Assignee
CHO NAMJU
KR10 patents
Top patents by PatentIndex Score
US8264091B2Sep 11, 2012
Integrated circuit packaging system with encapsulated via and method of manufacture thereof
CHO NAMJU95 citations98
US9496152B2Nov 15, 2016
Carrier system with multi-tier conductive posts and method of manufacture thereof
CHO NAMJU42 citations94
US8390108B2Mar 5, 2013
Integrated circuit packaging system with stacking interconnect and method of manufacture thereof
CHO NAMJU47 citations94
US8318539B2Nov 27, 2012
Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects
CHO NAMJU37 citations92
US8476111B2Jul 2, 2013
Integrated circuit packaging system with intra substrate die and method of manufacture thereof
CHO NAMJU8 citations84
US9355939B2May 31, 2016
Integrated circuit package stacking system with shielding and method of manufacture thereof
CHO NAMJU3 citations73
US8564125B2Oct 22, 2013
Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
CHO NAMJU5 citations73
US8541872B2Sep 24, 2013
Integrated circuit package system with package stacking and method of manufacture thereof
CHO NAMJU6 citations73
US8389329B2Mar 5, 2013
Integrated circuit packaging system with package stacking and method of manufacture thereof
CHO NAMJU4 citations63
US9054098B2Jun 9, 2015
Integrated circuit packaging system with redistribution layer and method of manufacture thereof
CHO NAMJU0 citations51