USRE49175EActiveUtility
Semiconductor device including three voltage generator circuits and two transistors configured to short-circuit respective different combinations of the voltage generator circuits
Est. expiryJun 26, 2029(~3 yrs left)· nominal 20-yr term from priority
G11C 16/30G11C 16/26G11C 16/0483
52
PatentIndex Score
0
Cited by
42
References
28
Claims
Abstract
According to one embodiment, a semiconductor device includes a first voltage generator, a second voltage generator, a first MOS transistor, and a controller. The first voltage generator outputs a first voltage to a first node. The second voltage generator outputs a second voltage to a second node. The first MOS transistor is capable of short-circuiting the first node and second node. The controller performs a control operation to short-circuit the first node and second node by turning on the first MOS transistor. The controller controls a period in which the first MOS transistor is kept in an on state based on time.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1. A semiconductor device comprising:
a first voltage generator circuit which outputs a first voltage to a first node; a second voltage generator circuit which outputs a second voltage to a second node; a first MOS transistor capable of short-circuiting the first node and second node; and a controller which performs a control operation to short-circuit the first node and second node by turning on the first MOS transistor, controlling a period in which the first MOS transistor is kept in an on state based on time.
2. The device according to claim 1 , wherein a first load is connected to the first node, and a second load larger than the first load is connected to the second node,
when a potential of the first load reaches the second voltage in a case where the first voltage is higher than the second voltage at a read time, the controller turns off the first MOS transistor.
3. The device according to claim 1 , wherein a first load is connected to the first node, and a second load larger than the first load is connected to the second node,
in a case where the second voltage is higher than the first voltage at a read time, the controller turns off the first MOS transistor before a potential of the second load reaches the first voltage.
4. The device according to claim 1 , wherein the first MOS transistor is one of an n-type intrinsic MOS transistor, depression-type MOS transistor, and enhancement-type MOS transistor.
5. The device according to claim 1 , wherein the controller
senses a potential of the second node, and transfers a voltage equal to the sum of the above potential and a threshold voltage of the first MOS transistor to the gate of the first MOS transistor.
6. The device according to claim 1 , further comprising:
a third voltage generator circuit which outputs a third voltage to a third node; and a second MOS transistor capable of short-circuiting the second node and the third node, wherein the controller simultaneously performs on and off switching operations of the first MOS transistor and second MOS transistor.
7. The device according to claim 6 , wherein the controller
senses a potential of one of the second node and the third node, and transfers one of a first voltage equal to the sum of the above potential and a first threshold voltage of the first MOS transistor and a second voltage equal to the sum of the above potential and a second threshold voltage of the second MOS transistor to the gates of the first and second MOS transistors.
8. The device according to claim 1 , further comprising:
a memory cell array including plural memory cells whose current paths are serially connected and each of which includes a charge storage layer and control gate; and word lines connected to the control gates of the memory cells and each used as one of the first and second loads; wherein the first and second voltage generator circuits transfer one of the first and second voltages to the word lines.
9. A semiconductor device comprising:
a memory cell array including i memory cells (i is an integral number larger than 2) capable of holding data each of which includes a charge storage layer and control gate and the i memory cells are serially connected along a current path; and a voltage generator circuit which generates a first voltage and second voltage, transferring the first and second voltages to word lines connected to the control gates of the memory cells, wherein the voltage generator circuit transfers the first voltage to the word line connected to the control gate of the ith memory cell, and transfers the second voltage to the word lines connected to the control gates of the (i+1)th and (i+2)th memory cells which are arranged on a drain side of the ith memory cell.
10. The device according to claim 9 , wherein the first voltage is a voltage corresponding to data held by the ith memory cell.
11. The device according to claim 9 , further comprising:
a MOS transistor capable of short-circuiting a first node and second node; and a controller which performs a control operation to turn on the MOS transistor to short-circuit the first node and second node, wherein the voltage generator circuit includes a first voltage generator circuit which generates the first voltage and outputs the first voltage to the first node, and a second voltage generator circuit which generates the second voltage and outputs the second voltage to the second node, and the controller controls a period in which the MOS transistor is maintained in an on state based on time.
12. The device according to claim 11 , wherein the controller
senses a potential of the second node, and transfers a voltage equal to the sum of the above potential and a threshold voltage of the MOS transistor to the gate of the MOS transistor.
13. The device according to claim 9 , wherein the MOS transistor is one of an n-type intrinsic MOS transistor, depression-type MOS transistor, and enhancement-type MOS transistor.
14. The device according to claim 11 , wherein a word line used as a first load is connected to the first node, and a word line used as a second load larger than the first load is connected to the second node, and
in a case where the second voltage is higher than the first voltage, the controller turns off the first MOS transistor before a potential of the second load reaches the first voltage.
15. A control method of a semiconductor device comprising:
causing a first voltage generator circuit to generate a first voltage and output the first voltage to a first node; causing a second voltage generator circuit to generate a second voltage and output the second voltage to a second node; causing a controller to set a first MOS transistor in an on state and short-circuit the first node and second node; and causing the controller to control a period in which the first MOS transistor is maintained in the on state based on time.
16. The method according to claim 15 , further comprising:
causing the first voltage generator circuit to transfer the first voltage to a first load via the first node; causing the second voltage generator circuit to transfer the second voltage higher than the first voltage to a second load larger than the first load via the second node; and causing the controller to turn off the first MOS transistor before a potential of the second load reaches the first voltage.
17. The method according to claim 15 , further comprising:
causing the first voltage generator circuit to transfer the first voltage to a first load via the first node; causing the second voltage generator circuit to transfer the second voltage to a second load larger than the first load via the second node; and if the first voltage is higher than the second voltage at a read time, causing the controller to turn off the first MOS transistor at the timing of a potential of the first load reaching the second voltage.
18. The method according to claim 15 , further comprising:
causing the controller to sense a potential of the second node; and causing the controller to transfer a voltage equal to the sum of the above potential and a threshold voltage of the first MOS transistor to the gate of the first MOS transistor.
19. The method according to claim 15 , further comprising:
causing a third voltage generator circuit to generate a third voltage and output the third voltage to a third node; causing the controller to turn on the first and second MOS transistors and short-circuit the first to third nodes; and causing the controller to simultaneously perform on and off switching operations of the first and second MOS transistors.
20. The method according to claim 16 , further comprising:
transferring the first voltage to a control gate of an ith memory cell among plural memory cells whose current paths are serially connected via the first node at a data read time; and transferring the second voltage to a control gate of an (i+1)th memory cell arranged on a drain side of the ith memory cell via the second node.
21. A semiconductor device comprising:
a memory cell array including a plurality of memory cells each configured to store data; a plurality of word lines connected to gates of the memory cells, respectively; a first node to which a first voltage is supplied; a second node to which a second voltage is applied; a third node to which a third voltage is applied; a first MOS transistor connected between the first node and the second node and configured to equalize a voltage level of the first node and a voltage level of the second node by being turned on and short-circuiting the first node and the second node; a second MOS transistor connected between the second node and the third node and configured to equalize the voltage level of the second node and a voltage level of the third node by being turned on and short-circuiting the second node and the third node; a controller which performs a control operation to short circuit the first node and the second node by turning on the first MOS transistor, controlling a period in which the first MOS transistor is kept in an on state based on time, wherein a first period during which the first MOS transistor is turned on to short-circuit the first node and the second node and a second period during which the second MOS transistor is turned on to short-circuit the second node and the third node are changed, the voltage level of the first node is transferred to at least a first one of the word lines, the voltage level of the second node is transferred to at least a second one of the word lines, and the voltage level of the third node is transferred to at least a third one of the word lines.
22. The device according to claim 21, further comprising:
a first voltage generator circuitry including a first charge pump, and configured to output the first voltage to the first node; a second voltage generator circuitry including a second charge pump, and configured to output the second voltage to the second node; and a third voltage generator circuitry including a third charge pump, and configured to output the third voltage to the third node, wherein the second voltage is higher than the first voltage, and the first MOS transistor is turned on during the first period in which at least one of first voltage generator circuit and the second voltage generator circuit controls the voltage level of the first node and the voltage level of the second node toward the first voltage, and the first MOS transistor is turned off during a third period after the first period in which the second voltage generator circuit controls the voltage level of the second node toward the second voltage.
23. The device according to claim 22, wherein
the second MOS transistor is turned on during the second period, and the second MOS transistor is turned off during a fourth period after the second period in which the third voltage generator circuit controls the voltage level of the third node toward the third voltage.
24. The device according to claim 21, wherein
the first MOS transistor is one of an n-type intrinsic MOS transistor, a depression-type MOS transistor, and an enhancement-type MOS transistor.
25. The device according to claim 21, wherein
a voltage equal to a sum of the voltage level of the second node and a threshold voltage of the first MOS transistor is applied to a gate of the first MOS transistor.
26. The device according to claim 21, wherein
a voltage applied to gates of the first and second MOS transistors is one of
a voltage equal to a sum of the voltage level of the one of the second node and the third node and a threshold voltage of the first MOS transistor, and
a voltage equal to a sum of the voltage level of the one of the second node and the third node and a threshold voltage of the second MOS transistor.
27. The device according to claim 21, wherein
a signal is applied to a gate of the first MOS transistor and a gate of the second MOS transistor.
28. The device according to claim 21, wherein
the first MOS transistor is one of an n-type depletion MOS transistor with high withstand voltage or an n-type enhancement MOS transistor with high withstand voltage.Cited by (0)
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