Mounting module and antenna apparatus

Abstract

Disclosed is a mounting module, an antenna apparatus, and a method of manufacturing a mounting module. The mounting module includes a board; an antenna mounted on a first surface of the board, an RF circuit unit mounted on a second surface of the board, and a feeding line to electrically connect the RF circuit unit and the antenna through the board, thereby reducing a loss of signal power.

What is claimed is: 
     
       1. A module, comprising:
 a board; 
 antennas mounted on a first surface of the board configured for transmitting and/or receiving an RF signal; 
 an RF circuit unit mounted on a second surface of the board configured for processing the RF signal; 
 feeding lines connecting the RF circuit unit and the antennas through the board; 
 a frame disposed on the second surface of the board to enclose the RF circuit unit, 
 wherein one of the feeding lines comprises a first section disposed parallel to the antennas and a second section disposed perpendicular to the antennas, and an area of the board enclosed by the frame being filled with an epoxy molding compound (EMC) resin for electromagnetic wave shielding. 
 
     
     
       2. The module of  claim 1 , wherein the antennas comprise any one or any combination of a dipole antenna, a monopole antenna, and a patch antenna. 
     
     
       3. The module of  claim 2 , wherein when the antennas comprise the patch antenna, the patch antenna is disposed at an intermediate surface portion closer to a center of the first surface than either the dipole antenna or the monopole antenna. 
     
     
       4. The module of  claim 1 , further comprising an interlayer antenna disposed in the interior of the board. 
     
     
       5. The module of  claim 1 , further comprising a via antenna disposed adjacent to a side surface of the board. 
     
     
       6. The module of  claim 5 , wherein the via antenna is perpendicular to the first surface. 
     
     
       7. The module of  claim 5 , wherein the via antenna is implemented in consideration of at least one of a frequency, a wavelength, or an interlayer thickness of a Printed Circuit Board (PCB). 
     
     
       8. The module of  claim 1 , wherein the antennas comprise a patch antenna disposed between a monopole antenna and a dipole antenna. 
     
     
       9. The module of  claim 2 , wherein the RF circuit unit has a width smaller than a width of the board. 
     
     
       10. The module of  claim 8 , wherein a horizontal distance between the monopole antenna and the dipole antenna is greater than a width of the RF circuit unit. 
     
     
       11. The module of  claim 4 , wherein the interlayer antenna is disposed in a dipole antenna form. 
     
     
       12. The module of  claim 1 , wherein the first section is parallel to the first surface and the second section perpendicular the first surface. 
     
     
       13. A module, comprising:
 a board; 
 antennas mounted on a first surface of the board configured for transmitting and/or receiving an RF signal; 
 an RF circuit unit mounted on a second surface of the board configured for processing the RF signal; and 
 feeding lines connecting the RF circuit unit and the antennas through the board, 
 wherein one of the feeding lines comprises a first section disposed parallel to the antennas and a second section disposed perpendicular to the antennas, 
 wherein the antennas comprise any one or any combination of a dipole antenna, a monopole antenna, and a patch antenna, and 
 wherein in response to a number of dipole antennas and monopole antennas exceeding a number of patch antennas, a radiation pattern direction of the RF signal approaches the lateral direction of the mounting module. 
 
     
     
       14. A module, comprising:
 a board; 
 antennas mounted on a first surface of the board configured for transmitting and/or receiving an RF signal; 
 an RF circuit unit mounted on a second surface of the board configured for processing the RF signal; 
 feeding lines connecting the RF circuit unit and the antennas through the board; and 
 a via antenna disposed adjacent to a side surface of the board, 
 wherein one of the feeding lines comprises a first section disposed parallel to the antennas and a second section disposed perpendicular to the antennas, and 
 wherein the via antenna is disposed in a monopole antenna form in which two vias are connected to each other in series. 
 
     
     
       15. A module, comprising:
 a board comprising a first layer disposed above a second layer;   a dipole antenna disposed on the second layer;   a patch antenna disposed on the first layer;   a Radio Frequency (RF) circuit disposed on a lower surface of the board; and   feeding lines connecting the RF circuit to the dipole and patch antennas through the board,   a frame disposed on the lower surface of the board to enclose the RF circuit unit,   wherein the dipole antenna is disposed closer to an outside of the board than the patch antenna, and   wherein an area of the board enclosed by the frame is filled with an epoxy molding compound (EMC) resin for electromagnetic wave shielding.   
     
     
       16. The module of claim 15, wherein the feeding lines comprise first feeding lines connected to the dipole antenna and second feeding lines connected to the patch antenna. 
     
     
       17. The module of claim 16, wherein the feeding lines comprise vias extended to the RF circuit in a vertical direction. 
     
     
       18. The module of claim 15, wherein the patch antenna comprises a main-rectangular shape and four sub-rectangular shapes surrounding the main-rectangular shape in a vertical direction view, and
 wherein a size of each of the four sub-rectangular shapes is smaller than a size of the main-rectangular shape.   
     
     
       19. The module of claim 15, wherein the feeding lines are disposed on a layer below the first layer. 
     
     
       20. The module of claim 15, wherein the dipole antenna comprises a plurality of dipole antennas disposed along the outside of the board. 
     
     
       21. The module of claim 20, wherein the patch antenna comprises a plurality of patch antennas disposed closer to a center of the board than the plurality of dipole antennas. 
     
     
       22. A module, comprising:
 a board;   a patch antenna disposed on an upper layer of the board configured to transmit and/or receive a Radio Frequency (RF) signal;   an RF circuit disposed on a lower surface of the board configured to process the RF signal;   a frame disposed on the lower surface of the board to enclose the RF circuit unit;   a feeding line connecting the RF circuit and the patch antenna through the board; and   a dipole antenna disposed adjacent to a side surface of the board and below the upper layer,   wherein the feeding line comprises a first section disposed parallel to a plane of the patch antenna and a second section disposed perpendicular to the plane of the patch antenna, and   wherein an area of the board enclosed by the frame is filled with an epoxy molding compound (EMC) resin for electromagnetic wave shielding.   
     
     
       23. The module of claim 22, wherein the feeding line comprises a first feeding line connected to the patch antenna and a second feeding line connected to the dipole antenna. 
     
     
       24. The module of claim 23, wherein one or more of the first and second feeding lines comprise a via extended to the RF circuit in a vertical direction. 
     
     
       25. The module of claim 24, wherein the patch and dipole antennas comprise a plurality of patch and dipole antennas,
 wherein the plurality of dipole antennas are disposed closer to the side surface of the board than the plurality of patch antennas,   wherein the first and second feeding lines comprise a plurality of first and second feeding lines connecting the plurality of dipole and patch antennas to the RF circuit unit, and   wherein the via comprises a plurality of vias.   
     
     
       26. The module of claim 22, wherein the patch antenna comprises a plurality of patch antennas and the dipole antenna comprises a plurality of dipole antennas disposed closer to the side surface of the board than the plurality of patch antennas. 
     
     
       27. The module of claim 22, wherein the patch antenna comprises a main-rectangular shape and four sub-rectangular shapes surrounding the main-rectangular shape in a vertical direction view, and
 wherein a size of each of the four sub-rectangular shapes is smaller than a size of the main-rectangular shape.   
     
     
       28. The module of claim 22, wherein the dipole antenna comprises a plurality of dipole antennas disposed along the side surface of the board.