Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects

Abstract

A method of manufacture of an integrated circuit packaging system includes: providing a carrier having a planar surface and a cavity therein, a first barrier between the planar surface and a first interconnect, and a second barrier between the cavity and a second interconnect; providing a substrate; mounting an integrated circuit over the substrate; mounting the carrier to the substrate with the first interconnect and the second interconnect attached to the substrate and with the planar surface over the integrated circuit; forming an encapsulation between the substrate and the carrier covering the integrated circuit, the encapsulation having an encapsulation recess under the planar surface and over the integrated circuit; and removing a portion of the carrier to expose the encapsulation, a portion of the first barrier to form a first contact pad, and a portion of the second barrier to form a second contact pad.

1. A method of manufacture of an integrated circuit packaging system comprising:
 providing a carrier having a planar surface and a cavity therein, a first barrier between the planar surface and a first interconnect, and a second barrier between the cavity and a second interconnect; 
 providing a substrate; 
 mounting an integrated circuit over the substrate; 
 mounting the carrier to the substrate with the first interconnect and the second interconnect attached to the substrate and with the planar surface over the integrated circuit; 
 forming an encapsulation between the substrate and the carrier covering the integrated circuit, the encapsulation having an encapsulation recess under the planar surface and over the integrated circuit; and 
 removing a portion of the carrier to expose the encapsulation, a portion of the first barrier to form a first contact pad, and a portion of the second barrier to form a second contact pad. 
 
     
     
       2. The method as claimed in  claim 1  wherein removing a portion of the first barrier includes forming a mounting pad along an inner portion of the encapsulation recess. 
     
     
       3. The method as claimed in  claim 1  wherein:
 providing the carrier having the planar surface, the first barrier between the planar surface and the first interconnect includes providing the first barrier between a ground interconnect and a further ground interconnect; 
 mounting the carrier to the substrate includes grounding the ground interconnect with the substrate, the ground interconnect adjacent to the integrated circuit and the first barrier over the integrated circuit; and 
 removing the portion of the carrier includes forming a conductive shield from the first barrier. 
 
     
     
       4. The method as claimed in  claim 1  further comprising connecting a device to the first contact pad in the encapsulation recess. 
     
     
       5. The method as claimed in  claim 1  further comprising connecting a mountable structure to the second contact pad over an encapsulation plateau. 
     
     
       6. A method of manufacture of an integrated circuit packaging system comprising:
 providing a carrier having a planar surface and a cavity therein, a first barrier between the planar surface and a first interconnect, and a second barrier between the cavity and a second interconnect; 
 providing a substrate having a substrate first side and a substrate second side; 
 mounting an integrated circuit over the substrate first side; 
 mounting the carrier to the substrate first side with the first interconnect and the second interconnect attached to the substrate first side, the first interconnect adjacent to the integrated circuit, and the planar surface over the integrated circuit; 
 forming an encapsulation between the substrate first side and the carrier covering the integrated circuit, the encapsulation having an encapsulation recess under the planar surface and over the integrated circuit; and 
 removing a portion of the carrier to expose the encapsulation, a portion of the first barrier to form a first contact pad, and a portion of the second barrier to form a second contact pad. 
 
     
     
       7. The method as claimed in  claim 6  further comprising:
 connecting a device to the first contact pad with the device in the encapsulation recess; and 
 connecting a mountable structure to the second contact pad with the device between the mountable structure and the encapsulation. 
 
     
     
       8. The method as claimed in  claim 6  wherein mounting the carrier to the substrate first side with the first interconnect and the second interconnect attached to the substrate first side includes attaching an interface interconnect between the first interconnect and the substrate, and between the second interconnect and the substrate. 
     
     
       9. The method as claimed in  claim 6  wherein providing the carrier includes providing the carrier having the side of the first interconnect facing away from the carrier co-planar with the side of the second interconnect facing away from the carrier. 
     
     
       10. The method as claimed in  claim 6  wherein mounting the integrated circuit includes mounting a flip chip.