Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

Abstract

There is provided a semiconductor light emitting device, a method of manufacturing the same, and a semiconductor light emitting device package using the same. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein the second electrode layer has an exposed area at the interface between the second electrode layer and the second conductivity type semiconductor layer, and the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer.

What is claimed is: 
     
       1. A semiconductor light emitting device having a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, and insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, wherein:
 the second electrode layer has an exposed area at an interface between the second electrode layer and the second conductivity type semiconductor layer, 
 the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer, and 
 an irregular pattern is defined on a surface of the first conductivity type semiconductor layer. 
 
     
     
       2. The semiconductor light emitting device of  claim 1 , further comprising an electrode pad unit formed at the exposed area of the second electrode layer. 
     
     
       3. The semiconductor light emitting device of  claim 1 ,
 wherein the exposed area of the second electrode layer is a region exposed by a via hole formed through the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer. 
 
     
     
       4. The semiconductor light emitting device of  claim 3 , wherein the diameter of the via hole increases in a direction from the second electrode layer toward the first conductivity type semiconductor layer. 
     
     
       5. The semiconductor light emitting device of  claim 3 , wherein an insulating layer is formed on an inner surface of the via hole. 
     
     
       6. The semiconductor light emitting device of  claim 1 , wherein the exposed area of the second electrode layer is formed at the edge of the semiconductor light emitting device. 
     
     
       7. The semiconductor light emitting device of  claim 1 , wherein the second electrode layer reflects light generated from the active layer. 
     
     
       8. The semiconductor light emitting device of  claim 7 , wherein the second electrode layer comprises one metal selected from a group consisting of Ag, Al, and Pt. 
     
     
       9. The semiconductor light emitting device of  claim 1 , wherein the irregular pattern has a photonic crystal structure. 
     
     
       10. The semiconductor light emitting device of  claim 1 , wherein the conductive substrate comprises one metal selected from a group consisting of Au, Ni, Cu, and W. 
     
     
       11. The semiconductor light emitting device of  claim 1 , wherein the conductive substrate comprises one selected from a group consisting of Si, Ge, and GaAs. 
     
     
       12. The semiconductor light emitting device of  claim 1 , wherein the irregular pattern is defined on an edge of the semiconductor light emitting device, which is an outermost edge in a direction in which light is emitted from the semiconductor light emitting device. 
     
     
       13. A method of manufacturing a semiconductor light emitting device, the method comprising:
 sequentially laminating a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, an insulating layer, a first electrode layer, and a conductive substrate; 
 forming an exposed area at an interface between the second electrode layer and the second conductivity type semiconductor layer; and 
 forming at least one contact hole in the first electrode layer, the contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer, 
 wherein the forming of the exposed area of the second electrode layer comprises mesa etching the first conductivity type semiconductor layer, the active layer, and the second conductivity type semiconductor layer. 
 
     
     
       14. The method of  claim 13 , wherein the conductive substrate is formed by a plating method and laminated. 
     
     
       15. The method of  claim 13 , wherein the conductive substrate is laminated by a substrate bonding method. 
     
     
       16. The method of  claim 13 , wherein the forming of the exposed area includes etching a corner of the semiconductor light emitting device to expose the second electrode layer at the interface between the second electrode layer and the second conductivity type semiconductor layer. 
     
     
       17. A semiconductor light emitting device package comprising:
 a semiconductor light emitting device package body having a recessed part defined at an upper surface thereof; 
 a first lead frame and a second lead frame disposed on the semiconductor light emitting device package body, exposed at a lower surface of the recessed part, and separated from each other by a predetermined distance; 
 a semiconductor light emitting device disposed on the first lead frame, wherein: 
 the semiconductor light emitting device comprises a first conductivity type semiconductor layer, an active layer, a second conductivity type semiconductor layer, a second electrode layer, an insulating layer, a first electrode layer, and a conductive substrate sequentially laminated, 
 the second electrode layer comprises an exposed area at an interface between the second electrode layer and the second conductivity type semiconductor layer, 
 the first electrode layer comprises at least one contact hole electrically connected to the first conductivity type semiconductor layer, electrically insulated from the second conductivity type semiconductor layer and the active layer, and extending from one surface of the first electrode layer to at least part of the first conductivity type semiconductor layer, and 
 the semiconductor light emitting device further comprises an electrode pad unit disposed at the exposed area of the second electrode layer, and the electrode pad unit is electrically connected to the second lead frame. 
 
     
     
       18. The method of  claim 17 , wherein a portion of the semiconductor light emitting device package body is exposed at the lower surface of the recess part between the first lead frame and the second lead frame. 
     
     
       19. A semiconductor light emitting device comprising:
 a substrate;   a first electrode layer disposed on the substrate;   a first insulating layer disposed on the first electrode layer;   a second electrode layer disposed on the first insulating layer and including an exposed surface;   a second conductivity type semiconductor layer disposed on the second electrode layer;   an active layer disposed on the second conductivity type semiconductor layer; and   a first conductivity type semiconductor layer disposed on the active layer and including an irregular pattern on a surface of the first conductivity type semiconductor layer,   wherein the first electrode layer includes at least one protruding portion that extends to the first conductivity type semiconductor layer and is electrically connected to the first conductivity type semiconductor layer.   
     
     
       20. The semiconductor light emitting device of claim 19, wherein the at least one protruding portion is electrically insulated from the second electrode layer, the active layer and the second conductivity type semiconductor layer. 
     
     
       21. The semiconductor light emitting device of claim 19, wherein the exposed surface is exposed through the second conductivity type semiconductor layer, the active layer and the first conductivity type semiconductor layer. 
     
     
       22. The semiconductor light emitting device of claim 19, wherein the exposed surface is formed at an edge of the semiconductor light emitting device. 
     
     
       23. The semiconductor light emitting device of claim 21, wherein the exposed surface is exposed through an opening that is obliquely formed through the second conductivity type semiconductor layer, the active layer and the first conductivity type semiconductor layer. 
     
     
       24. A semiconductor light emitting device comprising:
 a substrate;   a first electrode layer disposed on the substrate;   a first insulating layer disposed on the first electrode layer;   a second electrode layer disposed on the first insulating layer and including an exposed surface;   a second conductivity type semiconductor layer disposed on the second electrode layer;   an active layer disposed on the second conductivity type semiconductor layer;   a first conductivity type semiconductor layer disposed on the active layer and including an irregular pattern on a surface of the first conductivity type semiconductor layer; and   at least one contact layer extending from the first electrode layer to the first conductivity type semiconductor layer and electrically connecting the first conductivity type semiconductor layer to the first electrode layer.   
     
     
       25. The semiconductor light emitting device of claim 24, wherein the first electrode layer includes the at least one contact layer. 
     
     
       26. A semiconductor light emitting device comprising:
 a substrate;   a first electrode layer disposed on the substrate;   a first insulating layer disposed on the first electrode layer;   a second electrode layer disposed on the first insulating layer;   a second conductivity type semiconductor layer disposed on the second electrode layer;   an active layer disposed on the second conductivity type semiconductor layer; and   a first conductivity type semiconductor layer disposed on the active layer,   wherein the first electrode layer includes at least one protruding portion that extends to the first conductivity type semiconductor layer and is electrically connected to the first conductivity type semiconductor layer, and   the second electrode layer includes a first surface that is partially exposed through the second conductivity type semiconductor layer, the active layer and the first conductivity type semiconductor layer.   
     
     
       27. The semiconductor light emitting device of claim 26, wherein the first conductivity type semiconductor layer includes an irregular pattern on a surface of the first conductivity type semiconductor layer. 
     
     
       28. A semiconductor light emitting device comprising:
 a first electrode layer;   a first insulating layer disposed on the first electrode layer;   a second electrode layer disposed on the first insulating layer and including an exposed surface;   a second conductivity type semiconductor layer disposed on the second electrode layer;   an active layer disposed on the second conductivity type semiconductor layer; and   a first conductivity type semiconductor layer disposed on the active layer and including an irregular pattern on a surface of the first conductivity type semiconductor layer,   wherein the first electrode layer includes at least one protruding portion that extends to the first conductivity type semiconductor layer, and   the at least one protruding portion is electrically connected to the first conductivity type semiconductor layer, and is electrically insulated from the second electrode layer, the active layer and the second conductivity type semiconductor layer.   
     
     
       29. The semiconductor light emitting device of claim 28, further comprising a substrate on which the first electrode layer is disposed. 
     
     
       30. A semiconductor light emitting device package comprising:
 a package body;   a first lead frame and a second lead frame mounted on the package body; and   a semiconductor light emitting device disposed on the first lead frame, and including:   a first electrode layer;   a first insulating layer disposed on the first electrode layer;   a second electrode layer disposed on the first insulating layer and including an exposed surface;   an electrode pad unit electrically connected to the second lead frame and disposed on the exposed surface of the second electrode layer;   a second conductivity type semiconductor layer disposed on the second electrode layer;   an active layer disposed on the second conductivity type semiconductor layer; and   a first conductivity type semiconductor layer disposed on the active layer and including an irregular pattern on a surface of the first conductivity type semiconductor layer,   wherein the first electrode layer includes at least one protruding portion that extends to the first conductivity type semiconductor layer, and   wherein the at least one protruding portion is electrically connected to the first conductivity type semiconductor layer, and is electrically insulated from the second electrode layer, the active layer and the second conductivity type semiconductor layer.