Assignee
ARANA LEONEL R
US·1 granted patent·4 pending applications·1 citations·filing 2005–2010
Top patents by PatentIndex Score
5 records- 0155US8674519B2Microelectronic package and method of manufacturing sameARANA LEONEL R·Filed 2010·Granted Mar 18, 2014·1 cites·15 claims
- 0249US2007241448A1Electrically-isolated interconnects and seal rings in packages using a solder preformARANA LEONEL R·Filed 2007·Application pending·0 cites
- 0344US2008251932A1Method of forming through-silicon vias with stress buffer collars and resulting devicesARANA LEONEL R·Filed 2008·Application pending·0 cites
- 0437US2008237841A1Microelectronic package, method of manufacturing same, and system including sameARANA LEONEL R·Filed 2007·Application pending·0 cites
- 0532US2007004171A1Method of supporting microelectronic wafer during backside processing using carrier having radiation absorbing film thereonARANA LEONEL R·Filed 2005·Application pending·0 cites
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