Light emitting device package and lighting apparatus having same

Abstract

An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, a light emitting device package includes a first lead frame; a second lead frame spaced apart from the first lead frame; a body coupled to the first lead frame and the second lead frame and includes a first cavity which exposes a portion of the upper surface of the first lead frame, a second cavity which exposes a portion of the upper surface of the second lead frame, and a spacer which is disposed between the first lead frame and the second frame; at least one light emitting device disposed in the first cavity; and a protection device disposed in the second cavity. The second cavity is disposed on a first inside surface of the first cavity and the first inside surface is connected to an upper surface of the spacer, and an area of a bottom surface of the first cavity is equal to or less than 40% of entire area of the body.

What is claimed is: 
     
       1. A light emitting device package, comprising:
 a first lead frame;   a second lead frame spaced apart from the first lead frame;   a body on the first lead frame and the second lead frame;   a light emitting device disposed on the first lead frame;   a protection device disposed on the second lead frame; and   a reflection molding portion on the protective device,   wherein the body includes a first cavity which exposes a first portion of an upper surface of the first lead frame,   wherein the first light emitting device is disposed in the first cavity,   wherein the first cavity includes a first inside surface and a second inside surface facing to each other, and a third inside surface and a fourth inside surface facing to each other,   wherein the third inside surface and the fourth inside surface are connected to the first inside surface,   wherein the reflection molding portion is disposed on the first inside surface,   wherein a portion of the reflection molding portion extends to the upper surface of the first lead frame,   wherein a first boundary part of the reflection molding portion is located between the first inside surface of the first cavity and a first end of the reflection molding portion,   wherein a second boundary part of the reflection molding portion is located between the fourth inside surface of the first cavity and a second end of the reflection molding portion,   wherein a third boundary part of the reflection molding portion is connected between the first boundary part and the second boundary part, and   wherein an area of the first portion exposed to the first cavity in the upper surface of the first lead frame is equal to or less than 40% of entire area of the body.   
     
     
       2. The light emitting device package of  claim 1 , wherein the protective device is disposed in the first inside surface of the first cavity. 
     
     
       3. The light emitting device package of  claim 1 , wherein the protective device is disposed in a second cavity of the first inside surface, and
 wherein an upper portion of the second cavity is opened from the first inside surface.   
     
     
       4. The light emitting device package of  claim 1 , wherein the third boundary part of the reflection molding portion is disposed on the first portion of the upper surface of the first lead frame. 
     
     
       5. The light emitting device package of  claim 1 , wherein the first, second, third and fourth inside surfaces of the first cavity is disposed along an edge of the upper surface of the first lead frame. 
     
     
       6. The light emitting device package of  claim 1 , wherein the third boundary part of the reflection molding portion is disposed between a first side surface of the light emitting device and the first inside surface of the first cavity, and
 wherein the first side surface of the light emitting device faces to the first inside surface of the first cavity.   
     
     
       7. The light emitting device package of  claim 1 , wherein the third boundary part of the reflection molding portion is disposed to be parallel to the first side surface of the light emitting device. 
     
     
       8. The light emitting device package of  claim 1 , wherein the reflection molding portion is overlapped with the first inside surface and the fourth inside surface of the first cavity in a vertical direction. 
     
     
       9. The light emitting device package of  claim 8 , wherein the reflection molding portion is overlapped with the first lead frame and the second frame in the vertical direction. 
     
     
       10. The light emitting device package of  claim 1 , wherein a spacer is disposed between the first and second lead frames, and
 wherein the first inside surface of the first cavity is disposed on an upper surface of the spacer.   
     
     
       11. The light emitting device package of  claim 1 , wherein a spacer is disposed between the first and second lead frames, and
 wherein the portion of the reflection molding portion extends to an upper surface of the spacer.   
     
     
       12. The light emitting device package of  claim 1 , wherein a distance between the light emitting device and the reflection molding portion on a bottom surface of the first cavity is 3.3% or less of a width of the bottom surface of the first cavity. 
     
     
       13. The light emitting device package of  claim 12 , herein the distance is between the 30 μm and 100 μm. 
     
     
       14. A light emitting device package, comprising:
 a first lead frame;   a second lead frame spaced apart from the first lead frame;   a body on the first lead frame and the second lead frame;   a spacer between the first lead frame and the second lead frame;   a light emitting device disposed on the first lead frame;   a protection device disposed on the second lead frame; and   a reflection molding portion on the protective device,   wherein the body includes a first cavity which exposes a first portion of an upper surface of the first lead frame,   wherein the first light emitting device is disposed in the first cavity,   wherein the first cavity includes a first inside surface and a second inside surface facing to each other, and a third inside surface and a fourth inside surface facing to each other,   wherein the third inside surface and the fourth inside surface are connected to the first inside surface,   wherein the reflection molding portion is disposed on the first inside surface and the spacer,   wherein a portion of the reflection molding portion extends to the upper surface of the first lead frame which expose to a bottom of the first cavity,   wherein the reflection molding portion covers an entire area of an upper surface of the spacer, and   wherein an area of the first portion exposed to the first cavity in the upper surface of the first lead frame is equal to or less than 40% of entire area of the body.   
     
     
       15. The light emitting device package of  claim 14 , wherein the first inside surface includes a boundary portion between the light emitting device and a second cavity, and
 wherein the boundary portion has a height greater than a height of the protective device.   
     
     
       16. The light emitting device package of  claim 15 , wherein the protective device is disposed in the first inside surface of the first cavity. 
     
     
       17. The light emitting device package of  claim 15 , wherein the protective device is disposed in the second cavity of the first inside surface. 
     
     
       18. The light emitting device package of  claim 15 , wherein the first inside surface is inclined at a same angle as an upper surface of the boundary portion. 
     
     
       19. The light emitting device package of  claim 18 , wherein the second, third and fourth inside surfaces of the first cavity and the reflection molding portion are disposed along an edge of the upper surface of the first lead frame. 
     
     
       20. The light emitting device package of  claim 14 , wherein a distance between the light emitting device and the reflection molding portion on a bottom surface of the first cavity is 3.3% or less of a width of the bottom surface of the first cavity. 
     
     
       21. A light-emitting device package, comprising:
 a first lead frame;   a second lead frame;   a package body having a cavity exposing a portion of the first lead frame, wherein the cavity comprises an inclined inner surface inclining with respect to an upper surface of the first lead frame;   a light-emitting diode disposed on the exposed portion of the first lead frame;   a hole in the inclined inner surface of the cavity and exposing a portion of the second lead frame;   a protection device disposed in the hole and on the exposed portion of the second lead frame;   a first wire having a first end connected to the light-emitting diode, and a second end connected to the exposed portion the second lead frame; and   a second wire having a first end connected to the protection device, and a second end connected to the exposed portion of the first lead frame,   wherein the package body includes a spacer disposed between the first lead frame and the second lead frame,   wherein the package body includes a boundary portion disposed on the spacer,   wherein the boundary portion is disposed between the protection device and the light-emitting diode,   wherein the boundary portion includes a first inclined surface corresponding to the inclined inner surface of the cavity,   wherein both the first wire and the second wire are disposed on the boundary portion of the package body,   wherein the hole includes a first inner surface disposed on the boundary portion and a second inner surface facing the first inner surface,   wherein the first inner surface is facing a first side of the protection device and the second inner surface is facing a second side of the protection device opposite to the first side,   wherein both a height of the first inner surface of the hole and a height of the second inner surface of the hole with respect to an upper surface of the second lead frame decrease as it progresses toward the protective device, and   wherein an area of the exposed portion of the first lead frame is equal to or less than 40% of an area surrounded by outside surfaces of the package body, from a top view.    
     
     
       22. The light-emitting device package according to claim 21, wherein an area of the exposed portion of the second lead frame exposed to a bottom surface of the hole is less than 10% of the area surrounded by outside surfaces of the package body, from the top view.  
     
     
       23. The light-emitting device package according to claim 22, wherein an area of the exposed portion of the first lead frame exposed to a bottom surface of the cavity is between 12% and 26% of the area surrounded by outside surfaces of the package body, from the top view.  
     
     
       24. The light-emitting device package according to claim 22, wherein the spacer includes a bottom portion having a first width and a top portion having a second width smaller than the first width,
 wherein the boundary portion is vertically overlapped with the first lead frame, the second lead frame and the spacer, and   wherein a maximum width of the boundary portion is less than a first maximum width of the first width of the spacer and greater than a second maximum width of the second width of the spacer.    
     
     
       25. The light-emitting device package according to claim 24, wherein a first edge of the top portion of the spacer faces the protection device,
 wherein a first edge of the bottom portion of the spacer faces the protection device,   wherein a second edge of the top portion of the spacer opposite to the first edge faces the light-emitting diode, and   wherein a second edge of the bottom portion of the spacer opposite to the first edge faces the light-emitting diode.    
     
     
       26. The light-emitting device package according to claim 24, wherein a highest height of the boundary portion of the package body is less than a height of the light-emitting diode.  
     
     
       27. The light-emitting device package according to claim 26, wherein the highest height of the boundary portion of the package body is higher than a height of the protection device.  
     
     
       28. The light-emitting device package according to claim 27, wherein the first inclined surface of the boundary portion of the package body is spaced apart from the light-emitting diode.  
     
     
       29. The light-emitting device package according to claim 28, wherein the first and second inner surfaces of the hole are spaced apart from the protection device.  
     
     
       30. The light-emitting device package according to claim 29, wherein the highest point of the boundary portion is vertically overlapped with the top portion of the spacer.  
     
     
       31. The light-emitting device package according to claim 30, wherein a height of the highest point of the boundary portion is between 100 μm and 300 μm.  
     
     
       32. The light-emitting device package according to claim 30, wherein a length of the second inner surface of the hole is longer than a length of the first inner surface of the hole.  
     
     
       33. The light-emitting device package according to claim 30, wherein the inclined inner surface of the cavity extends from an outer edge of the cavity to an inner edge of the cavity.  
     
     
       34. The light-emitting device package according to claim 33, wherein the inner edge of the cavity does not expose the second lead frame, and
 wherein the hole does not expose the first lead frame.    
     
     
       35. The light-emitting device package according to claim 34, wherein the boundary portion of the package body is connected with the spacer, and
 wherein the spacer and the package body are integrally formed with each other.    
     
     
       36. The light-emitting device package according to claim 30, wherein top surfaces of the first lead frame, the spacer and the second lead frame are substantially flush.  
     
     
       37. The light-emitting device package according to claim 21, wherein the light-emitting diode includes a first electrode electrically connected to the second lead frame via the first wire and a second electrode electrically connected to the first lead frame.  
     
     
       38. The light-emitting device package according to claim 37, wherein the hole is spaced from an inner edge and an outer edge of the inclined inner surface of the cavity.  
     
     
       39. The light-emitting device package according to claim 38, wherein the inclined inner surface of the cavity reflects light emitted from the light-emitting diode, and the inner edge of the inclined inner surface is spaced apart from the light-emitting diode.  
     
     
       40. The light-emitting device package according to claim 39, wherein the inclined inner surface of the cavity has a reflectance higher than a reflectance of the exposed portion of the first lead frame.  
     
     
       41. The light-emitting device package according to claim 39, further comprising:
 a molding member disposed in the cavity,   wherein the molding member surrounds and protects the light-emitting diode, and   wherein the molding member includes phosphor.    
     
     
       42. The light-emitting device package according to claim 41, wherein the package body includes polyphthalamide.  
     
     
       43. The light-emitting device package according to claim 42, wherein the second end of the first wire is inserted into the hole and connected to the second lead frame.  
     
     
       44. The light-emitting device package according to claim 36, wherein bottom surfaces of the first lead frame and the second lead frame are exposed on a bottom surface of the package body.  
     
     
       45. The light-emitting device package according to claim 21, wherein the light-emitting diode includes at least one light-emitting diode.  
     
     
       46. The light-emitting device package according to claim 45, further comprising a third wire,
 wherein the light-emitting diode include a first light-emitting diode and a second light-emitting diode, and   wherein the third wire includes a first end connected to the first light-emitting diode and a second end connected to the second light-emitting diode.    
     
     
       47. The light-emitting device package according to claim 21, wherein the second lead frame is spaced apart from the first lead frame in a first direction,
 wherein the hole includes a third inner surface and a fourth inner surface,   wherein the first inner surface and second inner surface face each other in the first direction,   wherein the third inner surface and fourth inner surface face each other in a second direction orthogonal to the first direction, and   wherein both the first inner surface and the second surface are connected with the third inner surface and the fourth inner surface.