Assignee
CHIPMOS TECHNOLOGIES SHANGHAI
CN·1 granted patent·2 pending applications·16 citations·filing 2006–2006
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0179US7361984B2Chip package structureCHIPMOS TECHNOLOGIES SHANGHAI·Filed 2006·Granted Apr 22, 2008·16 cites·5 claims
- 0240US2008012106A1Chip package structure and fabricating method threrofCHIPMOS TECHNOLOGIES SHANGHAI·Filed 2006·Application pending·0 cites
- 0335US2008093719A1Chip package structureCHIPMOS TECHNOLOGIES SHANGHAI·Filed 2006·Application pending·0 cites
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