Assignee
BOARDTEK ELECTRONICS CORP
TW16 patents
Top patents by PatentIndex Score
US9860990B1Jan 2, 2018
Circuit board structure with chips embedded therein and manufacturing method thereof
BOARDTEK ELECTRONICS CORP14 citations80
US7585419B2Sep 8, 2009
Substrate structure and the fabrication method thereof
BOARDTEK ELECTRONICS CORP7 citations73
US11063333B2Jul 13, 2021
Multilayer electromagnetic wave transmission board assembled by an adhesive and including a barrier to block the adhesive from flowing into a waveguide channel
BOARDTEK ELECTRONICS CORP1 citations61
US11963293B2Apr 16, 2024
Circuit board structure with waveguide and method for manufacturing the same
BOARDTEK ELECTRONICS CORP1 citations60
US11678431B2Jun 13, 2023
Circuit board having waveguides and method of manufacturing the same
BOARDTEK ELECTRONICS CORP1 citations60
US12489076B2Dec 2, 2025
Power module for high-frequency use and method for manufacturing the same
BOARDTEK ELECTRONICS CORP0 citations49
US12424536B2Sep 23, 2025
Packaging structure with embedded power chip and circuit board module having the same
BOARDTEK ELECTRONICS CORP0 citations49
US11803022B2Oct 31, 2023
Circuit board structure with waveguide and method for manufacturing the same
BOARDTEK ELECTRONICS CORP0 citations49
US9392687B2Jul 12, 2016
Circuit board
BOARDTEK ELECTRONICS CORP1 citations49
US9320139B2Apr 19, 2016
Circuit board having interior space
BOARDTEK ELECTRONICS CORP0 citations49
US11129283B2Sep 21, 2021
Method of electroplating a circuit board
BOARDTEK ELECTRONICS CORP0 citations47
US9271387B2Feb 23, 2016
Circuit board structure manufacturing method
BOARDTEK ELECTRONICS CORP1 citations47
US12074357B2Aug 27, 2024
Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakage
BOARDTEK ELECTRONICS CORP0 citations44
US7556984B2Jul 7, 2009
Package structure of chip and the package method thereof
BOARDTEK ELECTRONICS CORP0 citations41
US9826642B1Nov 21, 2017
Circuit board structure and manufacturing method thereof
BOARDTEK ELECTRONICS CORP0 citations39
US9661760B2May 23, 2017
Printed circuit board and manufacturing method thereof
BOARDTEK ELECTRONICS CORP0 citations39