Assignee
APTOS CORP
US·15 granted patents·3 pending applications·754 citations·filing 1999–2004
Top patents by PatentIndex Score
18 records- 0196US6362087B1Method for fabricating a microelectronic fabrication having formed therein a redistribution structureAPTOS CORP·Filed 2000·Granted Mar 26, 2002·289 cites·15 claims
- 0292US7008867B2Method for forming copper bump antioxidation surfaceAPTOS CORP·Filed 2003·Granted Mar 7, 2006·179 cites·12 claims
- 0390US6424037B1Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ballAPTOS CORP·Filed 2001·Granted Jul 23, 2002·39 cites·6 claims
- 0484US6448171B1Microelectronic fabrication having formed therein terminal electrode structure providing enhanced passivation and enhanced bondabilityAPTOS CORP·Filed 2000·Granted Sep 10, 2002·43 cites·11 claims
- 0582US6316831B1Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier propertiesAPTOS CORP·Filed 2000·Granted Nov 13, 2001·28 cites·14 claims
- 0677US6913946B2Method of making an ultimate low dielectric deviceAPTOS CORP·Filed 2003·Granted Jul 5, 2005·28 cites·27 claims
- 0777US6674173B1Stacked paired die package and method of making the sameAPTOS CORP·Filed 2003·Granted Jan 6, 2004·26 cites·34 claims
- 0875US7208344B2Wafer level mounting frame for ball grid array packaging, and method of making and using the sameAPTOS CORP·Filed 2004·Granted Apr 24, 2007·31 cites·32 claims
- 0968US6784089B2Flat-top bumping structure and preparation methodAPTOS CORP·Filed 2003·Granted Aug 31, 2004·18 cites·28 claims
- 1067US7078272B2Wafer scale integration packaging and method of making and using the sameAPTOS CORP·Filed 2004·Granted Jul 18, 2006·24 cites·16 claims
- 1167US6635585B1Method for forming patterned polyimide layerAPTOS CORP·Filed 2000·Granted Oct 21, 2003·12 cites·14 claims
- 1263US6544878B2Microelectronic fabrication having formed therein terminal electrode structure providing enhanced barrier propertiesAPTOS CORP·Filed 2001·Granted Apr 8, 2003·9 cites·12 claims
- 1362US6281041B1Process to make a tall solder ball by placing a eutectic solder ball on top of a high lead solder ballAPTOS CORP·Filed 1999·Granted Aug 28, 2001·18 cites·12 claims
- 1447US7141875B2Flexible multi-chip module and method of making the sameAPTOS CORP·Filed 2004·Granted Nov 28, 2006·3 cites·59 claims
- 1545US6846360B2Apparatus and method for bubble-free application of a resin to a substrateAPTOS CORP·Filed 2003·Granted Jan 25, 2005·7 cites·12 claims
- 1636US2006001145A1Wafer level mounting frame with passive components integration for ball grid array packagingAPTOS CORP·Filed 2004·Application pending·0 cites
- 1732US2004166662A1MEMS wafer level chip scale packageAPTOS CORP·Filed 2003·Application pending·0 cites
- 1832US2004256719A1MEMS micro-cap wafer level chip scale packageAPTOS CORP·Filed 2003·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →