Assignee
APTOS CORP
US15 patents
Top patents by PatentIndex Score
US6362087B1Mar 26, 2002
Method for fabricating a microelectronic fabrication having formed therein a redistribution structure
APTOS CORP289 citations97
US7008867B2Mar 7, 2006
Method for forming copper bump antioxidation surface
APTOS CORP179 citations93
US6913946B2Jul 5, 2005
Method of making an ultimate low dielectric device
APTOS CORP28 citations92
US6674173B1Jan 6, 2004
Stacked paired die package and method of making the same
APTOS CORP26 citations92
US6448171B1Sep 10, 2002
Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondability
APTOS CORP43 citations92
US6424037B1Jul 23, 2002
Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
APTOS CORP39 citations92
US6316831B1Nov 13, 2001
Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
APTOS CORP28 citations92
US6281041B1Aug 28, 2001
Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ball
APTOS CORP18 citations92
US7078272B2Jul 18, 2006
Wafer scale integration packaging and method of making and using the same
APTOS CORP24 citations89
US7208344B2Apr 24, 2007
Wafer level mounting frame for ball grid array packaging, and method of making and using the same
APTOS CORP31 citations87
US6784089B2Aug 31, 2004
Flat-top bumping structure and preparation method
APTOS CORP18 citations80
US6544878B2Apr 8, 2003
Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier properties
APTOS CORP9 citations74
US6635585B1Oct 21, 2003
Method for forming patterned polyimide layer
APTOS CORP12 citations70
US7141875B2Nov 28, 2006
Flexible multi-chip module and method of making the same
APTOS CORP3 citations60
US6846360B2Jan 25, 2005
Apparatus and method for bubble-free application of a resin to a substrate
APTOS CORP7 citations58