Memory element, memory apparatus

Abstract

A memory element including a layered structure including a memory layer having magnetization perpendicular to a film face in which a direction of the magnetization is changed depending on information stored therein, a magnetization-fixed layer having magnetization perpendicular to the film face, which becomes a base of the information stored in the memory layer, and an intermediate layer that is formed of a non-magnetic material and is provided between the memory layer and the magnetization-fixed layer.

What is claimed is: 
     
       1. A memory device, comprising:
 a memory layer with a plurality of ferromagnetic material layers, a non-magnetic layer, and a non-magnetic oxide layer; 
 a magnetization-fixed layer; and 
 an intermediate layer between the memory layer and the magnetization-fixed layer, 
 wherein,
 the plurality of ferromagnetic material layers include a first ferromagnetic material layer and a second ferromagnetic material layer, 
 the non-magnetic layer is in direct contact with the first ferromagnetic material layer and the non-magnetic oxide layer is in direct contact with the second ferromagnetic material layer, 
 the non-magnetic layer and the non-magnetic oxide layer are in direct contact with each other and are between the first ferromagnetic material layer and the second ferromagnetic material layer, 
 the memory layer includes a magnetization perpendicular to a film face of the memory layer and parallel to a thickness direction of the memory device, a direction of the magnetization being changeable, and 
 wherein a perpendicular direction of the magnetization of the memory layer is changeable by applying a current in the thickness direction of the memory device to record information in the memory layer, the first and second ferromagnetic material layers comprising a same ferromagnetic material and having a same direction of magnetization. 
 
 
     
     
       2. The memory device according to  claim 1 , wherein the non-magnetic layer is made of a metallic material layer and is not an oxide layer. 
     
     
       3. The memory device according to  claim 1 , wherein the non-magnetic layer of the memory layer includes at least one selected from the group consisting of Cu, Ag, Au, V, Ta, Zr, Nb, Hf, W, Mo, and Cr. 
     
     
       4. The memory device according to  claim 1 , wherein the magnetization-fixed layer has a fixed magnetization perpendicular to the film face and parallel to the thickness direction of the memory device. 
     
     
       5. The memory device according to  claim 1 , wherein the non-magnetic oxide layer includes at least one selected from the group consisting of silicon oxide, magnesium oxide, tantalum oxide, aluminum oxide, cobalt oxide, zirconium oxide, titanium oxide, and chromium oxide. 
     
     
       6. The memory device according to  claim 1 , wherein the first and second ferromagnetic material layers include a composition of Co, Fe, and B. 
     
     
       7. The memory device according to  claim 1 , wherein a thickness of the non-magnetic layer is equal to a thickness of the non-magnetic oxide layer. 
     
     
       8. The memory device according to  claim 1 , wherein the first and second ferromagnetic material layers have a same thickness. 
     
     
       9. The memory device according to  claim 1 , wherein the memory layer further comprises a third ferromagnetic material layer, a second non-magnetic layer, and a second non-magnetic oxide layer, the second non-magnetic layer and the second non-magnetic oxide layer between the third ferromagnetic material layer and the first or second ferromagnetic material layer. 
     
     
       10. The memory device according to  claim 9 , wherein the second non-magnetic layer is in direct contact with the first or second ferromagnetic material layer and the second non-magnetic oxide layer is in direct contact with the third ferromagnetic material layer. 
     
     
       11. The memory device according to  claim 9 , wherein the second non-magnetic oxide layer is in direct contact with the third ferromagnetic material layer. 
     
     
       12. A memory device, comprising:
 a first magnetization layer including a plurality of ferromagnetic material layers, a non-magnetic layer, and a non-magnetic oxide layer;   a second magnetization layer including a magnetic layer with a fixed magnetization direction; and   an intermediate layer between the first magnetization layer and the second magnetization layer,   wherein,
 the plurality of ferromagnetic material layers include a first ferromagnetic material layer and a second ferromagnetic material layer, 
 the non-magnetic layer is in direct contact with the first ferromagnetic material layer and the non-magnetic oxide layer is in direct contact with the second ferromagnetic material layer, 
 the non-magnetic layer and the non-magnetic oxide layer are in direct contact with each other and are between the first ferromagnetic material layer and the second ferromagnetic material layer, 
 the first magnetization layer includes a magnetization perpendicular to a film face of the first magnetization layer and parallel to a thickness direction of the memory device, a direction of the magnetization being changeable, and 
 wherein a perpendicular direction of the magnetization of the first magnetization layer is changeable by applying a current in the thickness direction of the memory device to record information in the first magnetization layer, the first and second ferromagnetic material layers each comprising a same ferromagnetic element and having a same direction of magnetization.  
   
     
     
       13. The memory device according to claim 12, wherein the non-magnetic layer includes a metallic material layer and is not an oxide layer.  
     
     
       14. The memory device according to claim 12, wherein the intermediate layer includes magnesium oxide.  
     
     
       15. The memory device according to claim 12, wherein the second magnetization layer has a fixed magnetization perpendicular to the film face and parallel to the thickness direction of the memory device.  
     
     
       16. The memory device according to claim 12, wherein the non-magnetic oxide layer includes at least one selected from the group consisting of silicon oxide, magnesium oxide, tantalum oxide, aluminum oxide, cobalt oxide, zirconium oxide, titanium oxide, and chromium oxide.  
     
     
       17. The memory device according to claim 12, wherein at least one of the first and second ferromagnetic material layers includes a composition of Co, Fe, and B.  
     
     
       18. The memory device according to claim 12, wherein a thickness of the second magnetization layer is larger than a thickness of the first magnetization layer.  
     
     
       19. The memory device according to claim 12, wherein the second magnetization layer includes a Ru layer.  
     
     
       20. The memory device according to claim 19, wherein the second magnetization layer further includes a CoPt layer, and wherein the CoPt layer is in direct contact with the Ru layer.  
     
     
       21. The memory device according to claim 20, wherein a thickness of the CoPt layer is larger than the Ru layer.  
     
     
       22. The memory device according to claim 12, wherein the memory device further includes an underlying layer, and wherein the underlying layer further includes a Ta layer.