Assignee
ARVIN CHARLES L
US·21 granted patents·2 pending applications·72 citations·filing 2007–2012
Top patents by PatentIndex Score
23 records- 0196US8177945B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2007·Granted May 15, 2012·17 cites·20 claims
- 0293US8803317B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2012·Granted Aug 12, 2014·5 cites·15 claims
- 0393US8298930B2Undercut-repair of barrier layer metallurgy for solder bumps and methods thereofARVIN CHARLES L·Filed 2010·Granted Oct 30, 2012·16 cites·19 claims
- 0489US8637392B2Solder interconnect with non-wettable sidewall pillars and methods of manufactureARVIN CHARLES L·Filed 2010·Granted Jan 28, 2014·9 cites·23 claims
- 0581US8742578B2Solder volume compensation with C4 processARVIN CHARLES L·Filed 2012·Granted Jun 3, 2014·6 cites·10 claims
- 0681US8232655B2Bump pad metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2008·Granted Jul 31, 2012·9 cites·20 claims
- 0779US9035459B2Structures for improving current carrying capability of interconnects and methods of fabricating the sameARVIN CHARLES L·Filed 2009·Granted May 19, 2015·1 cites·10 claims
- 0878US8784618B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2010·Granted Jul 22, 2014·1 cites·9 claims
- 0975US8299611B2Ball-limiting-metallurgy layers in solder ball structuresARVIN CHARLES L·Filed 2009·Granted Oct 30, 2012·5 cites·12 claims
- 1069US8493746B2Additives for grain fragmentation in Pb-free Sn-based solderARVIN CHARLES L·Filed 2010·Granted Jul 23, 2013·2 cites·14 claims
- 1168US8623194B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Jan 7, 2014·0 cites·18 claims
- 1266US8551303B2Multi-anode system for uniform plating of alloysARVIN CHARLES L·Filed 2012·Granted Oct 8, 2013·0 cites·20 claims
- 1365US9347147B2Method and apparatus for controlling and monitoring the potentialARVIN CHARLES L·Filed 2012·Granted May 24, 2016·0 cites·16 claims
- 1464US8926820B2Working electrode design for electrochemical processing of electronic componentsARVIN CHARLES L·Filed 2012·Granted Jan 6, 2015·0 cites·6 claims
- 1561US8450619B2Current spreading in organic substratesARVIN CHARLES L·Filed 2010·Granted May 28, 2013·1 cites·20 claims
- 1659US9062388B2Method and apparatus for controlling and monitoring the potentialARVIN CHARLES L·Filed 2010·Granted Jun 23, 2015·0 cites·9 claims
- 1755US9222194B2Rinsing and drying for electrochemical processingARVIN CHARLES L·Filed 2010·Granted Dec 29, 2015·0 cites·16 claims
- 1850US8592976B2Ball-limiting-metallurgy layers in solder ball structuresARVIN CHARLES L·Filed 2012·Granted Nov 26, 2013·0 cites·11 claims
- 1950US8587112B2Underbump metallurgy employing an electrolytic Cu / electorlytic Ni / electrolytic Cu stackARVIN CHARLES L·Filed 2012·Granted Nov 19, 2013·0 cites·20 claims
- 2049US2013299989A1Chip connection structure and method of formingARVIN CHARLES L·Filed 2012·Application pending·0 cites
- 2146US2013249066A1Electromigration-resistant lead-free solder interconnect structuresARVIN CHARLES L·Filed 2012·Application pending·0 cites
- 2241US8759210B2Control of silver in C4 metallurgy with plating processARVIN CHARLES L·Filed 2012·Granted Jun 24, 2014·0 cites·15 claims
- 2340US8268716B2Creation of lead-free solder joint with intermetallicsARVIN CHARLES L·Filed 2010·Granted Sep 18, 2012·0 cites·16 claims
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