Assignee
BYUN HAK-KYOON
KR·2 granted patents·2 pending applications·10 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0187US8531034B2Semiconductor package and package on package having the sameBYUN HAK-KYOON·Filed 2011·Granted Sep 10, 2013·9 cites·20 claims
- 0253US8304876B2Semiconductor package and method for manufacturing the sameBYUN HAK-KYOON·Filed 2009·Granted Nov 6, 2012·1 cites·13 claims
- 0341US2008111224A1Multi stack package and method of fabricating the sameBYUN HAK-KYOON·Filed 2007·Application pending·0 cites
- 0429US2012315726A1Method of manufacturing a semiconductor chip packageBYUN HAK-KYOON·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →