Circuit board structure manufacturing method

Abstract

A circuit board structure manufacturing method includes the following steps. A circuit substrate is provided including an insulating layer, a first metal layer, and a second metal layer. The insulating layer is disposed between the first metal layer and the second metal layer. The first metal layer has a first cavity. The insulating layer has a second cavity and a provisional region. A width of the first cavity is larger than a width of the second cavity. The provisional region is defined between a sidewall of the first metal layer defining the first cavity and another sidewall of the first metal layer defining the second cavity. A first masking layer is formed to cover the first metal layer and provisional region. The second cavity is exposed from the first masking layer. A heat-dissipating metal member is formed in the second cavity. Furthermore, the first masking layer is removed.

What is claimed is: 
     
       1. A circuit board structure manufacturing method comprising the steps of:
 providing a circuit board, the circuit board comprising:
 an insulating layer; 
 a first metal layer; and 
 a second metal layer; 
 wherein the insulating layer is disposed between the first metal layer and the second metal layer, the first metal layer has portions defining a first cavity, the insulating layer has portions defining a second cavity and an empty region, the first cavity has a width larger than a width of the second cavity, and the empty region is defined by a sidewall of the first metal layer defining the first cavity and a sidewall of the insulating layer defining the second cavity; 
 
 applying a first masking layer covering the first metal layer and the empty region, wherein the first masking layer exposes the second cavity; 
 after applying the first masking layer, electroplating a metal member in the second cavity; and 
 after electroplating the metal member, removing the first masking layer; 
 wherein the first masking layer is formed after the second cavity is formed and the first masking layer covers the first metal layer and the empty region of the first cavity. 
 
     
     
       2. The circuit board structure manufacturing method as recited in  claim 1 , wherein in the step of providing a circuit board, the first and second cavities are formed by the steps comprising:
 developing a pattern on the first metal layer to form the first cavity; and 
 forming the second cavity through the insulating layer and exposing the second metal layer. 
 
     
     
       3. The circuit board structure manufacturing method as recited in  claim 2 , wherein the step of developing a pattern on the first metal layer comprises the step of:
 laser-ablating the first metal layer to form the first cavity thereon. 
 
     
     
       4. The circuit board structure manufacturing method as recited in  claim 1  further comprising the step of:
 abrasively treating the heat-dissipating metal member to flatten a top portion thereof. 
 
     
     
       5. The circuit board structure manufacturing method as recited in  claim 4 , wherein the top portion of the heat-dissipating metal member and the first metal layer are leveled. 
     
     
       6. The circuit board structure manufacturing method as recited in  claim 4 , wherein the top portion of the heat-dissipating metal member is lower in height than the insulating layer. 
     
     
       7. The circuit board structure manufacturing method as recited in  claim 1 , wherein the first masking layer is formed after the second cavity is formed and the first masking layer covers the first metal layer and the first cavity. 
     
     
       8. The circuit board structure manufacturing method as recited in  claim 1  wherein the first masking layer is formed before the second cavity is formed and the first masking layer covers the first metal layer and the first cavity. 
     
     
       9. The circuit board structure manufacturing method as recited in  claim 1  further comprising the step of:
 disposing an electronic component on and coupled to the heat-dissipating metal member, wherein the electronic component is electrically connected to the first metal layer. 
 
     
     
       10. The circuit board structure manufacturing method as recited in  claim 1  further comprising the step of:
 forming a second masking layer covering the second metal layer. 
 
     
     
       11. The circuit board structure manufacturing method as recited in  claim 1 , wherein the second cavity is formed by laser-ablating the insulating layer.