Ultrasonic probe apparatus and ultrasonic imaging apparatus using the same

Abstract

An ultrasonic probe apparatus and an ultrasonic imaging apparatus are disclosed. The ultrasonic probe apparatus includes: an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; a first electronic circuit electrically connected to the sound absorption unit; and a substrate connection unit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit. The ultrasonic imaging apparatus includes the above ultrasonic probe and a main body.

What is claimed is: 
     
       1. An ultrasonic probe apparatus comprising:
 an ultrasonic transducer configured to output an electrical signal upon receiving ultrasonic waves; 
 a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer, and being electrically connected to the ultrasonic transducer; 
 a first electronic circuit electrically connected to the sound absorption unit; and 
 a second electronic circuit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit, 
 wherein one surface of the second electronic circuit faces another surface of the sound absorption unit, and another surface of the second electronic circuit faces one surface of the first electronic circuit 
 wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer, 
 wherein the second electronic circuit includes: 
 a first substrate connection unit provided to pass through from the one surface of the second electronic circuit to the another surface of the second electronic circuit, connected to the at least one first connection unit and configured to electrically connect the sound absorption unit and the first electronic circuit; and 
 a second substrate connection unit provided at a position not in contact with the at least one first connection unit of the sound absorption unit and configured to electrically connect the first electronic circuit and an output unit of the second electronic circuit. 
 
     
     
       2. The ultrasonic probe apparatus according to  claim 1 , wherein the second electronic circuit includes a substrate connection unit electrically connected to the first electronic circuit. 
     
     
       3. The ultrasonic probe apparatus according to  claim 2 , wherein the substrate connection unit includes a first substrate connection unit configured to electrically interconnect the sound absorption unit and the first electronic circuit. 
     
     
       4. The ultrasonic probe apparatus according to  claim 3 , wherein the first substrate connection unit is electrically connected to the ultrasonic transducer. 
     
     
       5. The ultrasonic probe apparatus according to  claim 4 , wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer,
 wherein the first substrate connection unit contacts the first connection unit.   
     
     
       6. The ultrasonic probe apparatus according to claim  2  1, wherein the second electronic circuit includes at least one output unit is configured to output a signal processed by the first electronic circuit,
 wherein the substrate connection unit includes a second substrate connection unit configured to electrically interconnect the first electronic circuit and the at least one output unit. 
 
     
     
       7. The ultrasonic probe apparatus according to claim  2  1, wherein the first substrate connection unit includes and the second substrate connection unit include:
 a first opening configured to pass through a range from the one surface to the another surface of the second electronic circuit; and 
 a conductor installed at an inner lateral surface of the first opening and electrically coupled to the first electronic circuit. 
 
     
     
       8. The ultrasonic probe apparatus according to  claim 7 , wherein the conductor is configured to shield the first opening. 
     
     
       9. The ultrasonic probe apparatus according to  claim 7 , wherein the first substrate connection unit and the second substrate connection unit further includes include a second opening formed to pass through the conductor. 
     
     
       10. The ultrasonic probe apparatus according to  claim 9 , wherein the first substrate connection unit and the second substrate connection unit further includes include a filling material configured to shield the second opening. 
     
     
       11. The ultrasonic probe apparatus according to  claim 7 , wherein the conductor is deposited on the inner lateral surface of the first opening. 
     
     
       12. The ultrasonic probe apparatus according to  claim 7 , wherein the conductor is installed at the one surface of the second electronic circuit located in a vicinity of the first opening. 
     
     
       13. The ultrasonic probe apparatus according to  claim 1 , wherein the second electronic circuit includes a rigid flexible printed circuit board (PCB). 
     
     
       14. The ultrasonic probe apparatus according to  claim 13 , wherein the second electronic circuit includes at least one of a first region that is not curved and a second region that is flexibly curved. 
     
     
       15. The ultrasonic probe apparatus according to  claim 14 , wherein the second electronic circuit includes a substrate connection unit that is electrically connected to the first electronic circuit and is the first substrate connection unit and the second substrate connection unit are formed in the first region. 
     
     
       16. The ultrasonic probe apparatus according to claim  2  1, wherein:
 a second connection unit is mounted to on the first electronic circuit and includes a third connection unit and a fourth connection unit, the second third connection unit being attached to the first substrate connection unit of the second electronic circuit and the fourth connection unit, being attached to the second substrate connection unit, of the second electronic circuit. 
 
     
     
       17. The ultrasonic probe apparatus according to  claim 16 , further comprising:
 a separation unit disposed between the second electronic circuit and the first electronic circuit, and formed of a nonconductive material that prevents the second electronic circuit from directly contacting the first electronic circuit. 
 
     
     
       18. The ultrasonic probe apparatus according to  claim 17 , wherein the second connection unit is mounted to the first electronic circuit so as to pass passes through the separation unit. 
     
     
       19. The ultrasonic probe apparatus according to  claim 1 , further comprising:
 a heat conduction unit mounted to another surface of the first electronic circuit, and to perform heat transmission of the first electronic circuit. 
 
     
     
       20. The ultrasonic probe apparatus according to  claim 1 , wherein the sound absorption unit includes:
 a sound absorption material for absorbing sound; and 
 a firstthe at least one first connection unit configured to pass through the sound absorption material so as to electrically interconnect the ultrasonic transducer and the first electronic circuit. 
 
     
     
       21. The ultrasonic probe apparatus according to  claim 20 , wherein the at least one first connection unit is mounted to a single ultrasonic transducer. 
     
     
       22. The ultrasonic probe apparatus according to  claim 1 , further comprising:
 an acoustic enhancer disposed between the ultrasonic transducer and the sound absorption unit, and configured to amplify the electrical signal generated from the ultrasonic transducer.   
     
     
       23. The ultrasonic probe apparatus according to  claim 1 , wherein the sound absorption unit is formed of a sound absorption material configured to absorb sound waves or ultrasonic waves. 
     
     
       24. The ultrasonic probe apparatus according to  claim 1 , wherein:
 a seating surface at which the ultrasonic transducer or an acoustic enhancer is seated is formed at the one surface of the sound absorption unit,   wherein the acoustic enhancer is coupled to the ultrasonic transducer so as to amplify the electrical signal generated from the ultrasonic transducer.   
     
     
       25. The ultrasonic probe apparatus according to  claim 1 , wherein the first electronic circuit includes a processor configured to focus signals generated from the ultrasonic transducer. 
     
     
       26. The ultrasonic probe apparatus according to  claim 1 , wherein the first electronic circuit includes at least one application specific integrated circuit (ASIC). 
     
     
       27. An ultrasonic imaging apparatus comprising:
 an ultrasonic probe configured to receive ultrasonic waves; and 
 a main body configured to control operations of the ultrasonic probe, and to perform image processing of an ultrasound image corresponding to the received ultrasonic waves, 
 wherein the ultrasonic probe includes: 
 an ultrasonic transducer configured to output an electrical signal upon receiving the ultrasonic waves; 
 a sound absorption unit, one surface of which is an installation surface of the ultrasonic transducer and is electrically connected to the ultrasonic transducer; 
 a first electronic circuit electrically connected to the sound absorption unit; and a second electronic circuit disposed between the sound absorption unit and the first electronic circuit, configured to electrically interconnect the first electronic circuit and the sound absorption unit, 
 wherein one surface of the second electronic circuit faces another surface of the sound absorption unit, and another surface of the second electronic circuit faces one surface of the first electronic circuit 
 wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer, 
 wherein the second electronic circuit includes: 
 a first substrate connection unit provided to pass through from the one surface of the second electronic circuit to the another surface of the second electronic circuit, connected to the at least one first connection unit, and configured to electrically connect the sound absorption unit and the first electronic circuit; and 
 a second substrate connection unit provided a position not in contact with the at least one first connection unit of the sound absorption unit, and configured to electrically connect the first electronic circuit and an output unit of the second electronic circuit. 
 
     
     
       28. The ultrasonic imaging apparatus according to  claim 27 , wherein the second electronic circuit includes a substrate connection unit electrically connected to the first electronic circuit. 
     
     
       29. The ultrasonic imaging apparatus according to  claim 28 , wherein the substrate connection unit includes a first substrate connection unit configured to electrically interconnect the sound absorption unit and the first electronic circuit. 
     
     
       30. The ultrasonic imaging apparatus according to  claim 29 , wherein the first substrate connection unit is electrically connected to the ultrasonic transducer. 
     
     
       31. The ultrasonic imaging apparatus according to  claim 30 , wherein the sound absorption unit includes at least one first connection unit electrically connected to the ultrasonic transducer,
 wherein the first substrate connection unit contacts the first connection unit.   
     
     
       32. The ultrasonic imaging apparatus according to claim  28  27, wherein the second electronic circuit includes at least one output unit is configured to output a signal processed by the first electronic circuit, wherein the substrate connection unit includes a second substrate connection unit configured to electrically interconnect the first electronic circuit and the at least one output unit. 
     
     
       33. The ultrasonic imaging apparatus according to  claim 27 , wherein the second electronic circuit includes a rigid flexible printed circuit board (PCB). 
     
     
       34. The ultrasonic imaging apparatus according to  claim 33 , wherein the second electronic circuit includes at least one of a first region that is not curved and a second region that is flexibly curved. 
     
     
       35. The ultrasonic imaging apparatus according to  claim 34 , wherein the second electronic circuit includes a substrate connection unit that is electrically connected to the first electronic circuit and is the first substrate connection unit and the second substrate connection unit are formed in the first region. 
     
     
       36. The ultrasonic imaging apparatus according to claim  29  27, wherein: a second connection unit is mounted to on the first electronic circuit and includes a third connection unit and a fourth connection unit, the second third connection unit being attached to the first substrate connection unit of the second electronic circuit and the fourth connection unit being attached to the second substrate connection unit of the second electronic circuit. 
     
     
       37. The ultrasonic imaging apparatus according to  claim 36 , further comprising:
 a separation unit disposed between the second electronic circuit and the first electronic circuit, and formed of a nonconductive material that prevents the second electronic circuit from directly contacting the first electronic circuit. 
 
     
     
       38. The ultrasonic imaging apparatus according to  claim 37 , wherein the second connection unit is mounted to the first electronic circuit so as to pass passes through the separation unit. 
     
     
       39. The ultrasonic imaging apparatus according to  claim 27 , further comprising:
 a heat conduction unit mounted to another surface of the first electronic circuit, and to perform heat transmission of the first electronic circuit. 
 
     
     
       40. The ultrasonic imaging apparatus according to  claim 27 , wherein the sound absorption unit includes:
 a sound absorption material for absorbing sound; and 
 a firstthe at least one first connection unit configured to pass through the sound absorption material so as to electrically interconnect the ultrasonic transducer and the first electronic circuit. 
 
     
     
       41. The ultrasonic imaging apparatus according to  claim 40 , wherein the at least one first connection unit is mounted to a single ultrasonic transducer. 
     
     
       42. The ultrasonic imaging apparatus according to  claim 27 , further comprising:
 an acoustic enhancer disposed between the ultrasonic transducer and the sound absorption unit, and configured to amplify the electrical signal generated from the ultrasonic transducer.   
     
     
       43. The ultrasonic imaging apparatus according to  claim 27 , wherein the sound absorption unit is formed of a sound absorption material configured to absorb sound waves or ultrasonic waves. 
     
     
       44. The ultrasonic imaging apparatus according to  claim 27 , wherein:
 a seating surface at which the ultrasonic transducer or an acoustic enhancer is seated is formed at the one surface of the sound absorption unit,   wherein the acoustic enhancer is coupled to the ultrasonic transducer so as to amplify the electrical signal generated from the ultrasonic transducer.   
     
     
       45. The ultrasonic imaging apparatus according to  claim 27 , wherein the first electronic circuit includes a processor configured to focus signals generated from the ultrasonic transducer. 
     
     
       46. The ultrasonic imaging apparatus according to  claim 27 , wherein the first electronic circuit includes at least one application specific integrated circuit (ASIC).