Semiconductor device for preventing an increase in resistance difference of an electrode layer

Abstract

A semiconductor device of the embodiment includes a stacked body, a first insulating layer, first and second staircase portions 2, and a second insulating layer 46. The stacked body includes a first electrode layer 41 (WLDD) and a second electrode layer 41 (SGD). The first and second staircase portions 2 are provided in a first end portion 101 a second end region 102. The second insulating layer 46 extends in the X-direction. The second insulating layer divides the second electrode layer 41 (SGD) in the X-direction direction. A length L 1 in the X-direction of the second insulating layer 46 is longer than a length L 2 in the x-direction of the second electrode layer 41 (SGD) and shorter than a length L 3 in the X-direction of the first electrode layer 41 (WLDD).

The invention claimed is: 
     
         1 . A semiconductor device comprising:
 a stacked body including a first electrode layer and a second electrode layer provided to be electrically insulated from the first electrode layer in a stacking direction, the stacked body including a first staircase portion provided in a first end region in a first direction intersecting the stacking direction, and a second staircase portion provided in a second end region located on a side opposite to the first end region in the first region;   at least two first insulating layers provided in the stacked body to range from an upper end of the stacked body to a lower end of the stacked body, and extending in a the first directionintersecting the stacking direction;   a first staircase portion provided in a first end region of the stacked body between the at least two first insulating layers;   a second staircase portion provided in a second end region of the stacked body located on a side opposite to the first end region between the at least two first insulating layers; and;   at least two second insulating layers provided in the stacked body to range from the upper end of the stacked body to the lower end of the stacked body, and extending in the first direction;    a second third insulating layer extending in the first direction, provided in the stacked body between the at least two first insulating layers, one of the at least two first insulating layers and one of the at least two second insulating layers, and dividing the second electrode layer in the first direction, the third direction intersecting the stacking direction and the first direction;   a plurality of first column-shaped portions extending in the stacking direction through the stacked body and arranged in at least four rows each extending in the first direction between the one of the at least two first insulating layers and the third insulating layer; and   a plurality of second column-shaped portions extending in the stacking direction through the stacked body and arranged in at least four rows each extending in the first direction between the one of the at least two second insulating layers and the third insulating layer,   wherein a length in the first direction of the second third insulating layer being is longer than a length in the first direction of the second electrode layer and shorter than a length in the first direction of the second first electrode layer.   
     
     
         2 . The device according to  claim 1 , wherein
 the first electrode layer is a word line, and   the second electrode layer is a selection gate layer.   
     
     
         3 . The device according to  claim 2 , wherein the word line is a dummy word line. 
     
     
         4 . The device according to  claim 1 , wherein
 the stacked body includes a plurality of first column-shaped portion provided in an intermediate region of the stacked body located between the first end region and the second end region, the first column-shaped portion extending in the stacking direction, and   the first column-shaped portion includes: portions each includes: 
 a semiconductor body extending in the stacking direction; and 
 a charge storage portion provided between the semiconductor body and the first electrode layer, and 
   the plurality of second column-shaped portions each includes:
 a semiconductor body extending in the stacking direction; and  
 a charge storage portion provided between the semiconductor body and the first electrode layer. 
   
     
     
         5 . A semiconductor device comprising:
 a stacked body including a first electrode layer, a second electrode layer, and a third electrode layer, the second electrode layer provided to be electrically insulated from the first electrode layer in a stacking direction, the third electrode layer interposed between the second electrode layer and the first electrode layer in the stacking direction and provided to be electrically insulated from the second electrode layer, the stacked body including a first staircase portion provided in a first end region in a first direction intersecting the stacking direction, and a second staircase portion provided in a second end region located on a side opposite to the first end region in the first region;   at least two first insulating layers provided in the stacked body to range from an upper end of the stacked body to a lower end of the stacked body, and extending in a the first directionintersecting the stacking direction;   a first staircase portion provided in a first end region of the stacked body between the at least two first insulating layers;   a second staircase portion provided in a second end region of the stacked body located on a side opposite to the first end region between the at least two first insulating layers;   a second insulating layer extending in the first direction, the second insulating layer provided in the stacked body between the at least two first insulating layers, and dividing the second electrode layer in the first direction; and   an interconnection electrically connecting the first electrode layer and the third electrode layer in the stacked body.;   at least two second insulating layers provided in the stacked body to range from the upper end of the stacked body to the lower end of the stacked body, and extending in the first direction;   a third insulating layer extending in the first direction, the third insulating layer provided in the stacked body between one of the at least two first insulating layers and one of the at least two second insulating layers, and dividing the second electrode layer in a third direction intersecting the stacking direction and the first direction;   a plurality of first column-shaped portions extending in the stacking direction through the stacked body and arranged in at least four rows each extending in the first direction between the one of the at least two first insulating layers and the third insulating layer;   a plurality of second column-shaped portions extending in the stacking direction through the stacked body and arranged in at least four rows each extending in the first direction between the one of the at least two second insulating layers and the third insulating layer; and   an interconnection electrically connecting the first electrode layer and the third electrode layer.    
     
     
         6 . The device according to  claim 5 , wherein
 the first electrode layer is a first word line,   the second electrode layer is a selection gate layer, and   the third electrode layer is a second word line.   
     
     
         7 . The device according to  claim 6 , wherein
 the first word line is a first dummy word line, and   the second word line is a second dummy word line.   
     
     
         8 . The device according to  claim 6 , wherein the secondthird insulating layer divides the first word line in the firstthird direction. 
     
     
         9 . The device according to  claim 5 , wherein
 the stacked body includes a first column-shaped portion provided in an intermediate region of the stacked body located between the first end region and the second end region, the first column-shaped portion extending in the stacking direction, and   the first column-shaped portion includes:   the plurality of first column-shaped portions each includes:
 a semiconductor body extending in the stacking direction; and   a charge storage portion provided between the semiconductor body and the first electrode layer, and     the plurality of second column-shaped portions each includes: 
 a semiconductor body extending in the stacking direction; and 
 a charge storage portion provided between the semiconductor body and the first electrode layer. 
   
     
     
         10 . The device according to  claim 5 , wherein
 the interconnection is provided outside the stacked body, and   the interconnection is provided above at least one of the first end region and the second end region. below the third insulating layer.    
     
     
         11 . The device according to  claim 5 , wherein
 the interconnection is provided in the stacked body, and   the interconnection is provided below the second insulating layer.   
     
     
         12 . The device according to  claim 11 , wherein
 the stacked body includes a second column-shaped portion penetrating the second insulating layer and extending in the stacking direction,   the second column-shaped portion has the same structure as the fiat column-shaped portion, and   the interconnection is provided along the second column-shaped portion.   
     
     
         13 . A semiconductor device, comprising:
 a stacked body including a first electrode layer, a second electrode layer provided to be electrically insulated from the first electrode layer in a stacking direction, and a third electrode layer provided to be electrically insulated from the second electrode layer in the stacking direction;   at least two first insulating layers provided in the stacked body to range from an upper end of the stacked body to a lower end of the stacked body, and extending in a first direction intersecting the stacking direction;   a first staircase portion provided in a first end region of the stacked body between the at least two first insulating layers;   a second staircase portion provided in a second end region of the stacked body located on a side opposite to the first end region between the at least two first insulating layers;   a second insulating layer extending in the first direction, the second insulating layer provided in the stacked body between the at least two first insulating layers, and dividing the second electrode layer and the third electrode layer in the first direction; and   an interconnection electrically connecting the second electrode layer and the third electrode layer in the stacked body.   
     
     
         14 . The device according to  claim 13 , wherein
 the first electrode layer is a word line,   the second electrode layer is a first selection gate layer, and   the third electrode layer is a second selection gate layer.   
     
     
         15 . The device according to  claim 14 , wherein the word line is a dummy word line. 
     
     
         16 . The device according to  claim 13 , wherein
 the stacked body includes a first column-shaped portion provided in an intermediate region of the stacked body located between the first end region and the second end region, the first column-shaped portion extending in the stacking direction, and   the first column-shaped portion includes:
 a semiconductor body extending in the stacking direction; and 
 a charge storage portion provided between the semiconductor body and the first electrode layer. 
   
     
     
         17 . The device according to  claim 13 , wherein
 the interconnection is provided in the stacked body, and   the interconnection is provided along the second insulating layer.   
     
     
         18 . The device according to  claim 13 , further comprising a third insulating layer extending in the first direction, the third insulating layer provided in the stacked body between the first insulating layer and the second insulating layer, and dividing the second electrode layer and the third electrode layer in the first direction. 
     
     
       19. The device according to  claim 1 , wherein:
 the first staircase portion is provided in the first end region of the stacked body between the at least two first insulating layers; and   the second staircase portion is provided in the second end region of the stacked body located on the side opposite to the first end region between the at least two first insulating layers.    
     
     
       20. The device according to  claim 19 , wherein
 the plurality of first column-shaped portions are provided in an intermediate region of the stacked body located between the first end region and the second end region, and   the plurality of second column-shaped portions are provided in the intermediate region of the stacked body.    
     
     
       21. The device according to  claim 10 , further comprising a third column-shaped portion extending in the stacked body in the stacking direction, wherein
 the third insulating layer extends in the third column-shaped portion in the stacking direction,   the third column-shaped portion has the same structure as one of the plurality of first column-shaped portions, and   the interconnection is provided along the third column-shaped portion.    
     
     
       22. The device according to  claim 5 , wherein:
 the first staircase portion provided in the first end region of the stacked body between the at least two first insulating layers; and   the second staircase portion provided in the second end region of the stacked body located on the side opposite to the first end region between the at least two first insulating layers.    
     
     
       23. The device according to  claim 22 , wherein
 the plurality of first column-shaped portions are provided in an intermediate region of the stacked body located between the first end region and the second end region, and   the plurality of second column-shaped portions are provided in the intermediate region of the stacked body.    
     
     
       24. The device according to  claim 22 , wherein
 the interconnection is provided outside the stacked body, and   the interconnection is provided above at least one of the first end region and the second end region.    
     
     
       25. The device according to  claim 5 , wherein the interconnection electrically connecting the first electrode layer and the third electrode layer in the stacked body.  
     
     
       26. A semiconductor device, comprising:
 a stacked body including a first electrode layer, a second electrode layer provided to be electrically insulated from the first electrode layer in a stacking direction, and a third electrode layer provided to be electrically insulated from the second electrode layer in the stacking direction, the stacked body including a first staircase portion provided in a first end region in a first direction intersecting the stacking direction, and a second staircase portion provided in a second end region located on a side opposite to the first end region in the first region;   at least two first insulating layers provided in the stacked body to range from an upper end of the stacked body to a lower end of the stacked body, and extending in the first direction;   at least two second insulating layers provided in the stacked body to range from the upper end of the stacked body to the lower end of the stacked body, and extending in the first direction;   a third insulating layer extending in the first direction, the third insulating layer provided in the stacked body between one of the at least two first insulating layers and one of the at least two second insulating layers, and dividing the second electrode layer and the third electrode layer in a third direction intersecting the stacking direction and the first direction;   a plurality of first column-shaped portions extending in the stacking direction through the stacked body and arranged in at least four rows each extending in the first direction between the one of the at least two first insulating layers and the third insulating layer;   a plurality of second column-shaped portions extending in the stacking direction through the stacked body and arranged in at least four rows each extending in the first direction between the one of the at least two second insulating layers and the third insulating layer; and   an interconnection electrically connecting the second electrode layer and the third electrode layer.   
     
     
       27. The device according to  claim 26 , wherein
 the first electrode layer is a word line,   the second electrode layer is a first selection gate layer, and   the third electrode layer is a second selection gate layer.    
     
     
       28. The device according to  claim 27 , wherein the word line is a dummy word line.  
     
     
       29. The device according to  claim 27 , further comprising a fifth insulating layer extending in the first direction, the fifth insulating layer provided in the stacked body between one of the at least two first insulating lavers and the third insulating layer, and dividing the second electrode layer and the third electrode layer in the third direction.  
     
     
       30. The device according to  claim 26 , wherein
 the plurality of first column-shaped portions each includes:
 a semiconductor body extending in the stacking direction; and 
 a charge storage portion provided between the semiconductor body and the first electrode layer, and 
   the plurality of second column-shaped portions each includes:
 a semiconductor body extending in the stacking direction; and 
 a charge storage portion provided between the semiconductor body and the first electrode layer.  
   
     
     
       31. The device according to  claim 26 , wherein
 the interconnection is provided in the stacked body, and   the interconnection is provided along the third insulating layer.    
     
     
       32. The device according to  claim 26 , further comprising:
 the first staircase portion provided in the first end region of the stacked body between the at least two first insulating layers; and   the second staircase portion provided in the second end region of the stacked body located on the side opposite to the first end region between the at least two first insulating layers.    
     
     
       33. The device according to  claim 26 , wherein the interconnection electrically connecting the second electrode layer and the third electrode layer in the stacked body.