Assignee
BOARDTEK ELECTRONICS CORP
TW·16 granted patents·10 pending applications·26 citations·filing 2005–2025
Top patents by PatentIndex Score
26 records- 0191US9860990B1Circuit board structure with chips embedded therein and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2016·Granted Jan 2, 2018·14 cites·7 claims
- 0281US11963293B2Circuit board structure with waveguide and method for manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Apr 16, 2024·1 cites·19 claims
- 0381US11678431B2Circuit board having waveguides and method of manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Jun 13, 2023·1 cites·14 claims
- 0478US2025372501A1Circuit board moduleBOARDTEK ELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 0573US7585419B2Substrate structure and the fabrication method thereofBOARDTEK ELECTRONICS CORP·Filed 2005·Granted Sep 8, 2009·7 cites·31 claims
- 0668US11063333B2Multilayer electromagnetic wave transmission board assembled by an adhesive and including a barrier to block the adhesive from flowing into a waveguide channelBOARDTEK ELECTRONICS CORP·Filed 2019·Granted Jul 13, 2021·1 cites·2 claims
- 0765US12424536B2Packaging structure with embedded power chip and circuit board module having the sameBOARDTEK ELECTRONICS CORP·Filed 2022·Granted Sep 23, 2025·0 cites·7 claims
- 0862US9392687B2Circuit boardBOARDTEK ELECTRONICS CORP·Filed 2015·Granted Jul 12, 2016·1 cites·10 claims
- 0961US9271387B2Circuit board structure manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2013·Granted Feb 23, 2016·1 cites·11 claims
- 1053US12489076B2Power module for high-frequency use and method for manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2022·Granted Dec 2, 2025·0 cites·8 claims
- 1153US9320139B2Circuit board having interior spaceBOARDTEK ELECTRONICS CORP·Filed 2014·Granted Apr 19, 2016·0 cites·12 claims
- 1253US2025358936A1Circuit board with embedded elements and method for fabricating the sameBOARDTEK ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1351US11803022B2Circuit board structure with waveguide and method for manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Oct 31, 2023·0 cites·11 claims
- 1449US2016095197A1Circuit board module and circuit board structureBOARDTEK ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 1547US2015008029A1Circuit board and method of manufacturing the sameBOARDTEK ELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 1644US2014124124A1Printed circuit board manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 1744US2014123487A1Printed circuit board manufacturing methodBOARDTEK ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 1843US12074357B2Electromagnetic wave transmission board comprising an inner board with a plated through hole covered by outer plates, where the electromagnetic waves propagate in the through hole without leakageBOARDTEK ELECTRONICS CORP·Filed 2021·Granted Aug 27, 2024·0 cites·19 claims
- 1943US9826642B1Circuit board structure and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2016·Granted Nov 21, 2017·0 cites·6 claims
- 2043US2017298529A1Electroplating systemBOARDTEK ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2143US2017298530A1Electroplating anode assemblyBOARDTEK ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2242US2020107456A1Circuit board structureBOARDTEK ELECTRONICS CORP·Filed 2019·Application pending·0 cites
- 2341US11129283B2Method of electroplating a circuit boardBOARDTEK ELECTRONICS CORP·Filed 2019·Granted Sep 21, 2021·0 cites·11 claims
- 2441US2020128680A1Circuit board and plating method thereofBOARDTEK ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 2538US9661760B2Printed circuit board and manufacturing method thereofBOARDTEK ELECTRONICS CORP·Filed 2015·Granted May 23, 2017·0 cites·7 claims
- 2638US7556984B2Package structure of chip and the package method thereofBOARDTEK ELECTRONICS CORP·Filed 2005·Granted Jul 7, 2009·0 cites·44 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →