Electronic device

Abstract

Disclosed is an electronic device including a shielding member. The electronic device includes a substrate having an electric element mounted thereon; a shield can mounted on the electric element and including an opening formed at a part facing the electric element; a shielding member mounted around a part in which the opening is formed on an outer surface of the shield can, and electrically connected to the shield can; a metal plate mounted on the shielding member, with the opening covered, and electrically connected to the shielding member; and a heat conductive member mounted in the opening and interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate.

What is claimed is: 
     
         1 . An electronic device comprising:
 a substrate on which an electric element is disposed;   a shield can mounted disposed on the substrate to surround the electric element and including a first opening formed at a part facing the electric element;   a shielding member mounted around the first opening of the shield can and electrically connected to the shield can, the shielding member including a second opening formed at a second part facing the first opening of the shield can;   a metal plate mounted on the shielding member, with the second opening covered, and electrically connected to the shielding member;   at least one insulation film mounted on the metal plate and including a first surface facing the metal plate and a second surface opposite to the first surface;   at least one cooling member mounted on the second surface of the at least one insulation film; and   a heat conductive member mounted positioned in the first opening and the second opening, interposed between the electric element and the metal plate, and in contact with the electric element and the metal plate,   wherein the shielding member is configured to be elastic and to be compressed by an external force,   wherein the shielding member comprises a body surrounded by a shielding film that includes a nanofiber film,   wherein the at least one cooling member comprises a heat pipe and a bracket,   wherein the heat pipe is engaged with the at least one insulation film, for receiving heat generated from the electric element through the metal plate and the heat conductive member and cooling the received heat, and   wherein the bracket is engaged with the heat pipe, while being supported by the heat pipe, for absorbing and dissipating the heat of the heat pipe.   
     
     
         2 . The electronic device of  claim 1 , wherein the heat conductive member includes a carbon fiber sheet, and the metal plate includes a copper (Cu) plate. 
     
     
         3 . The electronic device of  claim 1 , further comprising
 a mounting insulation film for mounting the heat pipe thereon.   
     
     
         4 . The electronic device of  claim 1 , wherein the body is formed of polyurethane (PU) foam. 
     
     
         5 . The electronic device of  claim 1 , wherein the heat conductive member includes at least one of a liquid thermal interface material (TIM) and a solid TIM. 
     
     
         6 . The electronic device of  claim 4 , wherein the body includes a magnetic material to increase a shielding force. 
     
     
         7 . The electronic device of  claim 1 , wherein the shielding member further comprises at least one engagement protrusion to be engaged with at least one protrusion groove formed in the shield can. 
     
     
         8 . The electronic device of  claim 1 , wherein the at least one insulation film comprises an insertion through hole for allowing the heat pipe to be inserted therethrough, to connect the metal plate directly to the heat pipe, and
 wherein an insulation coating is applied on an exterior of the heat pipe.   
     
     
         9 . The electronic device of  claim 1 ,
 wherein the shielding member surrounds a side surface of the electric element.   
     
     
         10 . The electronic device of  claim 1 ,
 wherein the shielding member surrounds a side surface of the electric element, and   wherein the metal plate the shielding member and the electric element.   
     
     
         11 . The electronic device of  claim 10 , wherein an overall shape of the metal plate is an n-shape, and each of both ends of the metal plate is shaped into one of a U-shape and an L-shape. 
     
     
         12 . A method for assembling an electronic device, the method comprising:
 creating a substrate including an electric element mounted thereon;   disposing a shield can including at least one first opening at a part facing the electric element on the substrate;   disposing a shielding member to cover a first surface of the shield can, the shielding member being compressed when being pressed, and including at least one second opening for discharging heat from the electric element, and a shielding film engaged with an exterior of the shielding member;   disposing a metal plate to cover a first surface of the shielding member, mounting a heat conductive member on a first surface of the metal plate, mounting an insulation film on a second surface opposite to the first surface of the metal plate, and disposing the heat conductive member to face a first surface of the electric element, in engagement with the at least one first and second openings; and   mounting the metal plate on a first surface of the insulation film, and mounting at least one cooling member on a second surface opposite to the first surface of the insulation film,   wherein the insulation film transfers heat from the heat conductive member to the at least one cooling member through the metal plate,   wherein the at least one cooling member comprises a first cooling member and a second cooling member,   wherein the first cooling member includes a heat pipe engaged with the insulation film included in the electronic device, for receiving heat generated from the electric element through the metal plate and the heat conductive member, and cooling the received heat, and   wherein the second cooling member includes a bracket engaged with the first cooling member, while being supported by the first cooling member, for absorbing and dissipating the heat of the first cooling member.   
     
     
         13 . The method of  claim 12 , wherein when the at least one cooling member is pressed down, the shielding member is compressed, and the heat conductive member is moved to contact the electric element. 
     
     
         14 . The method of  claim 12 , wherein the shielding film is fabricated by cutting a nanofiber film. 
     
     
         15 . The method of  claim 14 ,
 wherein the cut shielding film is placed on a fixing jig.   
     
     
         16 . The method of  claim 12 ,
 wherein a body of the shielding member is engaged inside the shielding film.   
     
     
         17 . The method of  claim 16 ,
 wherein the body is formed of polyurethane foam.   
     
     
         18 . The method of  claim 16 ,
 wherein at least one engagement member protrudes outward from the shielding film and is folded and fixedly engaged with the body by at least one engagement jig.