Assignee
ABE YOSHIYUKI
JP·13 granted patents·7 pending applications·67 citations·filing 2004–2012
Top patents by PatentIndex Score
20 records- 0194US9544694B2Piezoelectric element, piezoelectric vibration module, and methods of manufacturing the sameABE YOSHIYUKI·Filed 2012·Granted Jan 10, 2017·30 cites·43 claims
- 0287US8276919B2Hydraulic cylinderABE YOSHIYUKI·Filed 2010·Granted Oct 2, 2012·7 cites·7 claims
- 0383US8156856B2Hydraulic cylinderABE YOSHIYUKI·Filed 2009·Granted Apr 17, 2012·9 cites·5 claims
- 0482US8084334B2Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting regionABE YOSHIYUKI·Filed 2011·Granted Dec 27, 2011·4 cites·5 claims
- 0581US8551370B2Oxide sintered body, manufacturing method therefor, manufacturing method for transparent conductive film using the same, and resultant transparent conductive filmABE YOSHIYUKI·Filed 2012·Granted Oct 8, 2013·3 cites·1 claims
- 0680US8542424B2Black coating film and production method therefor, black light shading plate, and diaphragm, diaphragm device for light intensity adjustment, shutter using the same, and heat resistant light shading tapeABE YOSHIYUKI·Filed 2009·Granted Sep 24, 2013·7 cites·39 claims
- 0775US8214678B2Serial data transfer apparatusABE YOSHIYUKI·Filed 2009·Granted Jul 3, 2012·5 cites·18 claims
- 0866US8546244B2Method of manufacturing semiconductor deviceABE YOSHIYUKI·Filed 2012·Granted Oct 1, 2013·2 cites·18 claims
- 0963US2008210551A1Target for Transparent Conductive Thin Film, Transparent Conductive Thin Film and Manufacturing Method Thereof, Electrode Material for Display, and Organic Electroluminescence ElementABE YOSHIYUKI·Filed 2007·Application pending·0 cites
- 1060US8612790B2Serial data transfer apparatusABE YOSHIYUKI·Filed 2012·Granted Dec 17, 2013·0 cites·9 claims
- 1156US2012089757A1Serial data transfer apparatusABE YOSHIYUKI·Filed 2011·Application pending·0 cites
- 1255US2009117709A1Manufacturing method of semiconductor integrated circuit deviceABE YOSHIYUKI·Filed 2008·Application pending·0 cites
- 1352US8772135B2Semiconductor device manufacturing method using laser irradiation and dicing saw and semiconductor device thereofABE YOSHIYUKI·Filed 2011·Granted Jul 8, 2014·0 cites·14 claims
- 1450US8941002B2Oxide evaporation material, vapor-deposited thin film, and solar cellABE YOSHIYUKI·Filed 2011·Granted Jan 27, 2015·0 cites·16 claims
- 1549US8574464B2Oxide evaporation material, transparent conducting film, and solar cellABE YOSHIYUKI·Filed 2010·Granted Nov 5, 2013·0 cites·4 claims
- 1645US2007141752A1Manufacturing method of semiconductor integrated circuit deviceABE YOSHIYUKI·Filed 2006·Application pending·0 cites
- 1743US2008000388A1Gas Barrier Transparent Resin Substrate Method for Manufacturing Thereof, and Flexible Display Element Using Barrier Transparent Resin SubstrateABE YOSHIYUKI·Filed 2004·Application pending·0 cites
- 1841US9349885B2Multilayer transparent electroconductive film and method for manufacturing same, as well as thin-film solar cell and method for manufacturing sameABE YOSHIYUKI·Filed 2011·Granted May 24, 2016·0 cites·12 claims
- 1939US2012145187A1Method for treatment of iron-based metal surface exposed to superheated steamABE YOSHIYUKI·Filed 2010·Application pending·0 cites
- 2039US2012024381A1Transparent conductive film and transparent conductive film laminated body and production method of same, and silicon-based thin film solar cellABE YOSHIYUKI·Filed 2010·Application pending·0 cites
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