unloading to unload an assembly of the first packaged microelectronic device, the first supporting substrate, and the underfill material from the automated optical inspection system. 
 
     
     
       13. The system of  claim 9  further comprising:
 a curing oven downstream of the automated optical inspection system, the curing oven configured for curing to cure the underfill material. 
 
     
     
       14. The system of  claim 9  wherein the dispensing system and the automated optical inspection system define an island of automation automated system. 
     
     
       15. The system of  claim 9  wherein the dispensing system and the automated optical inspection system define an inline automated system. 
     
     
       16. The system of  claim 9  wherein the dispensing system includes a controller coupled in communication with the dispensing device, the controller configured to supply control signals to the dispensing device for controlling the dispensing of the underfill material onto the first and second supporting substrates, and the automated optical inspection system includes a camera and a controller coupled in communication with the camera and by the feedback loop with the controller of the dispensing system, the camera configured to capture the image of the material, and the controller to analyze the image to determine one or more values of a measurable property of the fillet. 
     
     
       17. The system of  claim 16  wherein the controller of the dispensing system is configured to compare the one or more values of a the measurable property of the fillet with a predetermined value of the measurable property to generate an output from the comparison. 
     
     
       18. The system of  claim 16  wherein the controller of the automated optical inspection system is configured to compare the one or more values of a the measurable property of the fillet with a predetermined value of the measurable property to generate an output from the comparison. 
     
     
       19. The method of claim 1 wherein the at least one camera is disposed directly above the first packaged microelectronic device while the image of all of the edges of the fillet is captured. 
     
     
       20. The system of claim 9 wherein the at least one camera is disposed directly above the first packaged microelectronic device while the image of all of the edges of the fillet is captured.