Assignee
CHENG YU-TING
TW·1 granted patent·2 pending applications·0 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0146US2009302454A1Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate waferCHENG YU-TING·Filed 2009·Application pending·0 cites
- 0241US2008008900A1Ball Limiting Metallurgy, Interconnection Structure Including the Same, and Method of Forming an Interconnection StructureCHENG YU-TING·Filed 2007·Application pending·0 cites
- 0336US8957498B2On-chip electronic device and method for manufacturing the sameCHENG YU-TING·Filed 2012·Granted Feb 17, 2015·0 cites·11 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →