Assignee
CHEAH BOK ENG
MY·4 granted patents·4 pending applications·58 citations·filing 2010–2016
Top patents by PatentIndex Score
8 records- 0196US8987896B2High-density inter-package connections for ultra-thin package-on-package structures, and processes of forming sameCHEAH BOK ENG·Filed 2010·Granted Mar 24, 2015·31 cites·3 claims
- 0294US9136251B2Method to enable controlled side chip interconnection for 3D integrated packaging systemCHEAH BOK ENG·Filed 2012·Granted Sep 15, 2015·16 cites·30 claims
- 0389US8697495B2Stacked die packageCHEAH BOK ENG·Filed 2011·Granted Apr 15, 2014·9 cites·12 claims
- 0468US9721878B2High density second level interconnection for bumpless build up layer (BBUL) packaging technologyCHEAH BOK ENG·Filed 2012·Granted Aug 1, 2017·2 cites·12 claims
- 0557US2015277506A1Micro-hinge for an electronic deviceCHEAH BOK ENG·Filed 2014·Application pending·0 cites
- 0653US2014175670A1Stacked die packageCHEAH BOK ENG·Filed 2014·Application pending·0 cites
- 0739US2012319293A1Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi-channel communication pathway in same, and method of enabling electrical communication between components of a stacked-die packageCHEAH BOK ENG·Filed 2011·Application pending·0 cites
- 0836US2018088627A1Interconnects for wearable deviceCHEAH BOK ENG·Filed 2016·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →