Manufacturing method and electronic module with new routing possibilities

Abstract

Disclosed is an electronic module with high routing efficiency and other new possibilities in conductor design. The electronic module comprises a wiring layer ( 3 ), a component ( 1 ) having a surface with contact terminals ( 2 ) and first contact elements ( 6 ) that connect at least some of the contact terminals ( 2 ) to the wiring layer ( 3 ). The electronic module is provided with at least one conducting pattern ( 4 ) on the surface of the component ( 1 ) but spaced apart from the contact terminals ( 2 ). The electronic module further comprises a dielectric ( 5 ) and at least one second contact element ( 7 ) that connects the conducting pattern ( 4 ) to the wiring layer ( 3 ) through a portion of said dielectric ( 5 ). Methods of manufacturing such modules are also disclosed.An electronic module including a first wiring layer, a dielectric supporting the first wiring layer, wherein the first wiring layer is embedded in the dielectric, a component having a first surface and at least one contact terminal on the first surface, an additional passivation layer on the first surface of the component and in contact with the dielectric, a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, and at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern.

The invention claimed is: 
     
       1. An electronic module comprising:
 a first wiring layer,   a dielectric supporting the first wiring layer,   a component having a first surface and at least one contact terminal on the first surface, said at least one contact terminal having a contact bump protruding from the first surface of the component,   an additional passivation layer on the first surface of the component and in contact with the dielectric,   a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, wherein the contact bump and the conducting pattern are made of same material or materials and are similar in structure   at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, and   at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern.   
     
     
       2. The electronic module of  claim 1 , wherein the at least one first contact element comprises a plurality of first contact elements, and the at least one contact terminal comprises a contact terminal for each of the first contact elements. 
     
     
       3. The electronic module of  claim 1 , wherein the at least one second contact element comprises at least two second contact elements for making at least two electrical connection between the first wiring layer and the conducting pattern at at least two contact locations. 
     
     
       4. The electronic module of  claim 3 , wherein the first wiring layer comprises at least two separate conducting lines electrically connected to each other by means of the at least two second contact elements and the conducting pattern. 
     
     
       5. The electronic module of  claim 3 , wherein the first wiring layer comprises at least two separate conducting lines and at least one of said conducting lines crosses the conducting pattern between said at least two contact locations. 
     
     
       6. The electronic module according to  claim 1 , wherein the additional passivation layer contains polymer or epoxy. 
     
     
       7. The electronic module according to  claim 1 , wherein the thickness of the additional passivation layer is between 3 and 10 micrometers. 
     
     
       8. The electronic module according to  claim 1 , wherein the dielectric comprises a layer of insulating adhesive between the component and the first wiring layer. 
     
     
       9. The electronic module according to  claim 1 , wherein the first wiring layer, the conducting pattern, the component, the first contact elements, and the second contact elements are embedded in the dielectric. 
     
     
       10. The electronic module according to  claim 1 , wherein
 the first wiring layer comprises at least one conducting line,   the module comprises at least one electrically conducting path from the conducting pattern to the at least one contact terminal, and   each electrically conducting path from the conducting pattern to the at least one contact terminal passes through the at least one second contact element, the at least one conducting line, and the at least one first contact elements.   
     
     
       11. The electronic module of  claim 10 , wherein the at least one second contact element comprises at least two second contact elements for making at least two electrical connections between the first wiring layer and the conducting pattern at at least two contact locations. 
     
     
       12. The electronic module of  claim 11 , wherein the first wiring layer comprises at least two separate conducting lines electrically connected to each other by means of the at least two second contact elements and the conducting pattern, wherein the first wiring layer comprises at least two separate conducting lines and at least one of said conducting lines crosses the conducting pattern between said at least two contact locations. 
     
     
       13. The electronic module according to  claim 1 , having a spacing between the first wiring layer and the first surface of the component, wherein the spacing is less than 100 micrometers. 
     
     
       14. The electronic module according to  claim 1 , wherein the conducting pattern is a planar structure intended to be connected to a ground potential for proving a shield against electromagnetic interference between the component and the first wiring layer. 
     
     
       15. The electronic module according to  claim 1 , comprising a plurality of conducting patterns on the additional passivation layer on the first surface of the component, wherein each conducting pattern is spaced apart from each contact terminal. 
     
     
       16. The method of  claim 1 , wherein the method comprises:
 growing conductive material to form first contact elements, and   simultaneously growing conductive material to form the second contact elements.   
     
     
       17. An electronic module comprising:
 a first wiring layer,   a dielectric supporting the first wiring layer,   a component having a first surface and at least one contact terminal on the first surface, said at least one contact terminal having at least one contact bump protruding from the first surface of the component and having a thickness of less than 70 micrometers,   an additional passivation layer on the first surface of the component and in contact with the dielectric,   a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, wherein the conducting pattern has a thickness from a surface of the additional passivation layer of less than 70 micrometers,   at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, and
 at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern. 
   
     
     
       18. The electronic module according to  claim 17 , comprising a plurality of conducting patterns on the additional passivation layer on the first surface of the component, wherein each conducting pattern is spaced apart from each contact terminal. 
     
     
       19. An electronic module comprising:
 a first wiring layer,   a dielectric supporting the first wiring layer,   a component having a first surface and at least one contact terminal on the first surface,   an additional passivation layer on the first surface of the component and in contact with the dielectric,   a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal,   at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal, each of the at least one first contact element having a first height from the respective contact terminal to the respective portion of the first wiring layer, said first height being less than 70 micrometers, and each of the at least one first contact element having a maximum width in a direction parallel to the first surface of the component, said width being less than 100 micrometers, and
 at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern, each of the at least one second contact element has a second height from the respective conducting pattern to the respective portion of the first wiring layer, said second height being less than 70 micrometers. 
   
     
     
       20. The electronic module according to  claim 19 , comprising a plurality of conducting patterns on the additional passivation layer on the first surface of the component, wherein each conducting pattern is spaced apart from each contact terminal. 
     
     
       21. An electronic module comprising:
 a dielectric;   a first wiring layer embedded within the dielectric;   a component having a first surface and at least one contact terminal on the first surface, said at least one contact terminal having a contact bump protruding from the first surface of the component;   an additional passivation layer on the first surface of the component and in contact with the dielectric;   a conducting pattern on the additional passivation layer on the first surface of the component and spaced apart from each of the at least one contact terminal, wherein the contact bump and the conducting pattern are made of same material or materials and are similar in structure;   at least one first contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the at least one contact terminal; and   at least one second contact element extending inside the dielectric for making at least one electrical connection between the first wiring layer and the conducting pattern.   
     
     
       22. The electronic module of claim 21, wherein the at least one first contact element comprises a plurality of first contact elements, and the at least one contact terminal comprises a contact terminal for each of the plurality of first contact elements. 
     
     
       23. The electronic module of claim 21, wherein the at least one second contact element comprises at least two second contact elements for making at least two electrical connections between the first wiring layer and the conducting pattern at at least two contact locations. 
     
     
       24. The electronic module of claim 23, wherein the first wiring layer comprises at least two separate conducting lines electrically connected to each other by means of the at least two second contact elements and the conducting pattern. 
     
     
       25. The electronic module of claim 23, wherein the first wiring layer comprises at least two separate conducting lines, and at least one of said two separate conducting lines crosses the conducting pattern between said at least two contact locations. 
     
     
       26. The electronic module of claim 21, wherein the additional passivation layer contains polymer or epoxy. 
     
     
       27. The electronic module of claim 21, wherein a thickness of the additional passivation layer is between 3 and 10 micrometers. 
     
     
       28. The electronic module of claim 21, wherein the dielectric comprises a layer of insulating adhesive between the component and the first wiring layer. 
     
     
       29. The electronic module of claim 21, wherein the conducting pattern, the component, the at least one first contact element, and the at least one second contact element are embedded in the dielectric. 
     
     
       30. The electronic module of claim 21, further comprising:
 at least one electrically conducting path from the conducting pattern to the at least one contact terminal,   wherein the first wiring layer comprises at least one conducting line, and   wherein the at least one electrically conducting path from the conducting pattern to the at least one contact terminal passes through the at least one second contact element, the at least one conducting line, and the at least one first contact element.   
     
     
       31. The electronic module of claim 30, wherein the at least one second contact element comprises at least two second contact elements for making at least two electrical connections between the first wiring layer and the conducting pattern at at least two contact locations. 
     
     
       32. The electronic module of claim 31, wherein the first wiring layer comprises at least two separate conducting lines electrically connected to each other by means of the at least two second contact elements and the conducting pattern, and
 wherein at least one of said two separate conducting lines crosses the conducting pattern between said at least two contact locations.   
     
     
       33. The electronic module of claim 21, wherein the conducting pattern is a planar structure configured to be connected to a ground potential to thereby act as a shield against electromagnetic interference between the component and the first wiring layer. 
     
     
       34. The electronic module of claim 21, further comprising a plurality of conducting patterns on the additional passivation layer on the first surface of the component,
 wherein each of the plurality of conducting patterns is spaced apart from each of the at least one contact terminal.